JPH03263473A - Corrosion-proof and moistureproof insulating coating composition and production of mounted circuit-board subjected to corrosion-proof and moistureproof insulation treatment - Google Patents
Corrosion-proof and moistureproof insulating coating composition and production of mounted circuit-board subjected to corrosion-proof and moistureproof insulation treatmentInfo
- Publication number
- JPH03263473A JPH03263473A JP23512790A JP23512790A JPH03263473A JP H03263473 A JPH03263473 A JP H03263473A JP 23512790 A JP23512790 A JP 23512790A JP 23512790 A JP23512790 A JP 23512790A JP H03263473 A JPH03263473 A JP H03263473A
- Authority
- JP
- Japan
- Prior art keywords
- proof
- corrosion
- mounted circuit
- moistureproof
- triazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 13
- 239000008199 coating composition Substances 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical class C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920001577 copolymer Polymers 0.000 claims abstract description 7
- 230000009477 glass transition Effects 0.000 claims abstract description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000012964 benzotriazole Substances 0.000 claims abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 125000005907 alkyl ester group Chemical group 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 8
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 abstract description 3
- 125000000217 alkyl group Chemical group 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 abstract 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 150000003852 triazoles Chemical class 0.000 abstract 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、防錆防湿絶縁塗料組成物および防錆防湿絶縁
処理された実装回路板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a rust-proofing, moisture-proofing insulating coating composition and a method for producing a mounted circuit board subjected to rust-proofing, moisture-proofing and insulation treatment.
（従来の技術）
従来、ガラス−エポキシ樹脂１紙−フェノール樹脂など
の積層板に配線図が印刷され、マイコン。(Prior Art) Conventionally, wiring diagrams have been printed on a laminated board of glass, epoxy resin, paper, and phenol resin, etc., for microcontrollers.
抵抗体、コンデンサなどの各種電子部品が搭載された実
装回路板は、湿気、はこシなどから保護する目的で絶縁
処理が行われている。該絶縁処理方法には、アクリル樹
脂およびシリコーン樹脂を溶剤に溶解した防湿絶縁塗料
で保護コーティングする方法が広く採用されている。Mounted circuit boards equipped with various electronic components such as resistors and capacitors are insulated to protect them from moisture and dust. As the insulation treatment method, a method of protective coating with a moisture-proof insulation paint made by dissolving acrylic resin and silicone resin in a solvent is widely adopted.
このような実装回路板は、過酷な環状下、特に高湿度下
で使用され１例えば自動車、洗濯機などの機器に搭載さ
れて使用される。Such a mounted circuit board is used under harsh conditions, particularly under high humidity conditions, and is mounted on equipment such as automobiles and washing machines.
（発明が解決しようとする課題）
しかしながら、従来の実装回路板用防湿絶縁塗料組成物
は、搭載電子部品のリード線の防湿絶縁及び補強には有
効であったが塩害及び硫化水素ガス、亜硫酸ガス等のガ
スに対する防錆効果が低く。(Problems to be Solved by the Invention) However, although conventional moisture-proof insulating paint compositions for mounted circuit boards are effective for moisture-proof insulation and reinforcement of lead wires of mounted electronic components, they do not suffer from salt damage and hydrogen sulfide gas, sulfur dioxide gas. It has low rust prevention effect against gases such as.
実装回路板の金属面が腐食する問題があった。There was a problem that the metal surface of the mounted circuit board corroded.
本発ＢＡｈ、 このような従来技術の欠点を改良して
、信頼性の高い実装回路板を得ることができる防錆防湿
絶縁塗料組成物およびこノ“１．を用いた防錆防湿絶縁
処理された実装回路板の製造法を提供することにある。The present BAh is a rust-proof and moisture-proof insulating coating composition that can improve the shortcomings of the conventional technology and obtain a highly reliable mounted circuit board, and a rust-proof and moisture-proof insulation treatment using this "1." An object of the present invention is to provide a method for manufacturing a mounted circuit board.
