JPH03250693A - Manufacture of multilayered printed wiring board - Google Patents
Manufacture of multilayered printed wiring boardInfo
- Publication number
- JPH03250693A JPH03250693A JP4567090A JP4567090A JPH03250693A JP H03250693 A JPH03250693 A JP H03250693A JP 4567090 A JP4567090 A JP 4567090A JP 4567090 A JP4567090 A JP 4567090A JP H03250693 A JPH03250693 A JP H03250693A
- Authority
- JP
- Japan
- Prior art keywords
- hydrogen
- printed wiring
- copper
- wiring board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000001257 hydrogen Substances 0.000 claims abstract description 22
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 22
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 12
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000005751 Copper oxide Substances 0.000 claims abstract description 11
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 11
- 239000007789 gas Substances 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 239000012298 atmosphere Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000354 decomposition reaction Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 238000009877 rendering Methods 0.000 abstract 1
- 125000001475 halogen functional group Chemical group 0.000 description 9
- 239000000243 solution Substances 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は多層プリント配線板の製造方法に関するもので
、回路となる銅箔面とプリプレグとの密着性に優れ、へ
ローイング現象のない多層プリント配線板の製造方法に
関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a multilayer printed wiring board, which is a multilayer printed wiring board that has excellent adhesion between a copper foil surface that will become a circuit and a prepreg, and is free from the melting phenomenon. The present invention relates to a method for manufacturing a wiring board.
従来、多層プリント配線板を製造する方法は、回路とな
る銅箔の表面を粗化し、さらに亜塩素酸ナトリウム系の
水溶液や過硫酸カリ系の水溶液で酸化銅とすることによ
り、銅箔面に微細な凹凸を形成することによりプリプレ
グとの密着性をはかっていた。Conventionally, the method for manufacturing multilayer printed wiring boards is to roughen the surface of the copper foil that forms the circuit, and then oxidize the copper foil with a sodium chlorite-based aqueous solution or a potassium persulfate-based aqueous solution. Adhesion to the prepreg was achieved by forming fine irregularities.
しかしながら、単に銅箔面を酸化銅とする方法ではプリ
プレグと積層一体化したものは、多層プリント配線板と
した後、スルホール用のドリル加工を行った後の工程で
デスミア用の処理液、メツキの前処理液やメツキ液に浸
漬した際に、酸化銅面が耐酸、耐アルカリ性に乏しく、
これらの処理液に侵され、いわゆるハローイング現象（
以下ハローという）が発生し、ｗ４箔面とプリプレグと
の接着力を著しく低下させてしまうという欠点があった
。However, if the copper foil surface is simply coated with copper oxide, the prepreg and laminated product are integrated, and after forming a multilayer printed wiring board, the processing liquid for desmear and the plating are applied in the process after drilling for through holes. When immersed in pre-treatment liquid or plating liquid, the copper oxide surface has poor acid and alkali resistance.
These processing solutions cause the so-called haloing phenomenon (
There was a drawback that a halo (hereinafter referred to as a halo) was generated and the adhesive force between the W4 foil surface and the prepreg was significantly reduced.
これらの欠点を改良するため、回路面を酸化銅とし、次
いでこの面をアルカリ性還元剤溶液で処理する方法等が
提案されている（特開昭５６−１５３７９７号公報）が
、この方法はアルカリ性還元剤溶液を安定化させること
が非常に困難であり、さらにアルカリ性還元剤溶液によ
りカニッツアロー反応などの副反応が生じる恐れがあり
、また還元剤であるホルマリンの消耗が激しく、補充な
どの還元剤溶液の管理が非常に雛しく、還元剤溶液は高
温とする必要があり、さらに高アルカリであるため取り
扱いの安全性に劣るという欠点がある。In order to improve these drawbacks, a method has been proposed in which the circuit surface is made of copper oxide and then this surface is treated with an alkaline reducing agent solution (Japanese Patent Laid-Open No. 153797/1983); It is extremely difficult to stabilize the reducing agent solution, and there is a risk that side reactions such as the Kanitz-Arrow reaction may occur due to the alkaline reducing agent solution.Furthermore, formalin, which is the reducing agent, is rapidly consumed, and it is difficult to use the reducing agent solution for replenishment. It is difficult to manage, requires the reducing agent solution to be heated to a high temperature, and is highly alkaline, which makes handling less safe.
