JPH03250052A - Thermally curable organopolysiloxane composition - Google Patents
Thermally curable organopolysiloxane compositionInfo
- Publication number
- JPH03250052A JPH03250052A JP90202671A JP20267190A JPH03250052A JP H03250052 A JPH03250052 A JP H03250052A JP 90202671 A JP90202671 A JP 90202671A JP 20267190 A JP20267190 A JP 20267190A JP H03250052 A JPH03250052 A JP H03250052A
- Authority
- JP
- Japan
- Prior art keywords
- group
- platinum
- component
- resin
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 40
- 239000000203 mixture Substances 0.000 title claims description 40
- 229920002050 silicone resin Polymers 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 19
- 229920000548 poly(silane) polymer Polymers 0.000 claims abstract description 17
- 230000009477 glass transition Effects 0.000 claims abstract description 8
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 4
- 239000011236 particulate material Substances 0.000 claims abstract description 4
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract 3
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000003054 catalyst Substances 0.000 abstract description 26
- 238000003860 storage Methods 0.000 abstract description 10
- 239000006229 carbon black Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 64
- 229910052697 platinum Inorganic materials 0.000 description 31
- 239000010419 fine particle Substances 0.000 description 15
- -1 polysiloxane Polymers 0.000 description 15
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000008187 granular material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000000806 elastomer Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- 150000003624 transition metals Chemical class 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- MQSZOZMNAJHVML-UHFFFAOYSA-N 3-phenylbut-1-yn-1-ol Chemical compound OC#CC(C)C1=CC=CC=C1 MQSZOZMNAJHVML-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 240000008866 Ziziphus nummularia Species 0.000 description 1
- DSVGQVZAZSZEEX-UHFFFAOYSA-N [C].[Pt] Chemical compound [C].[Pt] DSVGQVZAZSZEEX-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical class [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明は、加熱硬化性オルガノポリシロキサン組成物に
関し、詳しくは、室温付近で優れた貯蔵安定性と迅速な
加熱硬化特性を有し、硬化後はK(熱性に優れたエラス
トマー成形品となり得る加熱硬化性シリコーンエラスト
マー組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a heat-curable organopolysiloxane composition, and more specifically, it has excellent storage stability and rapid heat-curing properties near room temperature, and The following is related to K (a heat-curable silicone elastomer composition that can be made into an elastomer molded article with excellent thermal properties).
[従来技術とその問題]
ヒドロシリル化反応によって硬化するオルガノポリシロ
キサン組成物は、反応副生物が生成せず深部まで迅速に
硬化が進行するという特徴を有しているので、例えば、
成型ゴム、接着剤、電気・電子部品のボッティング剤、
コーテイング材、紙やフィルムなどの剥離コーテイング
材などとして輻広い分野にわたって使用されている。[Prior art and its problems] An organopolysiloxane composition that is cured by a hydrosilylation reaction is characterized in that it does not produce reaction by-products and is rapidly cured to the depths.
Molded rubber, adhesives, botting agents for electrical and electronic parts,
It is used in a wide range of fields, including as a coating material and a release coating material for paper, film, etc.
しかしながら、この種のオルガノポリシロキサン組成物
は室温付近での貯蔵安定性に劣り、特に迅速に硬化する
配合物を得ようとすると可使時間が極めて短くなるとい
う欠点があった。However, this type of organopolysiloxane composition has the drawback of poor storage stability near room temperature, and particularly when attempting to obtain a rapidly curing formulation, the pot life is extremely short.
本発明者らは先にこのような問題点を解決したオルガノ
ポリシロキサン組成物としてヒドロシリル化反応用触媒
を含むシリコーン樹脂あるいはポリシランの粒状物を硬
化触媒としたオルガノポリシロキサンを提案した。しか
しこの組成物は室温付近での貯蔵安定性に著しく優れて
いるが、加熱硬化後のエラストマー成形品が長時間加熱
されると、シリコーン樹脂あるいはポリシラン樹脂が、
凝集し、凝集物を形成し、特にエラストマー成形品の機
械的強度が著しく低下するという問題点があった。The present inventors have previously proposed an organopolysiloxane composition that solves these problems, using a silicone resin or polysilane particles containing a hydrosilylation reaction catalyst as a curing catalyst. However, although this composition has excellent storage stability near room temperature, if the elastomer molded product after heat curing is heated for a long time, the silicone resin or polysilane resin will deteriorate.
There was a problem in that they agglomerated to form aggregates, and in particular, the mechanical strength of elastomer molded products was significantly reduced.
[発明が解決しようとする課題]
本発明者らは、上記問題点を解消すべく鋭意検討した結
果、上記オルガノポリシロキサン組成物に特定の金属化
合物を添加配合すれば、硬化したエラストマー成形品が
長時間加熱されても粒状物に使用した樹脂が凝集しない
ことを見出し本発明に到達した。[Problems to be Solved by the Invention] As a result of intensive studies to solve the above problems, the present inventors found that if a specific metal compound is added to the organopolysiloxane composition, a cured elastomer molded article can be formed. The present invention was achieved by discovering that the resin used for the granules does not aggregate even when heated for a long time.
本発明の目的は、室温付近での貯蔵安定性に優れており
、加熱時の硬化が迅速であり、かつ、加熱硬化後のエラ
ストマー成形品が長時間加熱された場合においても凝集
物が形成せず機械的強度の低下の度合が小さいという特
徴を有する加熱硬化性オルガノポリシロキサン組成物を
提供することにある。The object of the present invention is to have excellent storage stability near room temperature, to cure quickly when heated, and to prevent the formation of aggregates even when the heat-cured elastomer molded product is heated for a long time. The first object of the present invention is to provide a heat-curable organopolysiloxane composition which is characterized by a small degree of decrease in mechanical strength.
