JPH03251323A - Nc laser/electrical discharging composite machining device - Google Patents
Nc laser/electrical discharging composite machining deviceInfo
- Publication number
- JPH03251323A JPH03251323A JP2047253A JP4725390A JPH03251323A JP H03251323 A JPH03251323 A JP H03251323A JP 2047253 A JP2047253 A JP 2047253A JP 4725390 A JP4725390 A JP 4725390A JP H03251323 A JPH03251323 A JP H03251323A
- Authority
- JP
- Japan
- Prior art keywords
- work
- laser
- cutting
- machining
- discharge machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title claims abstract description 58
- 239000002131 composite material Substances 0.000 title claims abstract description 5
- 238000007599 discharging Methods 0.000 title abstract 2
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000003698 laser cutting Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 8
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 12
- 230000003746 surface roughness Effects 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract 3
- 238000009760 electrical discharge machining Methods 0.000 description 18
- 239000012530 fluid Substances 0.000 description 15
- 230000010355 oscillation Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 3
- 239000002905 metal composite material Substances 0.000 description 3
- 241001272720 Medialuna californiensis Species 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000009763 wire-cut EDM Methods 0.000 description 1
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明はレーザ切断加工と放電加工の両機能を合せ持
った金属複合加工装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a metal composite processing device that has both laser cutting and electrical discharge machining functions.
従来技術
レーザ切断機、放電加工機(型彫り、ワイヤカット)が
公知である。Prior Art Laser cutting machines and electrical discharge machines (die engraving, wire cutting) are known.
レーザ切断機は切断面の面粗さに多少の難があるが金属
ワークを複雑な形状で高速に切断加工することが可能で
、放電加工機は加工速度が非常に遅いが而粗さが小さい
三次元曲面の精密な加工を行うことができる。Laser cutting machines have some problems with the surface roughness of the cut surface, but are capable of cutting metal workpieces with complex shapes at high speeds, while electric discharge machines have very slow processing speeds, but the roughness is small. It is possible to precisely process three-dimensional curved surfaces.
ちなみに、レーザ切断加工は例えば、切断速度1.50
0mm/分(板厚1−Omm)、而粗さ50μRmax
であるのに対し、型彫りの放電加工では、例えば加工速
度(加工深さ) O,] mm/m i n。By the way, laser cutting processing has a cutting speed of 1.50, for example.
0mm/min (plate thickness 1-Omm), roughness 50μRmax
On the other hand, in die-sinking electric discharge machining, for example, the machining speed (machining depth) is O,] mm/min.
面粗さ10μRmaxである。The surface roughness is 10μRmax.
しかし、これら二種の装置は加工方法および加工精度が
異なるために、個別の装置としてのみ存在し、それぞれ
が全く異なる目的に使用されている。However, since these two types of devices have different processing methods and processing precision, they exist only as separate devices, and each is used for completely different purposes.
発明が解決しようとした課題
この発明は、レーザ切断加工と放電加工の長所を合せ持
つ金属複合加工装置の提供を課題とした。Problems to be Solved by the Invention The object of the present invention is to provide a metal composite processing device that has both the advantages of laser cutting and electrical discharge machining.
課題を解決するための手段
レーザ切断加工機構と放電加工機構を一体に組付け、作
動をNC制御装置で制御するNCレーザ・放電複合加工
装置とした。Means for Solving the Problems A laser cutting mechanism and an electric discharge machining mechanism were assembled into one unit, and an NC laser/electric discharge combined machining device whose operation was controlled by an NC control device was created.
該装置は、レーザ切断加工の後、切断面に放電加工を実
施する工程実行手段を有するものとした。The apparatus has a process execution means for performing electric discharge machining on the cut surface after laser cutting.
作 用
レーザ切断機構は金属ワークの荒加工を行い、放電加工
機構はその仕上げ加工を行う。Operation: The laser cutting mechanism performs rough machining of metal workpieces, and the electrical discharge machining mechanism performs finishing machining.
工程実行手段はNC制御装置の制御によって、レーザ切
断加工の後に放電加工を連続させる。The process execution means continues electrical discharge machining after laser cutting under the control of the NC control device.
