JPH03280378A - How to attach lead terminals to hybrid integrated circuit modules - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for attaching lead terminals to a hybrid integrated circuit module by attaching lead terminals to the hybrid integrated circuit module using a solder dip.

BACKGROUND OF THE INVENTION In recent years, hybrid integrated circuit modules installed in electronic devices have become more diverse year by year, and their production volume is steadily increasing. Accordingly, it has been expected that the lead terminal attachment process for hybrid integrated circuit modules can be produced more accurately and in a shorter takt time.

5 and 6 show a conventional method for attaching lead terminals to a hybrid integrated circuit module. In Figure 5, 1
is a hybrid integrated circuit module, which is an electrical circuit board with electrical components (not shown) mounted on its surface. 6 is for melting the solder in the solder bath. Reference numeral 7 denotes a part where the solder melted in the solder bath 6 is jetted.

Arrows in FIG. 5 indicate the direction in which the hybrid integrated circuit module 1 moves.

FIG. 6 is a sectional view taken along the line AA' in FIG. 5, where 2 is a conductor land and is an external circuit electrode of the hybrid integrated circuit module 1, and 3 is a lead terminal which is inserted into the conductor land 2 and soldered. Reference numeral 4 denotes a jet port, which is a part that creates a jet of solder 9 by blowing up solder.

Reference numeral 10 denotes a peeling portion, which often occurs at the rear portion in the traveling direction of the hybrid integrated circuit module 1 when the hybrid integrated circuit module 1 passes through the solder jet 9, and occurs particularly frequently as the traveling speed increases. This peeling part 10 will be explained in detail with reference to FIG. 7. Reference numeral 11 is an object having an arbitrary shape. 13
is a fluid, indicating gas or liquid. Reference numeral 12 indicates a peeling point, which corresponds to the peeling portion 10 in FIG. When the object 11 moves in the direction of the white arrow, the surrounding fluid branches into two at 13, passes through ■, and then joins again at 0. At this time, the fluid 13 is decelerated from (2), where the flow speed is highest, toward the confluence point O, and the fluid 13 may be separated from the object 11 at the point where the deceleration effect is maximum.

(Written by Tetsuo Nishiyama, Flow Studies, Chapter 5-1, P55-571, published by Nikkan Kogyo Shimbun, 348.12.25) This is separation, and separation point 12 corresponds to that point.

FIG. 5 shows that the hybrid integrated circuit module 1 moves through the solder jet 9, but the fluid, ie, the flow of the solder jet 9, separates from the object, ie, the hybrid integrated circuit module 1.

Problem to be Solved by the Invention Namely, in the configuration as described above, when the hybrid integrated circuit module 1 moves through the jet solder 9, the jet solder 9 and the hybrid integrated circuit at the rear part of the hybrid integrated circuit module 1 in the traveling direction A peeled portion 10 was generated between the module 1 and the conductor land 2 and the lead terminal 3, which often caused poor soldering between the conductor land 2 and the lead terminal 3. For this reason, the material cannot be moved at a speed higher than a certain level to prevent peeling, which poses a problem in productivity.

In view of the above-mentioned problems, the present invention provides a method for attaching lead terminals of an integrated circuit module to eliminate peeling portions that occur between jet solder and a hybrid integrated circuit module.

Means for Solving the Problems In order to solve the above problems, the method for attaching lead terminals of a hybrid integrated circuit module of the present invention has an upward jet opening for jetting solder upward and a spout opening for jetting solder horizontally. The solder tank is characterized by having a horizontal jet port.

According to the above-described configuration, the present invention moves the hybrid integrated circuit module in the traveling direction at the same speed as or close to the speed at which the conductor lands of the hybrid integrated circuit module and the lead terminals inserted into the conductor lands pass through the solder jet. We created a flow of jet solder in the same direction as by combining top jet solder and side jet solder. Eliminate soldering defects between the conductor lands and the lead terminals inserted into the conductor lands. In other words, the peeling of the jet solder, which is the cause of soldering defects, is eliminated by the movement of the hybrid integrated circuit module that moves through the solder jets. This was caused by the relative speed difference between the speed and the jet solder that does not move horizontally, so in order to eliminate or reduce the relative speed difference, horizontal jet soldering and top jet soldering were combined. By creating a flow of jet solder in the same direction as the hybrid integrated circuit module traveling direction, separation of the jet solder and the hybrid integrated circuit module is eliminated, and soldering defects are eliminated. Here, the horizontal jet solder creates a lateral solder flow, and the upper jet solder mainly serves to stabilize the lateral solder flow.