[課題を解決するための手段とその作用1本発明は、
(A)平均組成式RmSiO+4−al /2 (式中
、Rは置換または非置換の1価炭化水素基、aは1.8
〜2.3の数である)で示され、1分子中に少なくとも
2個のケイ素原子結合アルケニル基を有するオルガノポ
リシロキサン、
(B)1分子中に少なくとも2個のケイ素原子結合水素
原子を有するオルガノハイドロジエンポリシロキサン、
(C)ヒドロシリル化反応触媒と軟化点またはガラス転
移点が40〜200℃のシリコーン樹脂もしくはポリシ
ラン樹脂よりなる粒状物、
CD)IA族、IIA族を除く金属元素の酸化物もしく
は水酸化物、またはカーボンブラック
からなる加熱硬化性オルガノポリシロキサン組成に関す
る。[Means for Solving the Problems and Their Effects 1 The present invention has the following features: (A) average composition formula RmSiO+4-al/2 (wherein, R is a substituted or unsubstituted monovalent hydrocarbon group, and a is 1.8
~2.3) and having at least two silicon-bonded alkenyl groups in one molecule; (B) having at least two silicon-bonded hydrogen atoms in one molecule; Organohydrodiene polysiloxane, (C) Granules made of a hydrosilylation reaction catalyst and a silicone resin or polysilane resin with a softening point or glass transition point of 40 to 200°C, CD) Oxides of metal elements other than Group IA and Group IIA Alternatively, the present invention relates to a heat-curable organopolysiloxane composition comprising hydroxide or carbon black.
本発明に使用される(A)成分のオルガノポリシロキサ
ンは、本発明の組成物の主剤となる成分であり、平均単
位式か、Ra5i014−Ill y□で示され、かつ
、1分子中に少なくとも2個のケイ素原子結合アルケニ
ル基を有することが必要である。このオルガノポリシロ
キサンは上式中、Rはメチル基、エチル基、プロピル基
、ブチル基、ヘキシル基、オクチル基のようなアルキル
基、ビニル基、フリル基、ヘキセニル基などのアルケニ
ル基、フェニル基などのアリール基、3,3゜3−トリ
フルオロプロピル基のような置換炭化水素基で例示され
る1価炭化水素基であり、aは1.8〜2.3の数であ
る。このオルガノポリシロキサンの分子構成は直鎖状、
分岐状のシロキサン骨格を有するものでもよい。またそ
の重合度は特に限定されないが、通常は25℃における
粘度か10〜1 、000 、000 、000センチ
ボイスの範囲にあるものが使用される。The organopolysiloxane (A) component used in the present invention is a main component of the composition of the present invention, and is represented by the average unit formula or Ra5i014-Ill y□, and has at least It is necessary to have two silicon-bonded alkenyl groups. In the above formula, R is an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group, an alkenyl group such as a vinyl group, a furyl group, a hexenyl group, a phenyl group, etc. is a monovalent hydrocarbon group exemplified by a substituted hydrocarbon group such as an aryl group or a 3,3°3-trifluoropropyl group, and a is a number from 1.8 to 2.3. The molecular structure of this organopolysiloxane is linear,
It may also have a branched siloxane skeleton. Although the degree of polymerization is not particularly limited, those having a viscosity at 25° C. of 10 to 1,000,000,000 centivoice are usually used.
本発明に使用される(B)成分のオルガノハイドロジエ
ンポリシロキサンは、(A)成分のオルガノポリシロキ
サンの架橋剤であり、本発明の組成物が網状構造を形成
するためには1分子中に少なくとも2個のケイ素原子結
合水素原子を有することが必要である。水素原子以外に
ケイ素原子に結合した有機基としては前述した(A)成
分のオルガノポリシロキサンと同様のものが例示される
。この有機基は、1分子中に1種のみでもよく、また、
2種以上が混在してもよい。The organohydrodiene polysiloxane used in the present invention as the component (B) is a crosslinking agent for the organopolysiloxane as the component (A). It is necessary to have at least two silicon-bonded hydrogen atoms. Examples of the organic group bonded to the silicon atom other than the hydrogen atom include the same organopolysiloxane as component (A) described above. Only one type of organic group may be present in one molecule, and
Two or more types may be mixed.
このオルガノハイドロジエンポリシロキサンの分子構造
は、直鎖構造、網状構造、または3次元構造を含んでい
てもよく、これらの単一重合体または共重合体もしくは
2種以上の重合体の混合物も使用できる。このオルガノ
ハイドロジエンポリシロキサンの重合度は通常、25℃
における粘度が0.5〜50 、000センチボイスの
範囲であり、好ましくは1〜10,000センチボイス
の範囲内のものが使用される。The molecular structure of this organohydrodiene polysiloxane may include a linear structure, a network structure, or a three-dimensional structure, and a single polymer or copolymer thereof or a mixture of two or more types of polymers can also be used. . The degree of polymerization of this organohydrodiene polysiloxane is usually 25°C.
The viscosity is in the range of 0.5 to 50,000 centiVoice, preferably in the range of 1 to 10,000 centiVoice.
また、その配合棗は本成分中のケイ素原子結合水素原子
と(A)成分中のケイ素原子結合アルケニル基のモル比
が、好ましく ハ0.5/1〜10/1の範囲になるよ
うな量であり、通常は(A)成分100重量部に対して
0.1〜10重量部の範囲内である。In addition, the blended jujube is used in an amount such that the molar ratio of the silicon-bonded hydrogen atoms in this component to the silicon-bonded alkenyl groups in component (A) is preferably in the range of 0.5/1 to 10/1. It is usually in the range of 0.1 to 10 parts by weight per 100 parts by weight of component (A).