（課題を解決−するだめの手段）
本発明け、 Ａ）ガラス転移点が０−ＳＯ℃の″アクリ
ル酸のアルキルエステル及び／又はメタクリル酸のアル
ギルニスデルの重合体又はとれらの共重合体を１００重
葉部ならびに１３）ベンゾｈ ＩＪアゾール、１，２，
４−トリアゾールおよび１．λ４−トリアゾール誘導体
からなる群から選ばノ′する少なくとも】種類を０．０
１〜５重量部含む防錆防湿絶縁塗料組成物さらにこの防
錆防湿絶縁塗料組成物で、実装回路板を塗装処理シフ、
乾燥させる防錆防湿絶縁処理された実装回路板の製造法
に関する。(Solving the Problem - Means to Solve the Problem) The present invention provides: A) A polymer of acrylic acid alkyl ester and/or methacrylic acid argylnisder or a copolymer thereof having a glass transition point of 0-SO°C. heavy leaf part and 13) benzo h IJ azole, 1,2,
4-triazole and 1. λ4-triazole derivatives selected from the group consisting of at least 0.0
A rust-preventing, moisture-proofing insulating paint composition containing 1 to 5 parts by weight.
The present invention relates to a method for producing a mounted circuit board that is dried and subjected to rust-proofing, moisture-proofing and insulation treatment.
本発明におけるＡ）成分のガラス転移点＜Ｔｇ）が０〜
８０℃の上記の重合体又は共重合体は公知の重合体であ
り、既に知られた方法で製造されるものである。The glass transition point <Tg) of component A) in the present invention is from 0 to
The above-mentioned polymer or copolymer at 80° C. is a known polymer and can be produced by a known method.
゛アクリル酸のアルキルエステル及びメタクリル酸のア
ルギルエステルとしでは１例えば゛アクリル酸メチル、
アクリル酸１丁プル、アクリル酸ブチル。Examples of the alkyl esters of acrylic acid and the algyl esters of methacrylic acid include methyl acrylate,
1 block of acrylic acid, butyl acrylate.
メタクリル酸メザル、メタクリル酸丁チル、メタクリル
酸ブグル等があげられるがこれらに制限されるものでは
ない。アクリル酸のアルキルニスデルとメタクリル酸の
アルギルニスデルとの共重合体も用いられる。アクリル
酸の”アルキルニスカル又はメタクリル酸の′アルキル
エステルの重合体又はこれらの共重合体のガラス転移点
が０℃未満であると乾燥後にべたつきが残シ、まｆｃ、
８０℃を越えると塗膜が硬くなり、剥離やクラックが生
じやすくなる。好ましいガラス転移点は５〜３０℃の範
囲とされる。Examples include, but are not limited to, mesal methacrylate, clotyl methacrylate, and bugul methacrylate. Copolymers of alkyl nisder of acrylic acid and argyl nisder of methacrylic acid are also used. If the glass transition point of the alkyl ester of acrylic acid or the alkyl ester of methacrylic acid or a copolymer thereof is lower than 0°C, stickiness may remain after drying.
When the temperature exceeds 80°C, the coating film becomes hard and peels and cracks easily occur. A preferable glass transition point is in the range of 5 to 30°C.
本発明のＢ）成分の１．２．４−１！Ｊアゾ一ル誘導体
としては、−形式（１）
（ｆｒ、だし、Ｒ，およびＲ′は水素または−ＮＨ２で
あり。1.2.4-1 of B) component of the present invention! As the J azoyl derivative, -Form (1) (fr, dashi, R, and R' are hydrogen or -NH2.
１（と１ｔ′は同一・でも異ってもよい。ただしＲおよ
びＲ′が共に水素である場合を除く）であられされる化
合物であり、３−アミノ−１，２，４，−トリアゾール
、３，５．−ジ′γミノ−１，２，４−トリアゾール等
がある。1 (and 1t' may be the same or different, except when R and R' are both hydrogen), and 3-amino-1,2,4-triazole, 3,5. -di'γmino-1,2,4-triazole and the like.
上記Ａ）成分とＢ）成分との配合比は、Ａ）成分１００
重量部に対してＢ）成分が０４０１〜５重量部とされ。The blending ratio of the above A) component and B) component is 100% of A) component.
