JPH03270016A - Cleaning apparatus for semiconductor wafer container - Google Patents

Abstract

PURPOSE:To prevent that dust particles in a wafer container are produced and that a partial cleaning residue is caused by a method wherein a movable arm provided with a high-pressure-water spraying movable nozzle spraying the high-pressure water is set in a prescribed position and at a prescribed direction, the position and the direction are stored and an arm driving operation is controlled. CONSTITUTION:A wafer container 6 as an object to be cleaned is placed on a wafer container holder 7; the high-pressure-water which has been pressurized by a plurality of high-pressure-water spraying fixed nozzles 9 is sprayed to the surface of the wafer container 6. For parts where the sprayed high-pressure water is hard to reach, such as inner corner parts and the like of the wafer container 6, the position and the direction of a movable arm 4 and a high- pressure-water spraying movable nozzle 3 are adjusted so as to obtain an optimum cleaning effect; the high-pressure water is sprayed from the movable nozzle 3. Thereby, it is possible to prevent a cleaning residue from being caused even in the wafer container 6 whose shape is complicated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device for semiconductor wafer storage containers, and more particularly to a cleaning device for semiconductor wafer storage containers used in the manufacturing process of semiconductor devices.

[Conventional technology]

Conventionally, this type of semiconductor wafer storage container cleaning equipment (hereinafter referred to as cleaning equipment) has been divided into a cleaning equipment that uses a rotating brush 12 to scrub away dirt, as shown in FIG. 2, and a cleaning equipment as shown in FIG. In addition, a cleaning device that uses a high-pressure water jet fixed nozzle 22 to blow away dirt has been put into practical use.

Representative examples of each cleaning device will be explained with reference to the drawings.

The cleaning device shown in FIG. 2 consists of a rotating resin rotating brush 1
2 and an arm 13 that supports it. Wafer storage container 6
wafer storage container holder 7 that holds the wafer storage container holder 7, washing nozzle 1
As the arm 13 moves, the resin rotating brush 12 scrubs the surface of the wafer storage container 6, and furthermore, it has the function of removing attached particles, dirt, etc. by washing with water. .

The cleaning apparatus shown in FIG. 3 has a plurality of high-pressure water jet fixed nozzles 22 and a wafer storage container holder 7 that holds a wafer storage container 6 installed in a cleaning chamber 21, and uses a separately installed pressure tank 25 to generate high pressure. It has the function of supplying water to the high-pressure water jet fixed nozzle 22 and jetting it into the wafer storage container 7 to remove particles, dirt, etc. attached to the surface of the wafer storage container 7.

[Problem to be solved by the invention]

However, the above-mentioned brush type cleaning device damages resin wafer storage containers, which are currently widely used, due to the pressure of the brush, and conversely generates a large amount of dust.

On the other hand, in a high-pressure water jet nozzle type cleaning device, it is necessary to narrow the jet nozzle to obtain a high-pressure jet, and furthermore, depending on the angle of the jet, the area directly hit by the jet is severely restricted, resulting in cleaning residue.

An object of the present invention is to provide a cleaning device that does not generate dust or cleaning residue.

[Means to solve the problem]

The present invention provides a cleaning device for a semiconductor wafer storage container used in the manufacturing process of semiconductor devices, including a movable arm having a movable high-pressure water jet nozzle that sprays high-pressure water, and a movable arm that moves the movable arm in a predetermined position and direction. The arm drive mechanism includes an arm drive mechanism for setting, and an arm drive mechanism control section that stores the position and direction and controls the arm drive mechanism.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram of an embodiment of the present invention.

As shown in FIG. 1, the cleaning device 1 includes a movable arm 4 installed in a cleaning chamber 2, whose position is controlled by an arm drive mechanism 5 and an arm drive mechanism control section 8, and which has a movable high-pressure water jet nozzle 3 at its tip. There is. Furthermore, a wafer storage container holder 7 holds a wafer storage container 6 which is an object to be cleaned.
The cleaning tamper 2 also has a plurality of fixed high-pressure water jet nozzles 9 attached to the inner wall.

A wafer storage container 6, which is an object to be cleaned, is placed on a wafer storage container holder 7, and high-pressure water pressurized to 5 to 10 kg/-cm2 is applied to the wafer storage container from a plurality of high-pressure water jet fixed nozzles 9. 6 Spray on the surface.

At this time, the position and direction of the movable arm 4 and the high-pressure water spray movable nozzle 3 are adjusted to obtain the optimum cleaning effect for areas that are difficult to reach with the sprayed high-pressure water, such as the inner corners of the wafer storage container 6. , high-pressure water is injected from the nozzle 3.

As described above, by using the high-pressure water jet fixed nozzle 9 and the high-pressure water jet capable nozzle 3 in combination, it is possible to prevent cleaning residue from occurring even in the wafer storage container 6 having a complicated shape.

Further, by storing and reproducing the optimal positions and directions of the movable arm 4 and the high-pressure water jet capable nozzle 3 described above, it is possible to process a large number of wafer storage containers 6 of the same type.

〔Effect of the invention〕

As explained above, the present invention eliminates the generation of dust in the wafer storage container by controlling the position and direction of the high-pressure water jet nozzle so as to obtain the optimum cleaning effect according to each wafer storage container. This has the effect of preventing the occurrence of cleaning residue.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of an embodiment of the present invention, FIG. 2 is a schematic diagram of an example of a conventional cleaning device, and FIG. 3 is a schematic diagram of another example of a conventional cleaning device. DESCRIPTION OF SYMBOLS 1...Cleaning device, 2.11.21...Cleaning chamber, 3...High pressure water jet movable nozzle, 4...Movable arm, 5...Arm drive mechanism, 6...Wafer storage container , 7... Wafer storage container holder, 8... Arm drive machine lateral control section, 9.22... High pressure water jet fixed nozzle,
12...Rotating brush, 13...Arm, 16...
Washing nostle, 25...pressure tank, 26...high pressure water piping.

Claims (1)

[Claims] A cleaning device for a semiconductor wafer storage container used in the manufacturing process of semiconductor devices includes a movable arm having a movable high-pressure water spray nozzle that sprays high-pressure water, and an arm drive that sets the movable arm in a predetermined position and direction. A cleaning device for a semiconductor wafer storage container, comprising: a mechanism; and an arm drive mechanism control section that stores the position and direction and controls the arm drive mechanism.