実施例
NCレーザ・放電複合加工装置1は、第1図のように機
械装置2に対し、レーザ発振装置3、放電加工用電源装
置4、加工液装置5およびNC制御装置6を組み合せた
構成を有する。Example NC laser/discharge combined machining device 1 has a configuration in which a laser oscillation device 3, a power source device 4 for electric discharge machining, a machining fluid device 5, and an NC control device 6 are combined with a mechanical device 2, as shown in FIG. have
機械装置2は、第2図に示すようにX軸テーブル、Y軸
テーブルからなるテーブル機構7と、Z軸方向の」二下
移動機構8を備え、X軸、Y軸、Z軸はそれぞれがサー
ボモータで駆動される。As shown in FIG. 2, the mechanical device 2 includes a table mechanism 7 consisting of an X-axis table and a Y-axis table, and a two-way movement mechanism 8 in the Z-axis direction, and the Driven by servo motor.
上下移動機構8の下端には放電加工用の電極ヘッド9と
レーザヘッド10が隣接して共に設けられている。レー
ザヘッド10はアシストガスの噴射機能を備え、また、
放電加工時に加工液のスプラッシュなどで汚染されない
よう保護筒により保護されている。なお、先端部は放電
加工時に加工液中に没しないよう、電極ヘッド9とほぼ
等しい上下位置にある。At the lower end of the vertical movement mechanism 8, an electrode head 9 and a laser head 10 for electrical discharge machining are provided adjacent to each other. The laser head 10 has an assist gas injection function, and
It is protected by a protective tube to prevent contamination from machining fluid splash during electrical discharge machining. Note that the tip portion is located at approximately the same vertical position as the electrode head 9 so as not to be submerged in machining fluid during electrical discharge machining.
符号11は加工槽でありテーブル機構7の上面に取付け
られている。符号12はビームダクトで内部に反射鏡を
備え、先端部はテレスコピックな補助ダクト13に形成
されている。補助ダクト13は上下移動機構8に固定さ
れ、これと共に移動する構造であり、その先端に前記の
レーザヘッド10が装着されている。Reference numeral 11 denotes a processing tank, which is attached to the upper surface of the table mechanism 7. Reference numeral 12 denotes a beam duct which is equipped with a reflecting mirror inside, and whose tip is formed into a telescopic auxiliary duct 13. The auxiliary duct 13 is fixed to the vertical movement mechanism 8 and is configured to move together with it, and the laser head 10 described above is attached to the tip of the auxiliary duct 13.
レーザ発振装置3は出力2KWの連続ビーム型C02ガ
スレーサ装置で市販のものであり、安定した強力なレー
ザビームを前記ビームダクト12に出力する。The laser oscillation device 3 is a commercially available continuous beam type C02 gas laser device with an output of 2 KW, and outputs a stable and powerful laser beam to the beam duct 12.
すなわち、レーザ発振装置3、ビームダクト12、レー
ザヘッド10、テーブル移動機構7および上下移動機構
8などでレーザ切断機構が構成されている。That is, the laser oscillation device 3, the beam duct 12, the laser head 10, the table moving mechanism 7, the vertical moving mechanism 8, and the like constitute a laser cutting mechanism.
放電加工用電源装置4は型彫り、あるいはワイヤカット
用に開発された公知のものであって、トランジスタによ
るパルス発生方式で所用電源QKV^のものである。パ
ルスは電極ヘッド9に加工用電力として供給される。The electric discharge machining power supply device 4 is a known device developed for die engraving or wire cutting, and uses a pulse generation method using a transistor and requires a power source QKV^. The pulses are supplied to the electrode head 9 as processing power.
すなわち、放電加工用電源装置4、電極ヘッド9、テー
ブル移動機構7および上下移動機構8などで放電加工機
構が構成されている。That is, the electric discharge machining mechanism is constituted by the power supply device 4 for electric discharge machining, the electrode head 9, the table moving mechanism 7, the vertical moving mechanism 8, and the like.
