JPH03273022A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH03273022A JPH03273022A JP7086290A JP7086290A JPH03273022A JP H03273022 A JPH03273022 A JP H03273022A JP 7086290 A JP7086290 A JP 7086290A JP 7086290 A JP7086290 A JP 7086290A JP H03273022 A JPH03273022 A JP H03273022A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- resin composition
- weight
- acid anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003085 diluting agent Substances 0.000 claims abstract description 10
- 239000000945 filler Substances 0.000 claims abstract description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 7
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229930185605 Bisphenol Natural products 0.000 claims description 7
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- 230000001351 cycling effect Effects 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004062 sedimentation Methods 0.000 description 5
- -1 dodecenyl phthalic anhydride Chemical compound 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004727 Noryl Substances 0.000 description 2
- 229920001207 Noryl Polymers 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- FIIUXOFFAKRNDO-UHFFFAOYSA-N 1-benzyl-2,4-dimethylimidazole Chemical compound CC1=NC(C)=CN1CC1=CC=CC=C1 FIIUXOFFAKRNDO-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- ZWRDBWDXRLPESY-UHFFFAOYSA-N n-benzyl-n-ethylethanamine Chemical compound CCN(CC)CC1=CC=CC=C1 ZWRDBWDXRLPESY-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、高圧トランスの絶縁材料として。[Detailed description of the invention] (Industrial application field) The present invention can be used as an insulating material for high voltage transformers.
耐サイクル性に優れたエポキシ樹脂組成物１する。Epoxy resin composition 1 with excellent cycle resistance.
（従来の技術）
エポキシ樹脂は、電気特性９機械特性、耐湿性および耐
クラツク性に優れ、しかも各種材料との接着性に優れて
おり、このエポキシ樹脂に９例えば希釈剤、酸無水物、
光てん剤等を含有させたエポキシ樹脂組成物は、絶縁性
、高電圧特性（耐アーク性、耐トラツキング性）、酊ク
ランク性および接着性をさらに向上させることが知られ
ている。(Prior art) Epoxy resin has excellent electrical properties, mechanical properties, moisture resistance, and crack resistance, as well as excellent adhesion to various materials.
It is known that an epoxy resin composition containing a photonic agent or the like further improves insulation properties, high voltage properties (arc resistance, tracking resistance), dry crank properties, and adhesive properties.
近年、これらのエポキシ樹脂組成物は、電子部品等の性
能および信頼性の向上に対応して耐ヒートサイクル性に
優れることが要求場れている。In recent years, there has been a demand for these epoxy resin compositions to have excellent heat cycle resistance in response to improved performance and reliability of electronic components and the like.
高圧トランスは、一般に、変性ポリフェニレンオキサイ
ド（例えばＣｉＥ社製商品名ノリルＧＦＮ２）で成型さ
れた分割ボビンにウレタンエナメルワイヤを巻いたコイ
ルをエポキシ樹脂組成物で絶縁処理して得られる。A high-voltage transformer is generally obtained by insulating a coil formed by winding a urethane enamel wire around a split bobbin molded from modified polyphenylene oxide (for example, CiE's trade name Noryl GFN2) with an epoxy resin composition.
該エポキシ樹脂組成物には９作業性向上の点から希釈剤
が配合されるため、硬化中に充てん剤の沈降が大きくな
り、上部と下部の熱膨張率が異なり、歪んだ硬化物とな
る欠点がある。また、生産性の向上を目的に、硬化時間
が短縮されるため収縮も起こり、これらの現象は、エポ
キシ樹脂組成物の耐ヒートサイクル性の低下の原因とな
ってぃる。Since a diluent is added to the epoxy resin composition in order to improve workability, the filler sediments significantly during curing, resulting in different coefficients of thermal expansion between the upper and lower parts, resulting in a distorted cured product. There is. In addition, shrinkage occurs because the curing time is shortened for the purpose of improving productivity, and these phenomena cause a decrease in the heat cycle resistance of the epoxy resin composition.