(C)成分のヒドロシリル化反応触媒とシリコーン樹脂
もしくはポリシラン樹脂よりなる粒状物は、(A)成分
のケイ素原子結合アルケニル基と(B)成分のケイ素原
子結合水素原子とをヒドロシリル化反応によって架橋す
るための触媒である。かかる粒状物の目的は、含有する
ヒドロシリル化反応用触媒を粒状物外部の成分から隔離
することである。それ故、粒子状シリコーン樹脂もしく
はポリシラン樹脂の中にヒドロシリル化反応用触媒が溶
解または分散している構造でも、粒子状シリコーン樹脂
もしくはポリシラン樹脂の殻の中にヒドロシリル化反応
用触媒が核として含有されている構造の粒子、いわゆる
マイクロカプセルでも本発明の目的に使用できる。The particulate material made of the hydrosilylation reaction catalyst and silicone resin or polysilane resin as the component (C) crosslinks the silicon-bonded alkenyl group of the component (A) and the silicon-bonded hydrogen atom of the component (B) by a hydrosilylation reaction. It is a catalyst for The purpose of such granules is to isolate the contained catalyst for the hydrosilylation reaction from components external to the granules. Therefore, even if the hydrosilylation reaction catalyst is dissolved or dispersed in the particulate silicone resin or polysilane resin, the hydrosilylation reaction catalyst is contained as a core in the shell of the particulate silicone resin or polysilane resin. Particles with a similar structure, so-called microcapsules, can also be used for the purpose of the present invention.
ヒドロシリル化反応用触媒としては、従来公知のビトロ
シリル化触媒活性を示す遷移金属触媒がすべて使用でき
る。具体的には塩化白金酸、アルコール変性塩化白金酸
、白金とオレフィンとの錯体、アルミナ、シリカ、カー
ボンブラ・ンクなどに担持された白金、白金黒などで例
示される白金系触媒、テトラキス(トリフェニルホスフ
ィン)パラジウムのようなパラジウム系触媒、あるいは
ロジウム触媒が例示される。これらの中でも活性の高さ
および(A)成分と(B)成分への相溶性の点から白金
−ビニルシロキサン錯体触媒が好ましい。(C)成分は
このようなヒドロシリル化反応用触媒が、軟化点または
ガラス転移点が40〜200℃の範囲内にあるシリコー
ン樹脂もしくはポリシラン樹脂で粒状化されたものであ
る。軟化点は樹脂が自重または自身の表面張力で流動開
始する温度であり、一定速度で温度を上げなからs’a
鏡で粉砕粒子を観察する方法によって容易に知ることが
できる。ガラス転移点はDSC(テ゛ファレンシャル・
スキャンニング・カロリメーター)による測定で知るこ
とができる。本発明では、軟化点とガラス転移点のどち
らかが40〜200℃の範囲にあれば使用することがで
きる。軟化点またはガラス転移点が40℃より低いと組
成物の貯蔵安定性が著しく低下し、また、200℃より
も高いと十分な加熱硬化速度が得られなくなる。As the catalyst for the hydrosilylation reaction, all conventionally known transition metal catalysts exhibiting vitrosilylation catalytic activity can be used. Specifically, chloroplatinic acid, alcohol-modified chloroplatinic acid, complexes of platinum and olefins, platinum supported on alumina, silica, carbon black, etc., platinum-based catalysts such as platinum black, and tetrakis ( Examples include palladium-based catalysts such as (phenylphosphine) palladium, or rhodium catalysts. Among these, platinum-vinylsiloxane complex catalysts are preferred from the viewpoint of high activity and compatibility with components (A) and (B). Component (C) is such a hydrosilylation reaction catalyst granulated with a silicone resin or polysilane resin whose softening point or glass transition point is within the range of 40 to 200°C. The softening point is the temperature at which the resin starts to flow due to its own weight or its own surface tension.
This can be easily determined by observing the crushed particles with a mirror. The glass transition point is determined by DSC (Differential
This can be determined by measurement using a scanning calorimeter. In the present invention, it can be used as long as either the softening point or the glass transition point is in the range of 40 to 200°C. If the softening point or glass transition point is lower than 40°C, the storage stability of the composition will be significantly reduced, and if it is higher than 200°C, a sufficient heat curing rate will not be obtained.
ヒドロシリル化反応用触媒をシリコーン樹脂もしくはポ
リシラン樹脂で粒状化する方法は、従来公知の界面重合
法や1n−situ重合法などの化学的方法、コアセル
ベーシッン法や液中乾燥法、気相乾燥法などの物理的・
機械的方法があり、本発明においてはいずれの手段を用
いてもよい。なかでも狭い粒径分布の粒状物が比較的容
易に得られることから、液中乾燥法と気相乾燥法が望ま
しい。これらの方法によって得られた粒状物は、そのま
ま(C)成分として用いることもできるが、これを適切
な洗浄溶剤によって洗浄してその表面に付着したヒドロ
シリル化反応用触媒を除去することも、高い貯蔵安定性
を有する加熱効果性オルガノポリシロキサン組成物を得
るためには望ましい。ここで適切な洗浄溶剤とは、シリ
コーン樹脂もしくはポリシラン樹脂を溶解しないが、ヒ
ドロシリル化反応用触媒を溶解する性質を有するもので
ある。このような洗浄溶剤としては、例えば、メチルア
ルコール、エチルアルコールなどのアルコール類、ヘキ
サメチルジシロキサンなどの低分子量オルガノポリシロ
キサン類などが挙げられる。Methods for granulating the hydrosilylation reaction catalyst with silicone resin or polysilane resin include conventionally known chemical methods such as interfacial polymerization method and 1n-situ polymerization method, core cell basis method, submerged drying method, and vapor phase drying method. physical, such as law;
There are mechanical methods, and any method may be used in the present invention. Among these, the submerged drying method and the vapor phase drying method are preferable because granules with a narrow particle size distribution can be obtained relatively easily. The granules obtained by these methods can be used as they are as component (C), but it is also possible to wash them with an appropriate cleaning solvent to remove the hydrosilylation reaction catalyst attached to the surface. It is desirable to obtain heat-effect organopolysiloxane compositions that are storage stable. A suitable cleaning solvent here is one that does not dissolve the silicone resin or polysilane resin, but has the property of dissolving the hydrosilylation reaction catalyst. Examples of such cleaning solvents include alcohols such as methyl alcohol and ethyl alcohol, and low molecular weight organopolysiloxanes such as hexamethyldisiloxane.
