JPH032496Y2 - - Google Patents

Description

[Detailed explanation of the idea] This invention is a device for moving wafers, etc.

Wafers are processed in a vapor phase growth device, but the moving device that transports wafers on the loading side to the vapor growth device, and conversely, transports processed wafers from the vapor growth device to the unloading side, requires space. A small size that does not take up much space is required.

Conventionally, as a moving device of this type, there is one in which a wafer chuck is fixed to a pantograph, the wafer is held by the wafer chuck, and the wafer is transported to a diffusion furnace by opening and closing the pantograph.

However, this device is unstable because a plurality of threaded portions serve as supporting portions of the pantograph. Therefore, positioning is poor and it is difficult to accurately move the wafer to a predetermined position.

The purpose of this invention is to provide a device for moving wafers, etc., which allows accurate positioning and does not take up much space.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

In the figure, reference numeral 1 denotes a rectangular outside guide 1 fixed to the device main body (not shown), and this outside guide 1 has roller guide grooves 2 inclined at an angle θ, and roller guide grooves 2 on both sides of the guide 1 along the longitudinal direction. A plurality of formed inside guide rollers 3
is provided.

4 is a rectangular inside guide, and this inside guide 4 has a rail 5 formed on both sides along the longitudinal direction, and a rail 5 parallel to the rail 5.
A slider support rail 6 formed shorter than the rail 5, a toggle arm support hole 7 formed in the front part of the inside guide 4, and a rack (not shown) that engages with a pinion (not shown) are provided.

A slider 8 is supported by the rail 6 of the inside guide 4 and the roller 9 of the slider 8, and has a toggle arm support hole 10 provided in its front part. Two arms 12 and 13 are linked together by a telescopic device 11, and one end thereof is rotatably pivoted by a pin 14, and the other end of the arm 12 is a connecting shaft 15 passing through the toggle arm support hole 7. A connecting arm 16 is fixed to one end of the connecting shaft 15, and a connecting arm 16 is attached to the other end of the connecting shaft 15.
Further, a roller 18 fitted in the roller guide groove 2 is connected to the tip of the arm 16 via a connecting rod 17. The other end of the arm 13 is rotatably attached to the slider 8 by a screw 19 screwed into the toggle arm support hole 10.

Next, to explain the operation of this embodiment, when the rack (not shown) of the inside guide 4 is driven by a pinion (not shown), the inside guide 4
moves in the direction of arrow A4, and at the same time the roller 18
moves along the roller guide groove 2.

Since the roller guide groove 2 is inclined at an angle θ, the roller 18 moves linearly from diagonally upward to diagonally downward, but the force is applied to the connecting shaft via the connecting rod 17 and the connecting arm 16. 15 to give rotational motion. When the connecting shaft 15 rotates, the arm 12 fixed to the shaft 15 rotates clockwise, and at the same time causes the arm 13, which is pivoted by the pin 14, to rotate counterclockwise. When the arm 13 rotates, the rotational force is transmitted to the slider 8 via the screw 19, causing the slider 8 to move linearly in the direction of arrow A4.

In this way, the slider 8 is moved to the third position by the toggle operation.
When the state shown in FIG. 8A changes to the state shown in FIG. 1 and the roller 18 is further moved in the direction of arrow A4 and positioned at the lower end of the roller guide groove 2, the arm 12
B and 13B become a straight line, and the slider is moved in parallel to the maximum extent, bringing the slider into the state shown in FIG. 3, 8B, but at this time, the slider 8 has moved by a distance l.

In this state, the wafers (not shown) in the wafer chuck fixed to the slider 8 are supplied to a diffusion furnace (not shown), and then the slider 8 is
Return to the original position 8A.

The present invention includes an outside guide, an inside guide provided so as to be movable in the longitudinal direction of the outside guide, a slider provided so as to be movable in the longitudinal direction of the inside guide, and the slider and the inside guide provided so as to be movable in the longitudinal direction of the inside guide. Since the device includes a toggle mechanism provided to connect the guides and a mechanism for moving the wafer provided on the slider via the toggle mechanism by moving the inside guide, the device can be made smaller. , you can earn space.
Furthermore, since the slider moves along the inside guide, the wafer or the like can be accurately moved to a predetermined position, resulting in good positioning.

Furthermore, since the inside guide and the slider are movable, the moving distance of the slider can be increased.

In this embodiment, the description has been limited to the transportation of wafers, but it goes without saying that the present invention can also be used for transportation of other than wafers.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
The figure is a sectional view taken along the line -- in FIG. 1, and FIG. 3 is a diagram showing the state of movement of the slider. 1...Outside guide, 2...Roller guide groove, 4...Inside guide, 8...Slider.

Claims (1)

[Claims for Utility Model Registration] 1. An outside guide, an inside guide provided so as to be movable in the longitudinal direction of this outside guide, and a slider provided so as to be movable in the longitudinal direction of this inside guide; a toggle mechanism provided to connect the slider and the inside guide; and a mechanism in which one end of the toggle mechanism moves along a groove provided in the outside guide that slopes downward in the direction of movement of the slider. A wafer moving device comprising: a mechanism for moving a wafer provided on the slider via the doggle mechanism by moving the inside guide. 2. The wafer moving device according to claim 1, wherein one end of the toggle mechanism is a mechanism that moves along a groove provided in an outside guide. 3. The wafer moving device according to claim 2, wherein the groove provided in the outside guide is inclined downward in the longest movement direction of the slider.