〔発明が解決しようとする課Ｒ］
本発明らはこれらの欠点を解決しようと鋭意研究を進め
た結果、銅箔面を酸化銅処理後、水素もしくは水素及び
窒素の混合ガス雰囲気中で還元処理を施すことにより、
ハローを著しく改善できるとの知見を得てなされたもの
であり、銅箔面とプリプレグとの接着性に優れ、かつ耐
熱性に優れたハローの出ない多層プリント配線板を製造
することにある。[Problem R to be solved by the invention] As a result of intensive research by the present inventors to solve these drawbacks, the copper foil surface was treated with copper oxide, and then reduced in an atmosphere of hydrogen or a mixed gas of hydrogen and nitrogen. By applying
This was done based on the knowledge that halos can be significantly improved, and the objective is to produce a multilayer printed wiring board that has excellent adhesiveness between the copper foil surface and the prepreg, has excellent heat resistance, and does not exhibit halos.
〔課題を解決するための手段］
本発明は、多層プリント配線板を製造するにあたって、
まず回路パターンの銅箔面を通常の方法により酸化処理
した後、水素もしくは水素と窒素の混合ガスの雰囲気中
で還元処理を行った後に積層一体化することによりハロ
ーの生じない多層プリント配線板を製造するものである
。[Means for Solving the Problems] The present invention provides the following steps in manufacturing a multilayer printed wiring board:
First, the copper foil surface of the circuit pattern is oxidized using the usual method, then reduced in an atmosphere of hydrogen or a mixed gas of hydrogen and nitrogen, and then laminated into one piece to create a multilayer printed wiring board that does not produce halos. It is manufactured.
本発明において用いられる水素と窒素の混合ガスは水素
の濃度が５〜１００％の範囲のものが好ましく低温にて
還元作用を進める意味で水素が高濃度の方が望ましい。The mixed gas of hydrogen and nitrogen used in the present invention preferably has a hydrogen concentration in the range of 5 to 100%, and preferably has a high hydrogen concentration in order to promote the reduction action at low temperatures.
又、雰囲気温度は１５０〜４００°Ｃの範囲が好ましく
１５０°Ｃ以下では還元作用が生じに＜ ＜ ４００℃
以上では基板材料の分解が進む。工業的には基板材料の
分解や処理時間を考え水素が高濃度で低温側で処理する
のが遺しているが、還元作用が進めば本発明の効果が得
られるのでこれに限定されるものではない。In addition, the ambient temperature is preferably in the range of 150 to 400°C; below 150°C, a reducing effect occurs.<<400°C
In this case, the decomposition of the substrate material progresses. Industrially, considering the decomposition of the substrate material and the processing time, processing is still carried out at a low temperature with a high concentration of hydrogen, but the effect of the present invention can be obtained as long as the reduction action progresses, so it is not limited to this. do not have.
還元処理により銅箔表面の酸化銅被膜を耐薬品性に優れ
る金属銅化するとともに、酸化銅被膜形成時の表面の凹
凸の形状を保持してプリプレグ中の樹脂との接着性を維
持することにより耐ハロー性、耐熱性の優れた多層プリ
ント配線板を得ることが出来る。Through reduction treatment, the copper oxide coating on the surface of the copper foil is converted into metallic copper with excellent chemical resistance, and by maintaining the uneven shape of the surface when the copper oxide coating is formed, it maintains adhesion with the resin in the prepreg. A multilayer printed wiring board with excellent halo resistance and heat resistance can be obtained.
このように本発明で用いる水素と窒素の混合ガスによる
還元処理はガス濃度と温度の管理のみで良く管理が容易
で、かつ多量の処理が可能なため、安価で効率良くハロ
ーのない多層プリント配線板を製造するのに好適である
。In this way, the reduction treatment using a mixed gas of hydrogen and nitrogen used in the present invention is easy to manage by simply controlling the gas concentration and temperature, and can be processed in large quantities, so it can be used at low cost, efficiently, and without halos in multilayer printed wiring. Suitable for manufacturing plates.
実施例１ 以下の工程により多層プリント配線板を作成した。Example 1 A multilayer printed wiring board was created by the following steps.
（１）ガラス−エポキシ銅張積層板に公知の方法によっ
て回路パターンを形成し、内層用回路板とした。(1) A circuit pattern was formed on a glass-epoxy copper-clad laminate by a known method to obtain an inner layer circuit board.