(C)成分の平均粒子径は、通常0.01〜500ti
iの範囲内であり、好ましくは0.1〜10μmの範囲
内である。これは平均粒子径が0.01μIより小さく
なると製造に際してヒドロシリル化反応用触媒の収率が
大幅に低下するからであり、500μmよりも大きくな
るど、(A)成分のジオルガノポリシロキサンへの分散
安定性が損われたり、硬化物の機械的物性を低下させる
からである。また、この(C)成分の形状は球状である
ことが好ましい。The average particle diameter of component (C) is usually 0.01 to 500ti
i, preferably within the range of 0.1 to 10 μm. This is because if the average particle diameter becomes smaller than 0.01μI, the yield of the hydrosilylation reaction catalyst will decrease significantly during production. This is because the stability may be impaired or the mechanical properties of the cured product may be reduced. Moreover, it is preferable that the shape of this (C) component is spherical.
ヒドロシリル化反応用触媒のシリコーン444 脂もし
くはポリシラン樹脂に対する比率は、粒状物の製造方法
により大きく変わるので、侍に限定することはできない
か、(C)成分中に占めるヒドロシリル化反応用触媒の
含有率が0.01%以上となる比率にすることが望まし
い。これは、0゜01%未満になると、本発明組成物に
占めるシリコーン414脂もしくはポリシラン樹脂の比
率が高くなり過ぎ、硬化後の物性が損われることがある
ためである。このような(C)成分の配合量は、通常、
(A)成分のオルガノポリシロキサン100重量部に対
して白金換算で0.000001〜0.1重量部の範囲
内であり、好ましくはo、oo oos〜0.01重量
部の範囲内である。(C)成分そのものの配合量はo、
oos〜100重量部の範囲内で使用されるが、上記の
白金換算の重量部の範囲内であれば、この重量部の範囲
を越えて使用してもよい。なお、白金換算重量とは、白
金以外の遷移金属の場合、配合される遷移金属と等しい
原子数の白金が配合されるとして計算した重量を意味す
る。The ratio of the hydrosilylation reaction catalyst to the silicone 444 resin or polysilane resin varies greatly depending on the manufacturing method of the granules, so it may not be possible to limit it to Samurai, or the content of the hydrosilylation reaction catalyst in component (C). It is desirable that the ratio is 0.01% or more. This is because if it is less than 0.01%, the proportion of silicone 414 resin or polysilane resin in the composition of the present invention becomes too high, and the physical properties after curing may be impaired. The blending amount of such component (C) is usually
It is within the range of 0.000001 to 0.1 part by weight in terms of platinum, and preferably within the range of o, oo oos to 0.01 part by weight, based on 100 parts by weight of the organopolysiloxane of component (A). (C) The blending amount of the component itself is o,
Although it is used within the range of oos to 100 parts by weight, it may be used in an amount exceeding this range as long as it is within the above range of parts by weight in terms of platinum. In addition, in the case of a transition metal other than platinum, the platinum equivalent weight means the weight calculated assuming that the same number of atoms of platinum as the transition metal to be blended is blended.
(D)成分は、加熱硬化後の成形品が長時間加熱状態に
おかれた時に、(C)成分を構成するシ2ノコーン樹脂
もしくはポリシラン樹脂が凝集することを防止する役割
を果たす。かかる(D)成分は、IA族、II A族を
除く金属元素の酸化物もしくは水酸化物またはカーボン
ブラックである。Component (D) plays a role in preventing the cyanocone resin or polysilane resin constituting component (C) from agglomerating when the molded article after heat curing is left in a heated state for a long time. Component (D) is an oxide or hydroxide of a metal element other than Group IA or Group IIA, or carbon black.
ここでIA族、II A族を除く金属元素としては、コ
バルト、マンガン、亜鉛、銅、鉄、ジルコニウム、クロ
ム、スズ、ニッケル、アルミニウム、バナジウム、セリ
ウム、ランタン等の希土類金属が例示される。これらの
金属は、酸化物もしくは水酸化物として組成物中に添加
する必要がある。かかる(D)成分の配合量は、通常(
A)成分のオルガノポリシロキサン100重量部に対し
0.01〜10v量部の範囲である。これは本発明にお
いては0.01重量部より少ないと、硬化物であるエラ
ストマー成形品が長時間加熱状態に置かれた場合の粒状
物構成樹脂の凝集防止効果を果たし得す、10重皿部を
越えると(A)成分のすルガノボリシロキサンの4熱性
を損なったり、成形物の機械的強度を低下させるからで
ある。Examples of metal elements other than Group IA and Group IIA include rare earth metals such as cobalt, manganese, zinc, copper, iron, zirconium, chromium, tin, nickel, aluminum, vanadium, cerium, and lanthanum. These metals must be added to the composition as oxides or hydroxides. The blending amount of component (D) is usually (
The amount ranges from 0.01 to 10 parts by weight per 100 parts by weight of the organopolysiloxane component A). In the present invention, if it is less than 0.01 part by weight, the 10-layer plate part can achieve the effect of preventing agglomeration of the resin constituting the granules when the cured elastomer molded product is left in a heated state for a long time. This is because, if it exceeds this amount, the tetrathermal properties of the component (A), surganobolisiloxane, will be impaired, and the mechanical strength of the molded product will be reduced.