The amount of component B) is 0401 to 5 parts by weight.
Ｂ）成分は好まし、＜ｊ’１０．０５〜３重量部とされ
る。Component B) is preferably <j'10.05 to 3 parts by weight.
Ｂ）成分が０゜０１重量部未満では防錆効果が少なく。If component B) is less than 0.01 parts by weight, the antirust effect will be low.
５重量部を越えると効果はあオ勺かわらない。If it exceeds 5 parts by weight, the effect will not change.
本発明になる防錆防湿絶縁塗料組成物は、トルエン、ギ
シレンなどの芳香族系溶剤、酢酸エチル。The rust-proofing and moisture-proofing insulating coating composition according to the present invention uses aromatic solvents such as toluene and pyclene, and ethyl acetate.
酢酸ブチルなどのエステル系溶剤、メチルエチルケトン
、アセトンなどのケトン系溶剤等の溶剤。Solvents such as ester solvents such as butyl acetate, ketone solvents such as methyl ethyl ketone and acetone.
顔料、染料などを必要に応じて含有［７てもよい。Pigments, dyes, etc. may be contained as necessary [7].
上記の溶剤等の成分は、塗料組成物に通常用いられる量
で用いられ、その使用量には特に制限はない。The above-mentioned components such as the solvent are used in amounts normally used in coating compositions, and there are no particular restrictions on the amounts used.
防錆防湿絶縁処理された実装回路板は１本発明の前記塗
料組成物を実装回路板に、）・ケ塗り、浸漬、スブｔ・
・−などの塗布方法で塗布シフ、常温であへ
るいは加熱し７て乾燥することにより得られる。The mounted circuit board that has been subjected to rust-proofing and moisture-proofing insulation treatment is prepared by applying the coating composition of the present invention to the mounting circuit board by coating, dipping, or substituting.
It can be obtained by applying a coating method such as ・- or by heating and drying at room temperature.
（実施例）
次に本発明を実施例によりさらに詳ｊ〜〈説明するが１
本発明はこれらに制限されるものではない。(Example) Next, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these.
なお１部、チとあるのは重葉部１重量％である。Note that 1 part and 1 are 1% by weight of the heavy leaf part.
実施例
アクリル重合体の合成
メタクリル酸ブチル２１４部、アクリル酸ブチル２５部
およびトルエン１５０部を１１の四つロセバラブルフラ
スコに仕込み窒素ガスを通しながら９０℃まで昇温し保
温する。これにメタクリル酸ブチル２００部、アクリル
酸ブチル２１部、アゾビスインブチロニトリル３部を混
合溶解して溶液を２時間で滴下しながら重合を進める。Example Synthesis of Acrylic Polymer 214 parts of butyl methacrylate, 25 parts of butyl acrylate and 150 parts of toluene were placed in a four-piece rosemovable flask (No. 11), heated to 90° C. and maintained while passing nitrogen gas. 200 parts of butyl methacrylate, 21 parts of butyl acrylate, and 3 parts of azobisin butyronitrile were mixed and dissolved in this, and the solution was added dropwise over 2 hours to proceed with polymerization.
その後１１０℃に昇温し、２時間保温し１重合を完了さ
せた後冷却し５０℃になったらトルエン２００部を仕込
み１０分間攪拌し均一溶液とした。Thereafter, the temperature was raised to 110°C, maintained for 2 hours to complete one polymerization, and then cooled. When the temperature reached 50°C, 200 parts of toluene was added and stirred for 10 minutes to form a homogeneous solution.
この溶液を用いて２５μのフィルムを作りガラス転移点
（Ｔｇ ）をＴＭＳ ｆ熱的物理試験機）のペネトレー
ション法により測定したところ１２℃で６
あった。A 25μ film was made using this solution and its glass transition point (Tg) was measured at 12°C by the penetration method using a TMS (thermal physical tester).