（２）脱脂剤（エンプレートＰＣ−４９９メルテツクス
株）に浸漬し、回路パターン面のよごれを取り除く。(2) Immerse in a degreaser (Enplate PC-499 Meltex Co., Ltd.) to remove dirt from the circuit pattern surface.
（３）さらに、水洗後、過硫酸アンモニウムでソフトエ
ツチングをおこなった後、硫酸水溶液で洗浄する。(3) Furthermore, after washing with water, soft etching is performed with ammonium persulfate, and then washing is performed with an aqueous sulfuric acid solution.
（４）水洗後、内層銅箔酸化処理剤（エンブレー１−
ＭＢ −４３８メルテックス株）で処理し銅箔面に酸化
被膜を形成する。(4) After washing with water, use the inner layer copper foil oxidation treatment agent (ENBLE 1-
MB-438 Meltex Co., Ltd.) to form an oxide film on the copper foil surface.
（５）水洗後１２０″Ｃ２０分間乾燥する（６）水素５
０％、窒素５０％の混合ガス中に温度２００℃で６０分
間炉内に放置する。(5) After washing with water, dry at 120″C for 20 minutes (6) Hydrogen 5
0% and 50% nitrogen in a furnace at a temperature of 200° C. for 60 minutes.
（７）得られた内層回路板の上下にエポキシプリプレグ
を重ね合わせ、１８０°Ｃ１１２０分間、５０ｋｇ／ｃ
ｄの条件で加熱・加圧し多層プリント配線板を作成した
。(7) Overlap epoxy prepreg on the top and bottom of the obtained inner layer circuit board, 180°C, 1120 minutes, 50kg/c
A multilayer printed wiring board was produced by heating and pressurizing under the conditions of d.
（８）得られた多層プリント配線板を０．４ ｔｍφの
ドリルを用いてスルホール加工し、このものを塩酸水溶
液（１２％）に５分間浸漬しハロ−性、およびノンフラ
ッシュタイプの無電解銅メツキプロセス（シブレイＰＨ
Ｐプロセスシブレイファーイースト株）を用いメツキプ
ロセスによるハロー性を評価した。また、内層ｗ４箔の
ビール強度および半田耐熱性を測定し結果を第１表に示
す。(8) The obtained multilayer printed wiring board was drilled with a 0.4 tmφ drill and immersed in a hydrochloric acid aqueous solution (12%) for 5 minutes to form a halo-like and non-flash type electroless copper. Metsuki Process (Sibley PH)
The halo property was evaluated by the Metsuki process using P Process (Sible Far East strain). In addition, the beer strength and solder heat resistance of the inner layer W4 foil were measured and the results are shown in Table 1.
実施例２
実施例１と同様の工程により多層プリント配線板を作成
するが実施例１の（６）の工程で水素２０％、窒素８０
％の混合ガス中に温度２５０”Ｃで６０分間炉内に放置
する点を変えた以外は実施例１と同様に行い多層プリン
ト配線板を作成し、評価した結果を第１表に示す。Example 2 A multilayer printed wiring board was created by the same process as in Example 1, but in step (6) of Example 1, 20% hydrogen and 80% nitrogen were used.
A multilayer printed wiring board was prepared in the same manner as in Example 1, except that it was left in the oven for 60 minutes at a temperature of 250''C in a mixed gas of 100%, and the evaluation results are shown in Table 1.
実施例３
実施例１と同様の工程により多層プリント配線板を作成
するが、実施例１の（１）のガラスエポキシ銅張積層板
をガラスポリイミドの積層板に、（２）のエポキシプリ
プレグをポリイミドプリプレグに同じ＜（２）の１８０
°Ｃ１１２０分間を２００’Ｃ１５０分間に及び（６）
の工程で水素２０％、窒素８０％、温度３００°Ｃの炉
内に放置して変えた以外は実施例１と同様に行い多層プ
リント配線板を作成し評価した結果を第１表に示す
比較例
実施例１の（６）の工程を除いた以外は実施例１と同様
にし多層プリント配線板を作成し評価した結果を第１表
に示す。Example 3 A multilayer printed wiring board is created by the same process as in Example 1, but the glass epoxy copper clad laminate of Example 1 (1) is replaced with a glass polyimide laminate, and the epoxy prepreg of (2) is replaced with a polyimide laminate. Same as prepreg <(2) 180
°C 1120 minutes to 200'C 150 minutes (6)
A multilayer printed wiring board was created and evaluated in the same manner as in Example 1, except that the process was changed by leaving it in a furnace at 20% hydrogen, 80% nitrogen, and a temperature of 300°C. Table 1 shows the comparison results. EXAMPLE A multilayer printed wiring board was prepared and evaluated in the same manner as in Example 1 except that step (6) of Example 1 was omitted. Table 1 shows the results.