本発明の組成物は、上記(A)〜(D)成分からなるオ
ルガノポリシロキサン組成物であるが、これには必要に
応じて、フユームドシリ力や湿式シリカなどの微粉状シ
リカ、表面疎水化処理された微粉状シリカ、クレープハ
ードニング防止剤、フェニルブチノールなどの貯蔵安定
化剤、オルガノポリシロキサン以外のポリマー、耐熱剤
、難燃剤、石英粉末、珪藻土、炭酸カルシウム、ガラス
繊維などを配合することは、本発明の目的を損わない限
り差し支えない。The composition of the present invention is an organopolysiloxane composition consisting of the above-mentioned components (A) to (D). finely powdered silica, crepe hardening inhibitors, storage stabilizers such as phenylbutynol, polymers other than organopolysiloxane, heat resistant agents, flame retardants, quartz powder, diatomaceous earth, calcium carbonate, glass fiber, etc. may be used as long as it does not impair the purpose of the present invention.
本発明の組成物は、上記(A)〜(D)成分を均一に混
合することによって容易に得られる。この混合順序に特
に制限はないが、(C)成分を少量の(A)成分中に混
合して均一に分散させた後、これを(A)、(B)およ
び(D)の混合物に添加する方法が望ましい。この場合
は、(C)成分の粒状物化されたヒドロシリル化反応用
触媒を破壊しない限り、いかなる手段を用いてもよい。The composition of the present invention can be easily obtained by uniformly mixing the components (A) to (D) above. There is no particular restriction on the mixing order, but after mixing component (C) into a small amount of component (A) and dispersing it uniformly, this is added to the mixture of (A), (B) and (D). The preferred method is to In this case, any means may be used as long as it does not destroy the granulated hydrosilylation reaction catalyst of component (C).
また、その温度条件は使用する(C)成分によって異な
るので一概に規定することはできないが、少なくとも(
C)成分で使用する熱可塑性樹脂の軟化点以下の温度で
あることが望ましい。In addition, the temperature conditions cannot be unconditionally defined because they vary depending on the component (C) used, but at least (
The temperature is desirably below the softening point of the thermoplastic resin used in component C).
以上のような本発明の81成物は、室温での貯蔵安定性
に優れているので1成分型加熱硬化性オルガノポリシロ
キサン組成物として長期間の保存が可能であり、かつ、
加熱硬化後の成形品が長時間加熱状態におかれても粒状
物構成樹脂が凝集することがなく、機械的強度の低下の
度合も小さい。The 81 composition of the present invention as described above has excellent storage stability at room temperature, so it can be stored for a long period of time as a one-component heat-curable organopolysiloxane composition, and
Even if the molded article after heating and curing is kept in a heated state for a long time, the resin constituting the particles does not aggregate, and the degree of decrease in mechanical strength is small.
したがって、これらの特性を要求されるシリコーンゴム
組成物、シリコーンゲル組成物、シリコーンレジン組成
物として極めて有用である。Therefore, it is extremely useful as silicone rubber compositions, silicone gel compositions, and silicone resin compositions that require these properties.
[実施例]
つぎに本発明を実施例によって説明する。実施例中、粘
度は25℃の値であり、Cpはセンチボイズを表わす。[Example] Next, the present invention will be explained by referring to an example. In the examples, viscosity is the value at 25°C, and Cp represents centivoise.
参考例1
白金ビニルシロキサン錯体の調製
160gの1.3−ジビニルテトラメチルジシロキサン
と、 32.0gの塩化白金酸(H2PtC1s・6H
20)を混合し、窒素気流中120℃で1時間加熱混合
した。Reference Example 1 Preparation of platinum vinyl siloxane complex 160 g of 1,3-divinyltetramethyldisiloxane and 32.0 g of chloroplatinic acid (H2PtC1s.6H
20) and heated and mixed at 120° C. for 1 hour in a nitrogen stream.
ついで、濾過によりて副生じた白金黒を除去した後、水
洗により酸を除去して塩化白金酸に1.3−ジビニルテ
トラメチルジシロキサンが配位した白金錯体を含む反応
生成物を得た。この反応生成物中の白金金属濃度は4.
25時間2であった。Next, platinum black produced as a by-product was removed by filtration, and then the acid was removed by washing with water to obtain a reaction product containing a platinum complex in which 1,3-divinyltetramethyldisiloxane was coordinated with chloroplatinic acid. The platinum metal concentration in this reaction product is 4.
It was 25 hours 2.
参考例2
白金触媒含有シリコーン樹脂微粒子の調製12モルXの
ジフェニルシロキサン単位、21モル%のジメチルシロ
キサン単位、67モル%のモノフェニルシロキサン単位
から構成されるシリコーン樹脂(軟化点110℃)16
.0gと、2.0gの参考例1で得られた白金ビニルシ
ロキサン錯体触媒を、330gの塩化メチレンに溶解さ
せた。この塩化メチレン溶液を、15gのポリビニルア
ルコール[日本合成化学工業特製、ゴーセノールGL−
05]を含む水中に撹拌しながら添加した。次いで、塩
化メチレンを25〜40℃で48時間かけて蒸発除去し
た。この@fiJ液から遠心分離によって固体状物を分
離した。次いで、この固体状物を水洗した後、多量のメ
チルアルコールで洗浄して、白金含有量0.21重量%
の白金触媒含有シリコーン樹脂微粒子を得た。この微粒
子の平均粒子径は7μ幻であり、その形状は球状であっ
た。Reference Example 2 Preparation of Silicone Resin Fine Particles Containing a Platinum Catalyst Silicone resin (softening point: 110°C) consisting of 12 moles of diphenylsiloxane units, 21 mole% of dimethylsiloxane units, and 67 mole% of monophenylsiloxane units
.. 0 g and 2.0 g of the platinum vinyl siloxane complex catalyst obtained in Reference Example 1 were dissolved in 330 g of methylene chloride. This methylene chloride solution was mixed with 15 g of polyvinyl alcohol [Nippon Gosei Kagaku Kogyo special product, Gohsenol GL-
05] into water with stirring. Methylene chloride was then removed by evaporation at 25-40°C over 48 hours. Solid matter was separated from this @fiJ solution by centrifugation. Next, this solid material was washed with water and then with a large amount of methyl alcohol to obtain a platinum content of 0.21% by weight.