表ＩＫ示す実施例１，２．３および比較例１゜２の配合
（数字の単位は部である）で防錆防湿絶縁塗料組成物を
得、これにガラスエポキシ鋼張積層板に配線図が印刷さ
れ、ＩＣ，コンデンサなどの各種電子部品が搭載された
実装回路板を各２枚浸漬塗布して５０℃で１時間乾燥さ
せた。その後。A rust-proof and moisture-proof insulating paint composition was obtained using the formulations of Examples 1, 2.3 and Comparative Example 1゜2 (numbers are in parts) shown in Table IK, and a wiring diagram was applied to a glass-epoxy steel-clad laminate. Two printed printed circuit boards each equipped with various electronic components such as ICs and capacitors were dip-coated and dried at 50° C. for 1 hour. after that.
各１枚の防錆防湿絶縁処理された実装回路板を５チ塩化
す） ＩＪウム水溶液が入っている温度３５℃雰囲気の
デシケータ内に放置し表に示す時間経過後に実装回路板
の組成物を通して観察される銅の回路部の錆の発生状態
を肉眼で観察した。また。Each one of the mounted circuit boards treated with anti-rust and moisture-proof insulation was left in a desiccator containing an IJium aqueous solution at a temperature of 35°C, and after the time shown in the table had passed, the composition of the mounted circuit board was passed through. The state of rust on the observed copper circuit was observed with the naked eye. Also.
もう１枚の防錆防湿絶縁処理された実装回路板を硫化水
素ガスの濃度が１００ ｐｐｍに設定された２５℃の雰
囲気のデシケータ内に放置し表に示す時間経過後に実装
回路板の組成物を通して観察される銅の回路部の錆の発
生状態を肉眼で観察した。Another mounted circuit board treated with anti-rust and moisture-proof insulation was left in a desiccator in an atmosphere at 25°C with a hydrogen sulfide gas concentration of 100 ppm, and after the time shown in the table had passed, the composition of the mounted circuit board was passed through. The state of rust on the observed copper circuit was observed with the naked eye.
表１ ＊１ 錆発生状態二〇錆発生なし △錆一部発生 ×錆全面発生 ＊２ 無処理の実装回路板を用いた。Table 1 *1 Rust occurrence status 20 No rust occurrence △Some rust occurs × Rust occurs all over *2 An untreated mounted circuit board was used.
（発明の効果） 本発明になる防錆防湿絶縁塗料組成物によシ。(Effect of the invention) According to the rust-proofing and moisture-proofing insulating coating composition of the present invention.
実装回路板の防湿絶縁と共に錆の発生を防止でき。It can prevent the occurrence of rust along with moisture-proof insulation of the mounted circuit board.
信頼性が向上された実装回路板を得ることができ７−A mounted circuit board with improved reliability can be obtained7-
Claims (1)
キルエステル及び／又はメタクリル酸のアルキルエステ
ルの重合体又はこれらの共重合体を１００重量部ならび
にＢ）ベンゾトリアゾール、１，２，４−トリアゾール
および１，２，４−トリアゾール誘導体からなる群から
選ばれる少なくとも１種類を０．０１〜５重量部含む防
錆防湿絶縁塗料組成物。 ２、請求項１記載の防錆防湿絶縁塗料組成物で実装回路
板を塗装処理し、乾燥させることを特徴とする防錆防湿
絶縁処理された実装回路板の製造法。[Claims] 1. A) 100 parts by weight of a polymer of an alkyl ester of acrylic acid and/or an alkyl ester of methacrylic acid having a glass transition point of 0 to 80°C, or a copolymer thereof, and B) benzotriazole. , 1,2,4-triazole and 1,2,4-triazole derivatives in an amount of 0.01 to 5 parts by weight of at least one member selected from the group consisting of 1,2,4-triazole and 1,2,4-triazole derivatives. 2. A method for producing a mounted circuit board subjected to a rust-proofing, moisture-proofing and insulation treatment, which comprises painting the mounted circuit board with the rust-proofing and moisture-proofing insulating coating composition according to claim 1, and drying the coated circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2465590 | 1990-02-02 | ||
| JP2-24655 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03263473A true JPH03263473A (en) | 1991-11-22 |
Family