加工液装置5は放電加工に際して必要な加工液を加工槽
11に供給し、また、回収して前記加工槽を空にする能
力を備えると共に、放電加工中は加工液を濾過再生装置
を経由させて循環させる機能を備えている。The machining fluid device 5 has the ability to supply the machining fluid necessary for electrical discharge machining to the machining tank 11 and to recover the machining fluid to empty the machining tank. It has a function to circulate.
NC制御装置6は入・出力部、RAM、ROM、からな
るメモリ一部、プロセッサ一部および前記メモリ一部に
作動プログラムと加ニブログラムが格納された通常のも
のである。作動プログラムは加ニブログラムや各部に配
置したセンサーの信号あるいは外部から入力される指令
などのデータを処理し、NCレーザ・放電複合加工装置
Jの作動を全体的に管理するものであり、プロセッサ一
部を中心に基本的に第4図に示すようなフローの処理が
行なわれる。The NC control device 6 is a conventional one in which an input/output section, a memory part consisting of RAM and ROM, a processor part, and an operating program and a program are stored in the memory part. The operation program processes data such as the machine program, signals from sensors placed in various parts, and commands input from the outside, and manages the overall operation of the NC laser/discharge combined machining equipment J. The processing basically follows the flow shown in FIG. 4, centering on .
このフローては、レーザ切断加工(ステップ1)の後、
ワークを移動して前記の加工によるワークの切断面を放
電加工のための電極と正しく対応させ(ステップ2)、
加工槽5に加工液を満たしくステップ3)、型彫り揺動
放電加工(ステップ4)を行い、そして、放電加工終了
後に加工液を回収する(ステップ5)。In this flow, after laser cutting (step 1),
Move the workpiece so that the cut surface of the workpiece by the above-mentioned processing corresponds correctly to the electrode for electrical discharge machining (step 2),
The machining tank 5 is filled with machining fluid (step 3), die-sinking oscillating electrical discharge machining (step 4) is performed, and the machining fluid is recovered after the completion of electrical discharge machining (step 5).
なお、これら各ステップにおける具体的な処理はそれぞ
れ公知のレーザ切断加工、型彫り揺動放電加工と同じで
あり、ただ両加工が共通の作業プログラムおよび加ニブ
ログラムに基づき実行される。また、各ステップはその
終了信号によって順次シーケンシャルに進行される。こ
の進行を実行するプログラム部分および動作機構が工程
実行手段を構成している。It should be noted that the specific processing in each of these steps is the same as the well-known laser cutting processing and die-sinking oscillating electrical discharge machining, respectively, but both processing are executed based on a common work program and machine program. Furthermore, each step is sequentially progressed in response to its end signal. The program portion and operating mechanism that execute this progression constitute a process execution means.
加ニブログラムはワークに施す加工形状をデータと共に
記録したものである。The Kani program is a record of the machining shape applied to the workpiece along with data.
NC制御装置6は、入・出力部を介して前記の機械装置
2、レーザ発振装置3、放電加工用電源装置4および加
工液装置5と接続され、それぞれにおけるサーボモータ
の回転、発振や電源のON・OL” Fあるいは電磁弁
の開閉を制御するようになっている。The NC control device 6 is connected to the mechanical device 2, the laser oscillation device 3, the electric discharge machining power supply device 4, and the machining fluid device 5 through the input/output section, and controls the rotation and oscillation of the servo motor and the power supply in each. It is designed to control the opening and closing of ON/OL" F or solenoid valves.
今、ワーク14から第4図に示す半月形の精密な切抜き
孔(メス形)を加工する必要があるとき、NCレーザ・
放電複合加工装置1の電極ヘッド9に、第5図のような
切抜き孔と厳密に相似な半月形(オス形)であって、若
干小さめの型電極15を、加工図形と正確な位置関係に
配置して装着しておく。Now, when it is necessary to machine a precise half-moon-shaped cutout hole (female type) shown in Fig. 4 from the workpiece 14, the NC laser
A half-moon shaped (male) shaped electrode 15, which is exactly similar to the cutout hole as shown in FIG. Place and attach it.
なお、型電極1−5はワークと同じか若干大きめの厚さ
を備え、その周面が加工電極面となる。Note that the mold electrode 1-5 has the same thickness as the workpiece or is slightly larger, and its peripheral surface serves as the processing electrode surface.