（発明が解決しようとする課題）
本発明の目的は、前記の従来技術の欠点を解決し、硬化
中の充てん剤の沈降が少なくかつ、硬化収縮の少ない硬
化物の耐ヒートサイクル性に優れたエポキシ樹脂組成物
を提供することにるる。(Problems to be Solved by the Invention) An object of the present invention is to solve the above-mentioned drawbacks of the prior art, and to provide a cured product with less sedimentation of the filler during curing and less curing shrinkage and excellent heat cycle resistance. To provide an epoxy resin composition.
（課題を解決するための手段） 本発明は、エポキシ樹脂、希釈剤、酸無水物。(Means for solving problems) The present invention relates to epoxy resins, diluents, and acid anhydrides.
硬化促進剤および光てん剤を含有するエポキシ樹脂組成
物において、希釈剤としてビスフェノールＡ−アルキレ
ンオキサイド付加物のグリシジルエーテルをエポキシ樹
脂１００重量部に対して５〜３０重量部および硬化促進
剤としてべ／ジルジメチルアミンを酸無水物１００重量
部に対して０．１〜５．０重量部用いてなるエポキシ樹
脂組成物に関する。In an epoxy resin composition containing a curing accelerator and a photonic agent, 5 to 30 parts by weight of glycidyl ether of a bisphenol A-alkylene oxide adduct as a diluent is added to 100 parts by weight of the epoxy resin, and base as a curing accelerator. The present invention relates to an epoxy resin composition containing 0.1 to 5.0 parts by weight of dildimethylamine per 100 parts by weight of an acid anhydride.
本発明に用いられるエポキシ樹脂としては、１分子中に
少なくとも１個のエポキシ基を有するもの２例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦｆｆエ
ポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂、多価
アルコールのポリグリシジルエステルなどが挙げられ、
これらのうち特に常温で液状のものが好ましい。これら
は１糧ま＊ｔｉ２ｆｉ以上併用して用いられる。Epoxy resins used in the present invention include those having at least one epoxy group in one molecule2, such as bisphenol A epoxy resin, bisphenol Fff epoxy resin, bisphenol AD epoxy resin, polyglycidyl ester of polyhydric alcohol, etc. are mentioned,
Among these, those that are liquid at room temperature are particularly preferred. These are used in combination at least 1*ti2fi.
本発明に用いられる希釈剤は、ビスフェノールＡ−アル
キレンオキサイド付加物のグリシジルエーテルとされ、
商品としては例えば旭電化工業■製 ＥＰ −４０００
などがめる。その配合量は。The diluent used in the present invention is glycidyl ether of bisphenol A-alkylene oxide adduct,
For example, the product is EP-4000 manufactured by Asahi Denka Kogyo ■.
etc. What is its blending amount?
エポキシ樹脂１００重量部に対して５〜３０重量部とさ
れる。この配合量が５重量部未満では、粘度が高くまた
耐ヒートサイクル性に劣り、３０重量部を起えると硬化
中の充てん剤の沈降が大きく。The amount is 5 to 30 parts by weight per 100 parts by weight of the epoxy resin. If the amount is less than 5 parts by weight, the viscosity will be high and the heat cycle resistance will be poor, and if the amount is 30 parts by weight, the filler will largely settle during curing.
また、ガラス転移温度も低くなる。Moreover, the glass transition temperature is also lowered.
本発明に用いられる充てん剤は、結晶性シリカ。The filler used in the present invention is crystalline silica.
溶融シリカ、水和アルミナ、炭酸カルシウム、タルク、
ａ化マグネシウムなどがめる。Fused silica, hydrated alumina, calcium carbonate, talc,
Magnesium a-chloride etc.
本発明に用いられる酸無水物としては１例えばメチルテ
トラヒドロ無水フタル酸、メチルへキサヒドロ無水フタ
ル酸、メチルエンドメチレン無水フタル酸、ドデセニル
無水フタル酸等が挙げられ。Examples of the acid anhydride used in the present invention include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylendomethylene phthalic anhydride, and dodecenyl phthalic anhydride.
これらは特に常温で液状のものが好ましい。これらは１
糧または２種以上併用して用いることができる。この配
合量はエポキシ樹脂１００重量部に対して５０〜１５０
重量部でろることが好ましい。These are preferably liquid at room temperature. These are 1
It can be used as food or in combination of two or more kinds. This blending amount is 50 to 150 parts by weight per 100 parts by weight of epoxy resin.
