JPH032650U - - Google Patents

Info

Publication number
JPH032650U
JPH032650U JP1989062120U JP6212089U JPH032650U JP H032650 U JPH032650 U JP H032650U JP 1989062120 U JP1989062120 U JP 1989062120U JP 6212089 U JP6212089 U JP 6212089U JP H032650 U JPH032650 U JP H032650U
Authority
JP
Japan
Prior art keywords
integrated circuit
resin
semiconductor integrated
sealed semiconductor
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989062120U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989062120U priority Critical patent/JPH032650U/ja
Publication of JPH032650U publication Critical patent/JPH032650U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図ａは、本考案による第１の実施例を示す
正面図、第１図ｂは第１図ａの側面図、第２図ａ
は本考案による第２の実施例を示す正面図、第２
図ｂは第２図ａの側面図である。 １０，２０……パツケージ、１１，２１……外
部端子、１２，１３，２２，２３……樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止された半導体集積回路において、外部
    端子が取り出されているパツケージ面の端子周囲
    の樹脂量を他のパツケージ面より減らすか或いは
    多くして成形していることを特徴とする樹脂封止
    半導体集積回路。
JP1989062120U 1989-05-29 1989-05-29 Pending JPH032650U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062120U JPH032650U (ja) 1989-05-29 1989-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062120U JPH032650U (ja) 1989-05-29 1989-05-29

Publications (1)

Publication Number Publication Date
JPH032650U true JPH032650U (ja) 1991-01-11

Family

ID=31590981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062120U Pending JPH032650U (ja) 1989-05-29 1989-05-29

Country Status (1)

Country Link
JP (1) JPH032650U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165836A (ja) * 2010-02-09 2011-08-25 Mitsubishi Electric Corp 電力用半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165836A (ja) * 2010-02-09 2011-08-25 Mitsubishi Electric Corp 電力用半導体装置

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