また、型電極1−5と電極ヘッド9の固定は回転方向の
位置決めも可能なチャック方式となっている。Further, the mold electrode 1-5 and the electrode head 9 are fixed by a chuck method that also allows positioning in the rotational direction.
ワーク14をテーブル機構7に固定して複合加工装置1
を作動すると、装置1はまずレーザ切断加工モードとな
る。そして、作動プログラムにより、レーザヘッド10
の焦点位置がワーク14の表面上となる位置まで上下移
動機構8がZ軸に沿って下降され、ついで、加ニブログ
ラムに沿ってテーブル機構7を高速移動させながら、ア
シストガスの噴射とともにレーザ発振装置3からのビー
ムにより切断加工を行う。この加工はプログラムされた
加工通路からO,1mm幅の仕上げ取代を残した荒加工
に相当するものである。The workpiece 14 is fixed to the table mechanism 7 and the compound processing device 1
When activated, the device 1 first enters the laser cutting mode. Then, according to the operating program, the laser head 10
The vertical movement mechanism 8 is lowered along the Z-axis until the focal point is on the surface of the workpiece 14, and then, while moving the table mechanism 7 at high speed along the cannibal program, the laser oscillation device is injected with assist gas. The cutting process is performed using the beam from 3. This machining corresponds to rough machining that leaves a finishing allowance of 0.1 mm width from the programmed machining path.
切断加工が終了するとレーザ発振およびガスの供給が停
止されて一ヒ下移動機構8がホームポジションに戻され
、ついで、テーブル機構7がレーザヘッド10と電極ヘ
ッド9の位置ズレ分だけX軸、Y軸方向に移動して切断
加工されたワーク14を型電極15の下部に正しく配置
する。When the cutting process is completed, the laser oscillation and gas supply are stopped, and the one-step downward movement mechanism 8 is returned to the home position.Then, the table mechanism 7 is moved along the X-axis and Y-axis by the positional deviation between the laser head 10 and the electrode head 9. The workpiece 14 that has been cut by moving in the axial direction is placed correctly under the mold electrode 15.
ついで、加工液装置5の電磁弁が開かれて加工液が加工
槽1−1に供給され、ワーク14が加T、液中におかれ
る。Next, the electromagnetic valve of the machining fluid device 5 is opened, machining fluid is supplied to the machining tank 1-1, and the workpiece 14 is placed in the fluid at a temperature.
加工液の供給完了がレベルスイッチ等により確認される
と、複合装置1は揺動放電加工モードとなり、上下移動
機構をZ軸に沿って下降させて先端の型電極15をレー
ザ切断により切抜かれたワーク14の孔に配置する。放
電加工用電源装置4からパルス電力が電極15とワーク
1−4間に供給され、テーブル機構7は低速で電極15
とワーク14の間隔を放電の維持に必要な約20μに保
持しながらワーク14が0.5mmから0.6mmに至
る円揺動を行うよう駆動される。また、Z軸はワーク1
−4と型電極15との上下位置を維持して固定される。When the completion of supply of machining fluid is confirmed by a level switch or the like, the composite device 1 enters the swinging electric discharge machining mode, lowers the vertical movement mechanism along the Z axis, and cuts out the mold electrode 15 at the tip by laser cutting. It is placed in the hole of the workpiece 14. Pulse power is supplied from the electric discharge machining power supply 4 between the electrode 15 and the workpiece 1-4, and the table mechanism 7 moves the electrode 15 at a low speed.
The workpiece 14 is driven so as to perform a circular swing from 0.5 mm to 0.6 mm while maintaining the distance between the workpiece 14 and the workpiece 14 at about 20 μ, which is necessary to maintain the discharge. Also, the Z axis is work 1
-4 and the mold electrode 15 are fixed while maintaining their vertical positions.
すなわち、ワーク14における切抜き孔の切断面が型彫
り揺動放電加工により精密に仕上げられる。前記円揺動
の範囲は仕上げ代とレーザによる切り代(約0.5mm
)を基本にして算出されるものである。That is, the cut surface of the cutout hole in the workpiece 14 is precisely finished by die-sinking oscillating electrical discharge machining. The range of the circular oscillation is the finishing allowance and the laser cutting allowance (approximately 0.5 mm).