ID=12144161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23512790A Pending JPH03263473A (en) | 1990-02-02 | 1990-09-05 | Corrosion-proof and moistureproof insulating coating composition and production of mounted circuit-board subjected to corrosion-proof and moistureproof insulation treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03263473A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018009108A (en) * | 2016-07-14 | 2018-01-18 | ユケン工業株式会社 | Anti-corrosion coating solution |
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|---|---|---|---|---|
| JPS5247032A (en) * | 1975-10-11 | 1977-04-14 | Mitsubishi Monsanto Chem Co | Synthetic resin composition for coating metal |
| JPS5824270A (en) * | 1981-08-05 | 1983-02-14 | Canon Inc | Electrophotographing device |
| JPS59171646A (en) * | 1983-03-19 | 1984-09-28 | 住友金属工業株式会社 | Temporary rust-prevention treated steel pipe |
| JPS6067681A (en) * | 1983-09-20 | 1985-04-18 | Sumitomo Chem Co Ltd | Corrosion-proof method of prestressed concrete |
| JPS60219268A (en) * | 1984-04-14 | 1985-11-01 | Denki Kagaku Kogyo Kk | Coating resin composition and coating method |
| JPS60260662A (en) * | 1984-06-08 | 1985-12-23 | Toagosei Chem Ind Co Ltd | Corrosion-preventive composition |
| JPS61223061A (en) * | 1985-03-28 | 1986-10-03 | Japan Exlan Co Ltd | Aqueous antifouline coating compound |
| JPS62236872A (en) * | 1986-04-08 | 1987-10-16 | Hitachi Chem Co Ltd | Rust-rpeventive and moistureproof insulating coating composition for metallic circuit board |
| JPS6339969A (en) * | 1986-08-02 | 1988-02-20 | Aisin Chem Co Ltd | Acrylic baking paint composition |
| JPS63199772A (en) * | 1987-02-17 | 1988-08-18 | Toagosei Chem Ind Co Ltd | Corrosion-preventive composition |
| JPH01172472A (en) * | 1987-12-28 | 1989-07-07 | Nippon Paint Co Ltd | Coating-type chromate film treating agent |
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1990
- 1990-09-05 JP JP23512790A patent/JPH03263473A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247032A (en) * | 1975-10-11 | 1977-04-14 | Mitsubishi Monsanto Chem Co | Synthetic resin composition for coating metal |
| JPS5824270A (en) * | 1981-08-05 | 1983-02-14 | Canon Inc | Electrophotographing device |
| JPS59171646A (en) * | 1983-03-19 | 1984-09-28 | 住友金属工業株式会社 | Temporary rust-prevention treated steel pipe |
| JPS6067681A (en) * | 1983-09-20 | 1985-04-18 | Sumitomo Chem Co Ltd | Corrosion-proof method of prestressed concrete |
| JPS60219268A (en) * | 1984-04-14 | 1985-11-01 | Denki Kagaku Kogyo Kk | Coating resin composition and coating method |
| JPS60260662A (en) * | 1984-06-08 | 1985-12-23 | Toagosei Chem Ind Co Ltd | Corrosion-preventive composition |
| JPS61223061A (en) * | 1985-03-28 | 1986-10-03 | Japan Exlan Co Ltd | Aqueous antifouline coating compound |
| JPS62236872A (en) * | 1986-04-08 | 1987-10-16 | Hitachi Chem Co Ltd | Rust-rpeventive and moistureproof insulating coating composition for metallic circuit board |
| JPS6339969A (en) * | 1986-08-02 | 1988-02-20 | Aisin Chem Co Ltd | Acrylic baking paint composition |
| JPS63199772A (en) * | 1987-02-17 | 1988-08-18 | Toagosei Chem Ind Co Ltd | Corrosion-preventive composition |
| JPH01172472A (en) * | 1987-12-28 | 1989-07-07 | Nippon Paint Co Ltd | Coating-type chromate film treating agent |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018009108A (en) * | 2016-07-14 | 2018-01-18 | ユケン工業株式会社 | Anti-corrosion coating solution |
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