JPH0326033U - - Google Patents
Info
- Publication number
- JPH0326033U JPH0326033U JP8669389U JP8669389U JPH0326033U JP H0326033 U JPH0326033 U JP H0326033U JP 8669389 U JP8669389 U JP 8669389U JP 8669389 U JP8669389 U JP 8669389U JP H0326033 U JPH0326033 U JP H0326033U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- case
- relay
- relay body
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は、本考案よりなるリレーの実施例を示
した構成説明図、第２図はそのケースのみの横断
面図、第３図はリレーをプリント基板に取付けた
状態の説明図、第４図及び第５図は本考案の他の
実施例を示した説明図、第６図は従来例の説明図
である。
７……ケース、７ｈ……硬質樹脂層、７ｓ……
軟質樹脂層、８……プリント基板。
Fig. 1 is a configuration explanatory diagram showing an embodiment of the relay according to the present invention, Fig. 2 is a cross-sectional view of only the case, Fig. 3 is an explanatory diagram of the relay mounted on a printed circuit board, and Fig. 4 5 and 5 are explanatory diagrams showing other embodiments of the present invention, and FIG. 6 is an explanatory diagram of a conventional example. 7...Case, 7h...Hard resin layer, 7s...
Soft resin layer, 8...Printed circuit board.
Claims (1)
されかつ、該リレー本体に接続された端子９が他
側に貫通突出された基板１と、該基板の外周に開
口縁７′が嵌着されたカツプ状ケース７とを備え
た電磁リレーにおいて、前記ケース７を、軟質樹
脂層７ｓ及び硬質樹脂層７ｈの２層に形成すると
共に、該軟質樹脂層７ｓを前記ケース７の開口縁
７′にて前記硬質樹脂層７ｈより突出させ、前記
基板１の他側に張り出すように形成したことを特
徴とする電磁リレー。 A relay body 6, a board 1 to which the relay body 6 is fixed on one side and a terminal 9 connected to the relay body protrudes through the other side, and an opening edge 7' fitted around the outer periphery of the board. In the electromagnetic relay equipped with a cup-shaped case 7, the case 7 is formed of two layers, a soft resin layer 7s and a hard resin layer 7h, and the soft resin layer 7s is formed on the opening edge 7' of the case 7. An electromagnetic relay characterized in that it is formed so as to protrude from the hard resin layer 7h and extend to the other side of the substrate 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8669389U JPH0326033U (en) | 1989-07-24 | 1989-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8669389U JPH0326033U (en) | 1989-07-24 | 1989-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0326033U true JPH0326033U (en) | 1991-03-18 |
Family
ID=31636307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8669389U Pending JPH0326033U (en) | 1989-07-24 | 1989-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0326033U (en) |
-
1989
- 1989-07-24 JP JP8669389U patent/JPH0326033U/ja active Pending