) is calculated based on the following.
放電加工が完了すると型電極15に対するパルス電力の
供給が停止し、上下移動機構8がホームポジョンに復帰
し、加工槽]1から加工液が回収されて一連の金属複合
加工が終了する。When the electric discharge machining is completed, the supply of pulsed power to the mold electrode 15 is stopped, the vertical movement mechanism 8 returns to the home position, the machining fluid is recovered from the machining tank 1, and the series of metal composite machining is completed.
以上のように、レーザ切断加工により不用部分を除去し
てから放電加工を行うので全体の加工時間は放電加工の
みによる場合の約50〜100分の1に短縮され、また
、レーザ切断加工の後、ワーク14と装置1との位置関
係を変更することなく放電加工による仕上げ加工を連続
して行えるから、位置ズレなどが無い。さらに加工面の
面粗さも放電加工によって2〜3分の1程度になる。形
状に関する加工精度は中程度であるが、量産品の製造に
は充分である。As mentioned above, since unnecessary parts are removed by laser cutting and then electrical discharge machining is performed, the overall machining time is shortened to about 1/50 to 100 of that by electrical discharge machining alone. Since finishing machining by electric discharge machining can be performed continuously without changing the positional relationship between the workpiece 14 and the apparatus 1, there is no positional deviation. Furthermore, the surface roughness of the machined surface is reduced to about 2 to 3 times by electrical discharge machining. Although the processing accuracy regarding the shape is medium, it is sufficient for manufacturing mass-produced products.
第6図は本発明に関する他の構成を示し、機械装置2に
おいて、ビームダクト12の先端にテレスコピックに設
けた補助ダクト13が着脱機構16を介して上下移動機
構8に取付けられている。FIG. 6 shows another configuration related to the present invention, in which an auxiliary duct 13 telescopically provided at the tip of the beam duct 12 is attached to the vertical movement mechanism 8 via an attachment/detachment mechanism 16 in the mechanical device 2.
着脱機構16は一種の電磁クラッチで作動プログラムに
よってNC制御装置からの指令で作動され、補助ダクト
13を上下移動機構8に機械的に連結(前記ステップ1
の開始時)したり解除(ステップ1の終了時)したりす
る。補助ダクト13は上方に付勢されていて連結が解除
されると上方のホームポジション位置に止どまるか復帰
する構造となっている。The attachment/detachment mechanism 16 is a type of electromagnetic clutch that is operated by a command from the NC control device according to an operation program, and mechanically connects the auxiliary duct 13 to the vertical movement mechanism 8 (step 1 above).
(at the start of step 1) or released (at the end of step 1). The auxiliary duct 13 is biased upward, and when the connection is released, the auxiliary duct 13 remains in the upper home position or returns to the upper home position.
この構造であると、前記補助ダクト13と上下移動機構
8との機械的結合を解除することにより、放電加工時に
レーザヘッド10が型電極15と共に下降して加工液中
に没してしまうなどの事故を防止することができる。逆
に、レーザ切断加工時には型電極15よりも下方にレー
ザヘッド10を配置して、該ヘッド10とワーク表面を
より近接させた配置としたことができる。With this structure, by releasing the mechanical connection between the auxiliary duct 13 and the vertical movement mechanism 8, it is possible to prevent the laser head 10 from descending together with the mold electrode 15 and being submerged in the machining fluid during electrical discharge machining. Accidents can be prevented. Conversely, during laser cutting, the laser head 10 can be placed below the mold electrode 15 so that the head 10 and the workpiece surface are closer to each other.
以上は実施例である。The above are examples.