Platinum catalyst-containing silicone resin fine particles were obtained. The average particle diameter of the fine particles was 7 μm, and the shape was spherical.
参考例3
白金触媒含有ポリシラン樹脂微粒子の調製参考例2にお
いてシリコーン樹脂の代りに、8.0gのポリシラン樹
脂(軟化点135℃)を使用して、他は参考例2と同様
にして、平均粒子径10μ量、白金含有量0.27%の
白金触媒含有ポリシロキサン樹脂微粒子を得た。Reference Example 3 Preparation of platinum catalyst-containing polysilane resin fine particles In Reference Example 2, 8.0 g of polysilane resin (softening point 135°C) was used instead of the silicone resin, and the other conditions were the same as in Reference Example 2, so that the average particles were Platinum catalyst-containing polysiloxane resin fine particles having a diameter of 10 μm and a platinum content of 0.27% were obtained.
参考例4
白金触媒含有シリコーン樹脂微粒子の調製260gの塩
化白金酸水溶液(白金含有量33%)と160gの1.
3−ジビニルテトラメチルジシロキサンを350gのイ
ソプロピルアルコールに溶解し、さらに100gの重炭
酸ソーダを加えて懸濁状態で撹拌しながら70〜80℃
で60分反応させた。イソプロピルアルコールと水を圧
力50+n+nHg、 A度45℃の条件下で揮発除去
し、固形分を濾過することによって白金含有量8,5重
量Xの白金触媒溶液を調製した。Reference Example 4 Preparation of silicone resin fine particles containing platinum catalyst 260 g of chloroplatinic acid aqueous solution (platinum content 33%) and 160 g of 1.
Dissolve 3-divinyltetramethyldisiloxane in 350 g of isopropyl alcohol, add 100 g of bicarbonate of soda, and heat the suspension to 70-80°C while stirring.
The reaction was carried out for 60 minutes. A platinum catalyst solution having a platinum content of 8.5 weight X was prepared by removing isopropyl alcohol and water by volatilization under conditions of a pressure of 50 + n + nHg and a degree of A of 45°C, and filtering the solid content.
一方、looogのフェニルトリクロロシラン、160
gのジメチルジクロロシランおよび330gのジフェ
ニルジクロロシランを500gのトルエンで希釈した溶
液を加水分解の後、塩化水素を除去してから有機相を分
離し、次いで0.6gの水酸化カリウムを加えて加熱し
、発生する水を留去した後、中和して水洗を繰返した。On the other hand, looog phenyltrichlorosilane, 160
After hydrolysis of a solution of g of dimethyldichlorosilane and 330 g of diphenyldichlorosilane diluted with 500 g of toluene, hydrogen chloride was removed and the organic phase was separated, then 0.6 g of potassium hydroxide was added and heated. After distilling off the generated water, it was neutralized and washing with water was repeated.
しかる後溶媒を乾固してガラス転移点が65℃、軟化点
が85℃熱可塑性シリコーン樹脂を得た。Thereafter, the solvent was dried to obtain a thermoplastic silicone resin having a glass transition point of 65°C and a softening point of 85°C.
ガラス製の撹拌機付容器にこの熱可塑性シリコーン樹脂
900gとトルエン500gとジクロロメタン4600
gを投入し均一に混合した。次いで上記で得られた白
金触媒溶液44.4 gを投入し、混合することにより
白金触媒と熱可塑性シリコーン樹脂の均一溶液を得た。900 g of this thermoplastic silicone resin, 500 g of toluene, and 4600 g of dichloromethane in a glass container with a stirrer.
g was added and mixed uniformly. Next, 44.4 g of the platinum catalyst solution obtained above was added and mixed to obtain a homogeneous solution of the platinum catalyst and thermoplastic silicone resin.
次いでこの溶液を2流体ノズルを使って、窒素ガスを熱
気流にしたスワブし−ドライヤー槽(アシザワ・ニトロ
・アトマイシー株式会社製)内に連続して噴籾した。Next, this solution was continuously sprayed into a swab-dryer tank (manufactured by Ashizawa Nitro Atomy Sea Co., Ltd.) using a two-fluid nozzle and a hot nitrogen gas stream.
ここで、窒素ガスの熱気流温度はスプレードライヤーの
入口で95℃であり、スプレードライヤーの出口で45
℃であった。1時間の運転後でバッグフィルターによっ
て450 gの白金触媒含有シリコーン樹脂微粒子を捕
集した。この微粒子の平均粒子径は1.ILljllで
あり、その形状は球状であった。また、白金金属含有量
は0.40重量%であった。Here, the hot air flow temperature of nitrogen gas is 95°C at the inlet of the spray dryer, and 45°C at the outlet of the spray dryer.
It was ℃. After one hour of operation, 450 g of platinum catalyst-containing silicone resin fine particles were collected using a bag filter. The average particle diameter of these fine particles is 1. ILljll, and its shape was spherical. Further, the platinum metal content was 0.40% by weight.