Embodiment A method for attaching lead terminals to a hybrid integrated circuit module according to an embodiment of the present invention will be described with reference to the drawings. In FIGS. 1, 2, and 3, numeral 1 represents a hybrid integrated circuit module and an electric circuit board. A conductor land 2 is an external circuit electrode of the hybrid integrated circuit module 1. A lead terminal 3 is inserted into the conductive land 2 and soldered. Reference numeral 4 denotes an upward jet port for blowing molten solder upward. Reference numeral 5 denotes a horizontal jet port for blowing out molten solder in the horizontal direction.

6 is a solder tank for melting solder. 7 is a horizontal jet solder, which shows the flow of molten solder blown out from the horizontal jet port 5. Reference numeral 8 denotes an upper jet of solder, which shows the flow of molten solder blown up from the upper jet nozzle 4.

Next, the operation of the configuration of this embodiment will be explained. First, how to create a flow of jet solder in the same direction as the traveling direction of the hybrid integrated circuit module 1 is shown in FIG. Molten solder is blown out from the directional jet port 5 to form horizontal jet solder 7. In other words, the layer of upper jet solder 8 is essential in order to create a stable flow of horizontal jet solder 7. Further, there is a part of the upward jet port 4 above the horizontal jet port 5 at the left end in FIG. 4, and this is also for stabilizing the horizontal jet solder 7. The lead terminals 3 inserted into the conductor lands 2 of the hybrid integrated circuit module 1 pass through the horizontal jet solder 7 formed in this way. By changing the amount of molten solder blown out from the jet port 5, the flow speed of the horizontal jet solder 7 can be matched to the hybrid integrated circuit module 1. Therefore, the difference in speed that occurs between the conductor land 2 and lead terminal 3 and the jetted solder is very small or disappears, and no separation occurs between the conductor land 2 and lead terminal 3 and the jetted solder. , soldering defects are eliminated.

Although the shapes of the upper jet ports 4 and the horizontal jet ports 5 are rectangular, the shape is not limited to rectangles, and the numbers may be arbitrary. Furthermore, although the jet direction of the horizontal jet solder 7 is aligned with the traveling direction of the hybrid integrated circuit module 1, it is not necessary to jet in exactly the same direction, and it has a velocity component in the same direction as the traveling direction of the hybrid integrated circuit module 1. As long as it is a jet direction, it may be 45 degrees, and the direction can be arbitrarily selected.If there are a plurality of lateral jet ports, the combination is also arbitrary.

The table below shows the failure rate when producing using the horizontal jet solder 7.

Effects of the Invention As described above, according to the present invention, separation of the jet solder is eliminated by the upper jet solder jetted upward by the upper jet port and the horizontal jet solder jetted laterally by the lateral jet port. The number of soldering defects between conductor lands and lead terminals of hybrid integrated circuit modules is drastically reduced, and production quality is improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a lead terminal attachment method for a hybrid integrated circuit module according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA' in FIG. 1, and FIG. 3 is an embodiment of the present invention. FIG. 4 is an enlarged view of the main portion of FIG. 2, and FIG. 5 is a perspective view showing the lead terminal attachment method of a conventional hybrid integrated circuit module. He is a descendant of the 1... Hybrid integrated circuit module, 2...
・Conductor land, 3...Lead terminal, 4...
...Upper jet port, 5... Lateral jet port, 7.
...Horizontal jet soldering, 8...Top jet soldering.

Claims (1)

[Claims] The conductor lands of the hybrid integrated circuit module and the lead terminals inserted into the conductor lands are soldered by upper jet solder jetted upward by an upper jet port and horizontal jet solder jetted laterally by a lateral jet port. A method for attaching lead terminals of a hybrid integrated circuit module, characterized by attaching the lead terminals to the hybrid integrated circuit module.