型電極15は切抜き孔の形状に相似なものだけに限らな
い。例えば、前記相似形の一部を備えた、いわば部分電
極を複数種類準備し、孔の切断面に平行移動させる寄せ
放電加工で仕上げることもできる。さらに、切抜き孔の
形状に沿って移動できる程度の径を備えた丸棒電極を回
転させつつ、切断面に沿って移動させ、仕上げ加工をす
ることもできる。この場合、電極の移動は加ニブログラ
ムの移動データに電極径に関する補正など多少の修正を
加えることで可能である。The mold electrode 15 is not limited to one similar in shape to the cutout hole. For example, it is also possible to prepare a plurality of types of so-called partial electrodes, each having a part of the similar shape, and to finish the work by electric discharge machining in which the electrodes are moved parallel to the cut surface of the hole. Furthermore, finishing can be performed by moving a round rod electrode having a diameter large enough to move along the shape of the cut hole while rotating it. In this case, the electrode can be moved by making some corrections, such as correction regarding the electrode diameter, to the movement data of the cannibalogram.
なお、形状が前記の半月形のような場合、両端の尖鋭部
をシャープに仕上げる必要のあるときは、該尖鋭部の形
に合致した部分電極を先端側に向けて寄せ加工を行う。In addition, when the shape is like the above-mentioned half-moon shape, when it is necessary to sharpen the sharp parts at both ends, the partial electrode that matches the shape of the sharp parts is brought closer toward the tip side.
また、仕上げ取代、揺動の範囲、寄せの寸法などは任意
であり、レーサ切断加工と放電加工の双方に適宜な値を
選択する。Further, the finishing allowance, the range of swing, the size of the offset, etc. are arbitrary, and appropriate values are selected for both laser cutting and electrical discharge machining.
ワーク14に対し、レーザヘッド14、電極15側を加
ニブログラムにより移動させることもある。The laser head 14 and electrode 15 side may be moved with respect to the workpiece 14 using a nitrogram.
型電極5の周面に突条を設けておき、切抜き孔の周面に
凹溝を巡らすなどの特殊な加工を一挙に行うこともある
。A protrusion may be provided on the circumferential surface of the mold electrode 5, and special processing such as forming a groove around the circumferential surface of the cutout hole may be performed all at once.
放電加工工程はワイヤカット放電でも可能である。この
場合においても荒加工はレーザ切断によ1
2
り素早く行なわれるので、全体としての加工時間は短縮
され、またその切断面はワイヤカット放電加工の仕上げ
工程により精密に仕上げられる。The electric discharge machining process can also be performed by wire cut electric discharge. Even in this case, the rough machining is quickly performed by laser cutting, so the overall machining time is shortened, and the cut surface is precisely finished by the finishing process of wire-cut electrical discharge machining.
発明の効果
複雑な形状の切断加工を、切断面の面粗さを改善して、
量産的に行うことができる。Effects of the invention: Cutting of complex shapes can be done by improving the surface roughness of the cut surface.
It can be mass-produced.
第1図は構成のブロック図、第2図は機械装置の斜視図
、第3図は処理の基本的なフロー図、第4図はワークの
斜視図(荒加工後)、第5図は型電極の斜視図、第6図
は機械装置の他の構成例を示す斜視図である。
1・・・NCレーザ・放電複合加工装置、7・・・テー
ブル機構、8・・・上下移動機構、9・・・電極ヘッド
、10・・・レーザヘッド、14・・・ワーク、15・
・・型電極、16・・・着脱機構。
3
48−
−150=Figure 1 is a block diagram of the configuration, Figure 2 is a perspective view of the mechanical equipment, Figure 3 is a basic flow diagram of processing, Figure 4 is a perspective view of the workpiece (after rough machining), and Figure 5 is the mold. A perspective view of the electrode, and FIG. 6 is a perspective view showing another example of the structure of the mechanical device. DESCRIPTION OF SYMBOLS 1... NC laser/discharge combined processing device, 7... Table mechanism, 8... Vertical movement mechanism, 9... Electrode head, 10... Laser head, 14... Work, 15...
... type electrode, 16... attachment/detachment mechanism. 3 48- -150=
Claims (3)
放電加工機構を備え、レーザ切断加工の後、切断面に放
電加工を実施する工程実行手段を有することを特徴とし
たNCレーザ・放電複合加工装置。(1) An NC laser/discharge composite comprising a laser cutting mechanism and an electric discharge machining mechanism controlled by an NC control device, and a process execution means for performing electric discharge machining on the cut surface after the laser cutting process. Processing equipment.