実施例1
ジメチルシロキサン単位99.8モルχとメチルビニル
シロキサン単位0,15モル%からなるオルガノポリシ
ロキサン生ゴム(重合度5000) 100重量部、両
末端シラノール基封鎖ジメチルシロキサン (粘度60
c p )8.0部および比表面積200nz/gのヒ
ユームドシリカ40重量部をニーダ−ミキサーに投入し
て加熱下で均一になるまで混練した。このゴムベース1
00重棗部に対して、平均分子式が、
Me3SiO(Me2SiO)3(HeHSiO) a
siHe3で示されるシロキサン0.30重量部に第1
表に示す通りの重量部の金属化合物およびカーボンブラ
・ンクを添加混合してから、各々に参考例2で得られた
白金触媒含有シリコーン樹脂微粒子0.04重量部およ
び1−エチニル−1−シクロヘキサノール0.001重
量部を混合して加熱硬化性オルガノポリシロキサン組成
物を調製した。Example 1 100 parts by weight of organopolysiloxane raw rubber (degree of polymerization 5000) consisting of 99.8 mol χ of dimethylsiloxane units and 0.15 mol% of methylvinylsiloxane units, dimethylsiloxane endblocked with silanol groups at both ends (viscosity 60)
8.0 parts of c p ) and 40 parts by weight of fumed silica having a specific surface area of 200 nz/g were placed in a kneader mixer and kneaded under heating until uniform. This rubber base 1
For the 00 jujutsu part, the average molecular formula is Me3SiO(Me2SiO)3(HeHSiO) a
0.30 parts by weight of siloxane represented by siHe3
After adding and mixing the metal compound and carbon blank in the weight parts shown in the table, 0.04 weight part of the platinum catalyst-containing silicone resin fine particles obtained in Reference Example 2 and 1-ethynyl-1-cyclo A heat-curable organopolysiloxane composition was prepared by mixing 0.001 part by weight of hexanol.
これらの組成物を130℃で5分間加圧下で硬化させ厚
さ2IIIINのシートを作成した。このシートを20
0℃で2時間加硫した後、250℃の熱風循環式オーブ
ン中で3日間加熱処理した。得られた加熱直後のシート
と加熱処理後のシートについてシリコーン樹脂微粒子の
凝集物がゴム中に生成しているかどうかを顕微鏡によっ
て観察した。また、これらのシートの機械的特性をJI
SK6301に増始して測定した。比較のため上記にお
いて白金触媒含有シリコーン樹脂微粒子を添加混合しな
い以外は上記と同様にして加熱硬化性オルガノポリシロ
キサン組成物を調製し、この組成物の特性を上記と同様
にして測定した。これらの測定結果を第1表に併記した
。These compositions were cured under pressure at 130°C for 5 minutes to produce a sheet with a thickness of 2IIIN. 20 sheets of this
After vulcanization at 0°C for 2 hours, it was heat-treated in a hot air circulation oven at 250°C for 3 days. The obtained sheet immediately after heating and the sheet after heat treatment were observed using a microscope to determine whether aggregates of silicone resin fine particles were formed in the rubber. In addition, the mechanical properties of these sheets were determined by JI
The measurement was performed starting from SK6301. For comparison, a heat-curable organopolysiloxane composition was prepared in the same manner as above except that the platinum catalyst-containing silicone resin fine particles were not added and mixed, and the properties of this composition were measured in the same manner as above. These measurement results are also listed in Table 1.
第1表
実施例2
実施例1において、第1表に示した添加剤の代わりに第
2表に示す添加剤を使用し、さらに、白金触媒含有シリ
コーン樹脂微粒子の代わりに、参考例3で得られた白金
触媒含有ポリシラン樹脂微粒子0.05gを使用した以
外は実施例1と同様にして加熱硬化性オルガノポリシロ
キサン組成物を調製した。これらの組成物を130℃で
5分間加圧下で硬化させて厚さ2m1mのシートを作成
した。以下、これらのシートの特性を実施例1と同様に
して評価した。これらの結果を第2表に示す。Table 1 Example 2 In Example 1, the additives shown in Table 2 were used instead of the additives shown in Table 1, and the platinum catalyst-containing silicone resin fine particles were replaced with those obtained in Reference Example 3. A heat-curable organopolysiloxane composition was prepared in the same manner as in Example 1, except that 0.05 g of the platinum catalyst-containing polysilane resin fine particles prepared above were used. These compositions were cured under pressure at 130° C. for 5 minutes to produce a sheet with a thickness of 2 ml and 1 m. The properties of these sheets were evaluated in the same manner as in Example 1 below. These results are shown in Table 2.
第2表
実施例3
粘度1500cpのα、ω−ジビニルポリジメチルシロ
キサンloogに、ヘキザメヂルジシラザンで疎水化処
理されたフユームドシリカ20gを十分に混合した後、
平均分子式が、
河easiO(MezSiO)3()IelSiO)6
siMe3示されるシロキサン2.8gとフェニルブヂ
ノール0.01gを添加し、均一に混合した。この組成
物(組成物−1とする)100重量部に第3表に示す通
りの金属化合物とカーボンプラ・ンクを所定量添加し、
各々にさらに参考例2で得られた白金触媒含有シリコー
ン樹脂微粒子0.25重量部を添加混合することにより
加熱硬化性オルガノポリシロキサン組成物を得た。これ
らの組成物を130’Cで5分間加圧下で硬化させて2
I111厚のシートを得た。このシートを250℃の熱
風循環式オーブン中で3日間加熱した。これらのシート
について実施例1同様にして評価した。その結果を第3
表に示した。Table 2 Example 3 After thoroughly mixing 20 g of fumed silica hydrophobized with hexamedyldisilazane into α,ω-divinylpolydimethylsiloxane loog with a viscosity of 1500 cp,
The average molecular formula is EasiO(MezSiO)3()IelSiO)6
2.8 g of siloxane shown as siMe3 and 0.01 g of phenylbutinol were added and mixed uniformly. To 100 parts by weight of this composition (referred to as composition-1), a prescribed amount of metal compounds and carbon platinum as shown in Table 3 was added,
0.25 parts by weight of the platinum catalyst-containing silicone resin fine particles obtained in Reference Example 2 were further added and mixed to each of them to obtain a heat-curable organopolysiloxane composition. These compositions were cured under pressure at 130'C for 5 minutes.
A sheet having a thickness of I111 was obtained. This sheet was heated in a hot air circulation oven at 250° C. for 3 days. These sheets were evaluated in the same manner as in Example 1. The result is the third
Shown in the table.