第
表
※１ ： 常態＋Ｓ−２６０／２０’ （ＪＴＳ
Ｃ６４８１）※２ ： プレッシャークツカー（１２５
℃）１時間＋Ｓ−２６０／２０’※３ ： プレッシャ
ークツカー（１２５℃）２時間＋Ｓ−２６０／２０’〔
発明の効果］
以上のように、本発明の方法により得られた多層プリン
ト配線板は、回路パターンを形成した内層銅箔とプリプ
レグとの接着性に非常に優れ、耐ハロー性、耐熱性に優
れた多層プリント配線板であり、さらに本発明の多層プ
リント配線板を得る方法においては内層銅箔の還元に用
いる水素もしくは水素と窒素の混合ガスの取扱い及びそ
の処理は容易で、かつ生産性に優れ、工業的利用価値の
高いものである。Table *1: Normal + S-260/20' (JTS
C6481) *2: Pressure cutter (125
°C) 1 hour + S-260/20'*3: Pressure cooker (125 °C) 2 hours + S-260/20' [
[Effects of the Invention] As described above, the multilayer printed wiring board obtained by the method of the present invention has excellent adhesion between the inner layer copper foil on which the circuit pattern is formed and the prepreg, and has excellent halo resistance and heat resistance. Furthermore, in the method for obtaining a multilayer printed wiring board of the present invention, handling and processing of hydrogen or a mixed gas of hydrogen and nitrogen used for reducing the inner layer copper foil is easy and has excellent productivity. , has high industrial utility value.
Claims (1)
成した内層回路板１枚以上と複数のプリプレグとを交互
に重ね合わせ、更にその上下に銅箔もしくは片面銅張板
もしくは片面にのみ回路を作成した両面銅張板を配し、
プレスにより加熱・加圧することによって一体化し、多
層プリント配線板を製造する方法において、内層回路板
の回路パターンである銅箔表面に酸化銅被膜を形成し、
次いでこれら内層回路板を水素もしくは水素および窒素
の混合ガス雰囲気中で還元処理し回路パターン表面の酸
化銅被膜を金属銅化した後、プリプレグと交互に重ね合
わせ、プレスにより加熱・加圧して多層一体化すること
を特徴とする多層プリント配線板の製造方法。(1) One or more inner layer circuit boards with a circuit pattern formed on one or both sides in advance and multiple prepregs are alternately stacked, and then copper foil or one-sided copper clad board or double-sided with a circuit formed only on one side are layered on top and bottom. Arranged with copper clad plate,
In the method of manufacturing a multilayer printed wiring board by integrating by heating and pressurizing with a press, a copper oxide film is formed on the surface of the copper foil that is the circuit pattern of the inner layer circuit board,
These inner layer circuit boards are then subjected to reduction treatment in a hydrogen or mixed gas atmosphere of hydrogen and nitrogen to convert the copper oxide film on the surface of the circuit pattern into metallic copper, which is then stacked alternately with prepreg and heated and pressurized using a press to form a multi-layered unit. A method for manufacturing a multilayer printed wiring board, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4567090A JPH03250693A (en) | 1990-02-28 | 1990-02-28 | Manufacture of multilayered printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4567090A JPH03250693A (en) | 1990-02-28 | 1990-02-28 | Manufacture of multilayered printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03250693A true JPH03250693A (en) | 1991-11-08 |
Family
ID=12725823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4567090A Pending JPH03250693A (en) | 1990-02-28 | 1990-02-28 | Manufacture of multilayered printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03250693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113215518A (en) * | 2021-03-17 | 2021-08-06 | 江苏富乐德半导体科技有限公司 | Copper sheet oxidation method |
-
1990
- 1990-02-28 JP JP4567090A patent/JPH03250693A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113215518A (en) * | 2021-03-17 | 2021-08-06 | 江苏富乐德半导体科技有限公司 | Copper sheet oxidation method |
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