It is preferable to dissolve by parts by weight.
硬化促進剤としては、ベンジルジメチルアミンが用いら
れ、その配合量は、酸無水物１００重量部に対して０．
１〜５．０重量部とされる。この配合量が０．１重量部
未満では、耐ヒートサイクル性に劣り、５．０重量部を
起えると可使時間が短く作業性に劣る。Benzyldimethylamine is used as the curing accelerator, and the amount thereof is 0.00 parts by weight per 100 parts by weight of the acid anhydride.
The amount is 1 to 5.0 parts by weight. If the amount is less than 0.1 parts by weight, the heat cycle resistance will be poor, and if it is more than 5.0 parts by weight, the pot life will be short and the workability will be poor.
前記エポキシ樹脂組成物には１％性を向上するために可
とう化剤、カップリング剤、難燃性を付与する友め、ハ
ロゲン化合物、リン化合物等の難燃剤、カーボン、チタ
ン等の着色剤などを配合することもできる。The epoxy resin composition contains a softening agent, a coupling agent, a flame retardant such as a halogen compound and a phosphorus compound, and a coloring agent such as carbon and titanium to improve the 1% property. It is also possible to combine the following.
（実施例） 以下４本発明を実施例によシ拝しく説明する。(Example) The present invention will be described in detail below using four examples.
実施例中１部および％は４！に断らないかぎシ、それぞ
れ重量部９重量ｔｓを意味する。第１表に示す配合でエ
ポキシ樹脂組成物を得た。配合は重量部で示す。なお、
可使時間、ガラス転移温度、硬化中の沈降性、モデルコ
イルの耐ヒートサイクル性は次の方法で測定した。Part 1 and % in Examples are 4! Unless otherwise specified, each part by weight means 9 parts by weight. Epoxy resin compositions were obtained with the formulations shown in Table 1. Formulations are given in parts by weight. In addition,
The pot life, glass transition temperature, sedimentation during curing, and heat cycle resistance of the model coil were measured by the following methods.
（１）可使時間：ｉｓｏｇのエポキシ樹脂組成物を４０
℃の恒温槽中に放置し、初期粘度の２倍になる時間を測
定した。(1) Pot life: 40 ml of isog epoxy resin composition
The sample was left in a constant temperature bath at 0.degree. C., and the time required for the viscosity to double its initial viscosity was measured.
（２）ガラス転移温度：１００９のエポキシ樹脂組成物
を１００℃で３時間、さらに１２０℃で３時間で硬化し
＋５ｍＸ５ｍＸＺ−の試験片を切り出し、熱物理試験機
（パーキンエルマー社製）で測定した。(2) Glass transition temperature: The epoxy resin composition of 1009 was cured at 100°C for 3 hours and then at 120°C for 3 hours, and a +5m x 5mXZ- test piece was cut out and measured using a thermophysical tester (manufactured by PerkinElmer). .
（３）硬化中の沈降性：直径１８ｍのポリエチレン製試
験管に１３０ｍ高さまでエポキシ樹脂組成物を注入し、
（１）と同じ条件で硬化させた後、硬化物の上端および
下端から各１ａ＋１部分の灼熱残査を測定し、上下間の
差を求めた。差が大きいほど、硬化中の沈降が大きいこ
とを示す。(3) Sedimentation during curing: Inject the epoxy resin composition into a polyethylene test tube with a diameter of 18 m to a height of 130 m,
After curing under the same conditions as in (1), the burning residue of each 1a+1 portion from the upper and lower ends of the cured product was measured to determine the difference between the upper and lower ends. A larger difference indicates greater sedimentation during curing.
（４）モデルコイルの耐ヒートｖイクル性：変性ボＪフ
ェニレンオキサイド（ＧＥ社製商品名ノリルＧＦＮ−２
）で成型された分割ボビン（１５スリット）に、直径０
．０５ｍｍのウレタンエナメルワイヤーを各５００タ一
ン巻き付けてモデルコイルを作製し、これをプラスチッ
クケースに入れて１２０℃で２時間予熱後、予め２ｍｍ
Ｈｇの減圧下４０℃で脱泡して光分に気泡金線いたエポ
キシ樹脂組成物を約３０秒で注入し、その後常圧に戻し
て８０℃で３時間、８０〜１４０℃で３０分１次いで１
４０℃３時間加熱硬化し、モデルコイルを作製した。(4) Heat cycle resistance of model coil: Modified BoJ phenylene oxide (trade name Noryl GFN-2 manufactured by GE)
) to a split bobbin (15 slits) with a diameter of 0.
