JPH03280448A - Dicing of semiconductor wafer - Google Patents

Abstract

PURPOSE:To make it possible to separate a semiconductor wafer comprising chips of different sizes into the chips using only one roller by a method wherein the upper part of the wafer with scribing lines engraved therein is pressed by the roller, whose curvature of the outer peripheral surface in the direction perpendicular to the axis of the roller is partially different. CONSTITUTION:The section of a roller 11 comprises a part A of a large curvature radius and a part B of a small curvature radius. In a semiconductor wafer 1, there are two kinds of chip sizes, for example, and scribing lines 1A are engraved in the wafer 1. When the roller 11 is rotated around a rotating axis 10 on the semiconductor substrate 1 and a pressure is applied to the substrate 1, each part of the wafer is pressed in the curvatures, which apply to the chip sizes, of the roller and the wafer can be separated into chips along the lines 1A in the direction perpendicular to an orientation flat 1B by only one operation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] Undeveloped IJI relates to a dicing method for separating semiconductor wafers into chips.

(Prior Art) There are two dicing methods: a scribing method in which a scribe line is carved along the chip with a laser or a diamond needle to mechanically divide the chip, and a dicing saw method. Conventionally, in the scribing method, semiconductor wafers are A scribe line is carved into the material, and then a roller is pressed along the line to separate the material.

[Problem to be solved by the invention]

In the conventional mechanical separation method described above, a roller having a substantially perfect circular cross section is used, and the roller is selected to have an appropriate diameter depending on the size of the chips. A roller with a small diameter is suitable for small chips, and a roller with a large diameter is suitable for large chips.

On the other hand, in order to efficiently perform high-mix, low-volume production, chips of different sizes have recently been increasingly incorporated into the same semiconductor wafer. In this case, when separating the chips from two semiconductor wafers, it is necessary to change the diameter of the roller for each part of the chip of different size, so there is a drawback that the process must be carried out in several stages. be.

The object of the invention is to provide a method which obviates the above-mentioned drawbacks and makes it possible to separate a semiconductor wafer containing chips of different sizes into chips using only one roller.

[Means to solve the problem]

The present invention involves scribing a scribe line on a semiconductor wafer containing at least two types of chips of different sizes, and then pressing the semiconductor wafer with rollers having partially different curvatures on the outer peripheral surface in the direction perpendicular to the axis. The chips are separated by

[Effect]

The curvature of the cross section of the roller is adjusted to suit the different sizes of chips included in the semiconductor wafer.
Each part is determined to have an appropriate curvature. This makes it possible to press the semiconductor wafer and separate the chips under optimal conditions without changing the rollers.

〔Example〕

Embodiments of the present invention will be described below with reference to one drawing. In FIG. 1, the roller 11 has a cross section including a portion A with a large radius of curvature and a portion B with a small radius of curvature, and is configured to rotate and press the top of the semiconductor wafer 1 around the rotation axis lO. I have to. As shown in FIG. It has a class II chip size and has a scribe line IA engraved on it.

When the roller 11 is rotated over the semiconductor substrate l and pressure is applied, each part is compressed with a curvature that matches the size of the chip, and the orientation is flattened by the -times operation along the scribe line IA perpendicular to the IB. Can be separated.

Next, as a second embodiment, an example in which the roller drive system is changed is shown in FIG. 2. In this example, outer rollers 21 having partially different curvatures are driven by inner gears 22. This provides the same effect as the first embodiment.

〔Effect of the invention〕

As explained above, undeveloped IJ1 is produced by compressing a semiconductor wafer with scribe lines using two rollers with different curvatures. It has the effect of being able to be divided into individual chips by operation.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views showing the configuration of an embodiment of the present invention,
FIG. 3 is a plan view of a semiconductor wafer containing chips of different sizes. l...Semiconductor wafer, IA...Scribe line, 1
1...Roller, 21...Outer roller, 22
...Inner gear. Patent Applicant n Hon Electric Stock Figure 2) B Orientation Flat

Claims (1)

[Claims] In the process of separating a semiconductor wafer containing at least two types of chips of different sizes into individual chips, the curvature of the outer peripheral surface in the direction perpendicular to the axis is A method for dicing semiconductor wafers, characterized in that chips are separated by pressure using different rollers.