構の電極ヘッドが、同一の上下移動機構に取付けられた
構造を持つことを特徴とした特許請求の範囲第1項に記
載のNCレーザ・放電複合加工装置。(2) The NC laser/discharge according to claim 1, wherein the laser head of the laser cutting mechanism and the electrode head of the electric discharge machining mechanism have a structure in which they are attached to the same vertical movement mechanism. Composite processing equipment.
け構造が、該ヘッドを上下移動機構へ機械的に分離、結
合する着脱手段を有することを特徴とした特許請求の範
囲第2項に記載のNCレーザ・放電複合加工装置。(3) The attachment structure for attaching the laser head to the vertical movement mechanism has attachment/detachment means for mechanically separating and coupling the head to the vertical movement mechanism. NC laser/discharge combined machining equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2047253A JPH03251323A (en) | 1990-03-01 | 1990-03-01 | Nc laser/electrical discharging composite machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2047253A JPH03251323A (en) | 1990-03-01 | 1990-03-01 | Nc laser/electrical discharging composite machining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03251323A true JPH03251323A (en) | 1991-11-08 |
Family
ID=12770105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2047253A Pending JPH03251323A (en) | 1990-03-01 | 1990-03-01 | Nc laser/electrical discharging composite machining device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03251323A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2389554A (en) * | 2002-06-12 | 2003-12-17 | Alstom | Machining apparatus and a method for machining |
| US7411150B2 (en) | 2002-06-12 | 2008-08-12 | Alstom Technology Ltd. | Method of producing a composite component |
| CN103817389A (en) * | 2014-02-17 | 2014-05-28 | 中国矿业大学 | Holographic laser micro electrochemical machining method and device thereof |
| CN104014880A (en) * | 2014-05-22 | 2014-09-03 | 西安交通大学 | Laser-electrolysis composite machining device and method of tiny holes in non-recast layer |
| CN104942449A (en) * | 2015-06-18 | 2015-09-30 | 江苏塞维斯数控科技有限公司 | Laser cutting machine head with protecting device |
| CN109648189A (en) * | 2019-03-14 | 2019-04-19 | 常州江苏大学工程技术研究院 | A kind of laser electric spark complex machining device and its working method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6239933B2 (en) * | 1982-09-11 | 1987-08-26 | Toyoda Gosei Kk | |
| JPS63312027A (en) * | 1987-06-12 | 1988-12-20 | レイコン・テクストロン・インコーポレイテッド | Boring method and device by laser and electric discharge machining |
-
1990
- 1990-03-01 JP JP2047253A patent/JPH03251323A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6239933B2 (en) * | 1982-09-11 | 1987-08-26 | Toyoda Gosei Kk | |
| JPS63312027A (en) * | 1987-06-12 | 1988-12-20 | レイコン・テクストロン・インコーポレイテッド | Boring method and device by laser and electric discharge machining |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2389554A (en) * | 2002-06-12 | 2003-12-17 | Alstom | Machining apparatus and a method for machining |
| US7411150B2 (en) | 2002-06-12 | 2008-08-12 | Alstom Technology Ltd. | Method of producing a composite component |
| CN103817389A (en) * | 2014-02-17 | 2014-05-28 | 中国矿业大学 | Holographic laser micro electrochemical machining method and device thereof |
| CN103817389B (en) * | 2014-02-17 | 2016-08-24 | 中国矿业大学 | A kind of holographic laser electrochemical micromachining method and device thereof |
| CN104014880A (en) * | 2014-05-22 | 2014-09-03 | 西安交通大学 | Laser-electrolysis composite machining device and method of tiny holes in non-recast layer |
| CN104014880B (en) * | 2014-05-22 | 2017-04-26 | 西安交通大学 | Laser-electrolysis composite machining device and method of tiny holes in non-recast layer |
| CN104942449A (en) * | 2015-06-18 | 2015-09-30 | 江苏塞维斯数控科技有限公司 | Laser cutting machine head with protecting device |
| CN109648189A (en) * | 2019-03-14 | 2019-04-19 | 常州江苏大学工程技术研究院 | A kind of laser electric spark complex machining device and its working method |
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