．． A model coil was made by winding 0.5 mm urethane enameled wire with 500 twists each, and this was placed in a plastic case and preheated at 120°C for 2 hours.
The epoxy resin composition was degassed at 40°C under a reduced pressure of Hg, and the epoxy resin composition was injected into a light beam for about 30 seconds, and then returned to normal pressure and heated at 80°C for 3 hours and at 80 to 140°C for 30 minutes. then 1
A model coil was produced by heating and curing at 40°C for 3 hours.
得られたモデルコイルの耐ヒートサイクル試験（−３０
℃で２時間と１２０℃で２時間を１サイクルとした）を
行ない、１０サイクル毎に動作テストを行ない、動作す
る場合はＯＫ、作動しない場合はＮＧとして、その動作
サイクル回数を示し次。Heat cycle resistance test (-30
℃ for 2 hours and 120℃ for 2 hours as one cycle), and an operation test was performed every 10 cycles.If it worked, it was OK, and if it did not, it was NG.The number of operation cycles was indicated as follows.
以上の結果から、実施例１〜６で得られた組成物は、い
ずれも可使時間が長く、ガラス転移温度高く、硬化中の
沈降性４少なく、また、この組成物を用いて得たモデル
コイルは、耐ヒートサイクル性に優れている。From the above results, all of the compositions obtained in Examples 1 to 6 had a long pot life, a high glass transition temperature, and a low settling property during curing. The coil has excellent heat cycle resistance.
比較例１は、ビスフェノールＡ−アルキレンオキサイド
付加物のグリシジルエーテル（加電化工業■ＥＰ−４０
００）を、５部以下としたため。Comparative Example 1 is glycidyl ether of bisphenol A-alkylene oxide adduct (Kadenka Kogyo EP-40).
00) was reduced to 5 parts or less.
ガラス転移温度が高くなりモデルコイルの耐ヒートサイ
クル性も劣っている。The glass transition temperature is high and the heat cycle resistance of the model coil is also poor.
比較例２は、ビスフェノールＡ−アレキレンオキサイド
付加物のグリシジルエーテル（加電化工業■製ＥＰ−４
０００）を３０部以上としたため。Comparative Example 2 is glycidyl ether of bisphenol A-alkylene oxide adduct (EP-4 manufactured by Kadenka Kogyo ■).
000) was made into 30 copies or more.
ガラス転移温度が低く硬化中の沈降性も大きくなってい
る。The glass transition temperature is low and the settling property during curing is also high.
比較例３は、ベンジルジメチルアミン（花王■製ＢＤＭ
Ａ）を０．１部以下としたため、硬化が十分でないこと
から、ガラス転移温度が低く、モデルコイルの耐ヒート
サイクル性も劣っている。Comparative Example 3 is benzyldimethylamine (BDM manufactured by Kao ■).
Since the amount of A) was 0.1 part or less, curing was insufficient, resulting in a low glass transition temperature and poor heat cycle resistance of the model coil.
比較例４は、べ／ジルジメチルアミン（花王製。Comparative Example 4 is be/zyl dimethylamine (manufactured by Kao).
ＢＤＭＡ）を、５．０部以上とし７’（ため可使時間が
短く２作業性に劣りまた。＆化が著しく速いため不均一
となシアモデルコイルの耐ヒートサイクル性も劣ってい
る。BDMA) is set at 5.0 parts or more, so the pot life is short and the workability is poor, and the heat cycle resistance of the non-uniform shear model coil is also poor because the conversion is extremely fast.
比較例５，６は、希釈剤にビスフェノールＡアルキレン
オキサイド付加物のグリシジルエーテル（加電化工業■
ＥＰ−４０００１を使用ゼず。In Comparative Examples 5 and 6, glycidyl ether of bisphenol A alkylene oxide adduct (Kadenka Kogyo ■) was used as a diluent.