第3表
実施例4
実施例1において、第1表に示した添加剤の代りに第4
表に示した添加剤を使用し、参考例1で得られた白金層
v!、含有シリコーン樹脂黴粒子の代りに参考例4で得
られた白金触媒含有シリコーン樹脂微粒子0.02重量
部を使用した以外は、実施例1と同様にして、加熱硬化
性オルガノポリシロキサン組成物を調製した。これらの
組成物を実施例1と同様にして硬化させシート機械的特
性を測定した。この結果を第4表に示した。Table 3 Example 4 In Example 1, instead of the additives shown in Table 1,
The platinum layer v! obtained in Reference Example 1 using the additives shown in the table! A thermosetting organopolysiloxane composition was prepared in the same manner as in Example 1, except that 0.02 parts by weight of the platinum catalyst-containing silicone resin fine particles obtained in Reference Example 4 was used instead of the silicone resin mold particles containing mold. Prepared. These compositions were cured in the same manner as in Example 1, and sheet mechanical properties were measured. The results are shown in Table 4.
第4表
[発明の効果]
本発明の加熱硬化性オルガノポリシロキサン組成物は、
(A)〜(D)成分がらなり、特に(C)成分と(DJ
酸成分含有しているので、室温付近での貯蔵安定性に優
れており、加熱時の硬化か迅速であり、かつ、加熱硬化
後のエラストマー成形品が長時間加熱下におかれ゛C凝
集物が形成せず、機械的強度の低下の度合が小さいとい
う特徴を有する。Table 4 [Effects of the invention] The heat-curable organopolysiloxane composition of the present invention is as follows:
Consists of components (A) to (D), especially component (C) and (DJ
Because it contains an acid component, it has excellent storage stability near room temperature, and cures quickly when heated, and after heat-curing, the elastomer molded product is not exposed to heat for a long time. It is characterized in that it does not form, and the degree of decrease in mechanical strength is small.
Claims (1)
)_/_2(式中、Rは置換または非置換の1価炭化水
素基、aは1.8〜2.3の数である)で示され、1分
子中に少なくとも2個のケイ素原子結合アルケニル基を
有するオルガノポリシロキサン、 (B)1分子中に少なくとも2個のケイ素原子結合水素
原子を有するオルガノハイドロジェンポリシロキサン、 (C)ヒドロシリル化反応触媒と軟化点またはガラス転
移点が40〜200℃のシリコーン樹脂もしくはポリシ
ラン樹脂よりなる粒状物、 および (D) I A族、IIA族を除く金属元素の酸化物もしく
は酸化物、またはカーボンブラックからなる加熱硬化性
オルガノポリシロキサン組成物。 2 I A族、IIA族を除く金属元素がセリウム、コバ
ルト、マンガン、亜鉛、鉄、ジルコニウムもしくはチタ
ンである特許請求の範囲第1項記載の加熱硬化性オルガ
ノポリシロキサン組成物。[Claims] 1 (A) Average compositional formula R_aSiO_(_4_-_a_
)_/_2 (wherein R is a substituted or unsubstituted monovalent hydrocarbon group, a is a number from 1.8 to 2.3), and at least two silicon atom bonds in one molecule An organopolysiloxane having an alkenyl group, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction catalyst and a softening point or glass transition point of 40 to 200. A heat-curable organopolysiloxane composition comprising a particulate material made of a silicone resin or a polysilane resin at a temperature of 0.degree. 2. The heat-curable organopolysiloxane composition according to claim 1, wherein the metal element other than Group IA and Group IIA is cerium, cobalt, manganese, zinc, iron, zirconium, or titanium.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP90202671A JPH03250052A (en) | 1990-01-31 | 1990-07-31 | Thermally curable organopolysiloxane composition |
| EP19910101150 EP0440168A3 (en) | 1990-01-30 | 1991-01-29 | One-part curable organosiloxane composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2-21169 | 1990-01-31 | ||
| JP2116990 | 1990-01-31 | ||
| JP90202671A JPH03250052A (en) | 1990-01-31 | 1990-07-31 | Thermally curable organopolysiloxane composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03250052A true JPH03250052A (en) | 1991-11-07 |
Family
ID=12047422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP90202671A Pending JPH03250052A (en) | 1990-01-30 | 1990-07-31 | Thermally curable organopolysiloxane composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03250052A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06157913A (en) * | 1992-08-31 | 1994-06-07 | Dow Corning Corp | Curable organosiloxane composition containing organotitanium compound/microencapsulated platinum cocatalyst |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54146897A (en) * | 1978-05-10 | 1979-11-16 | Toshiba Silicone | Organopolysiloxane composition |
| JPS61285257A (en) * | 1985-06-11 | 1986-12-16 | Shin Etsu Chem Co Ltd | Heat stabilizer for silicone rubber and its manufacturing method |
| JPS62149981A (en) * | 1985-12-25 | 1987-07-03 | カンボウプラス株式会社 | Heat resistant sheet |
| JPH0214244A (en) * | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | Thermosetting organopolysiloxane composition |
-
1990
- 1990-07-31 JP JP90202671A patent/JPH03250052A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54146897A (en) * | 1978-05-10 | 1979-11-16 | Toshiba Silicone | Organopolysiloxane composition |
| JPS61285257A (en) * | 1985-06-11 | 1986-12-16 | Shin Etsu Chem Co Ltd | Heat stabilizer for silicone rubber and its manufacturing method |
| JPS62149981A (en) * | 1985-12-25 | 1987-07-03 | カンボウプラス株式会社 | Heat resistant sheet |
| JPH0214244A (en) * | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | Thermosetting organopolysiloxane composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06157913A (en) * | 1992-08-31 | 1994-06-07 | Dow Corning Corp | Curable organosiloxane composition containing organotitanium compound/microencapsulated platinum cocatalyst |
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