No need to use EP-40001.
エチレングリコールジグリシジルエーテル（ＤＹ〜０２
２）、−ｙエニルグリシジルエ−７Ａ−（ＰＧＥ＞を用
いているため耐ヒートサイクル性に劣っている。Ethylene glycol diglycidyl ether (DY~02
2) Since -yenylglycidyl ether-7A- (PGE>) is used, the heat cycle resistance is poor.
比較例７，８は、硬化促進剤にベンジルジエチルアミ／
（花王社製ＢＤＭＡ）ではなく、２エチル４メチルイミ
ダゾール（四国化成社製２Ｅ４ＭＺ）１ベンジルジメチ
ルイミダゾール（四国化成社製Ｉ Ｂ ２ＭＺ ）を用
いているため耐ヒートサイクル性に劣っていた。In Comparative Examples 7 and 8, benzyldiethylamine/
Because 2-ethyl-4-methylimidazole (2E4MZ, manufactured by Shikoku Kasei Co., Ltd.) and 1-benzyldimethylimidazole (I B 2MZ, manufactured by Shikoku Kasei Co., Ltd.) were used instead of (BDMA, manufactured by Kao Corporation), the heat cycle resistance was poor.
（発明の効果）
本発明に々るエポキシ樹脂組成物は、硬化中の充てん剤
の沈降および硬化収縮が少なく、＆化物の耐ヒートサイ
クル性に優れる。(Effects of the Invention) The epoxy resin composition according to the present invention has less sedimentation of the filler during curing and less curing shrinkage, and has excellent heat cycle resistance of the compound.
Claims (1)
び充てん剤を含有するエポキシ樹脂組成物において、希
釈剤として、ビスフェノールＡ−アルキレンオキサイド
付加物のグリシジルエーテルをエポキシ樹脂１００重量
部に対して５〜３０重量部および硬化促進剤としてベン
ジルジメチルアミンを酸無水物１００重量部に対して０
．１〜５．０重量部用いてなるエポキシ樹脂組成物。1. In an epoxy resin composition containing an epoxy resin, a diluent, an acid anhydride, a curing accelerator, and a filler, glycidyl ether of a bisphenol A-alkylene oxide adduct is added as a diluent to 100 parts by weight of the epoxy resin. 5 to 30 parts by weight and benzyldimethylamine as a curing accelerator to 100 parts by weight of acid anhydride.
．． An epoxy resin composition containing 1 to 5.0 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070862A JPH07119276B2 (en) | 1990-03-20 | 1990-03-20 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070862A JPH07119276B2 (en) | 1990-03-20 | 1990-03-20 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03273022A true JPH03273022A (en) | 1991-12-04 |
| JPH07119276B2 JPH07119276B2 (en) | 1995-12-20 |
Family
ID=13443797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2070862A Expired - Lifetime JPH07119276B2 (en) | 1990-03-20 | 1990-03-20 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07119276B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001302759A (en) * | 2000-04-25 | 2001-10-31 | Matsushita Electric Works Ltd | Liquid epoxy resin composition for sealing and semiconductor device |
| JP2011079968A (en) * | 2009-10-07 | 2011-04-21 | Uniplus Electronics Co Ltd | High thermal conductivity and low loss factor build-up material |
| JP2017171727A (en) * | 2016-03-22 | 2017-09-28 | 田岡化学工業株式会社 | Epoxy resin composition containing epoxy resin having cyclic hydrocarbon skeleton |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159426A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Flexible epoxy resin composition |
-
1990
- 1990-03-20 JP JP2070862A patent/JPH07119276B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159426A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Flexible epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001302759A (en) * | 2000-04-25 | 2001-10-31 | Matsushita Electric Works Ltd | Liquid epoxy resin composition for sealing and semiconductor device |
| JP2011079968A (en) * | 2009-10-07 | 2011-04-21 | Uniplus Electronics Co Ltd | High thermal conductivity and low loss factor build-up material |
| JP2017171727A (en) * | 2016-03-22 | 2017-09-28 | 田岡化学工業株式会社 | Epoxy resin composition containing epoxy resin having cyclic hydrocarbon skeleton |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07119276B2 (en) | 1995-12-20 |
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