JPH03280480A - Sheathing of laminated piezoelectric actuator element - Google Patents
Sheathing of laminated piezoelectric actuator elementInfo
- Publication number
- JPH03280480A JPH03280480A JP2079894A JP7989490A JPH03280480A JP H03280480 A JPH03280480 A JP H03280480A JP 2079894 A JP2079894 A JP 2079894A JP 7989490 A JP7989490 A JP 7989490A JP H03280480 A JPH03280480 A JP H03280480A
- Authority
- JP
- Japan
- Prior art keywords
- actuator element
- piezoelectric actuator
- molded body
- epoxy resin
- laminated piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000004593 Epoxy Substances 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は積層型圧電アクチュエータ素子に関し、特に外
装方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laminated piezoelectric actuator element, and particularly to a packaging method.
第6図は、この種の積層型圧電アクチュエータ素子の従
来例の斜視図である。FIG. 6 is a perspective view of a conventional example of this type of laminated piezoelectric actuator element.
この積層型圧電アクチュエータ素子は、低電圧駆動およ
び高変位を得るため圧電セラミックス14を薄い膜厚の
グリーンシートにし、その上に銀などの内部導電体層1
5を塗布した後数十層積層して焼結し、側面に露出した
内部導電体層15を対向する側面で一層おきに絶縁体1
7で絶縁した後、外部電極16にて露出している内部電
極15を接続して2つのくし歯形電極を形成して製造さ
れていた。そして、この電極間に電圧を与え積層方向に
縦歪を生じさせることにより積層型圧電アクチュエータ
素子の積層方向に変位と力を取出していた。しかし前記
構造の積層型圧電アクチュエータ素子は、内部導電体f
i15が露出しており、高湿度雰囲気中においては内部
導電体層15中の銀がマイグレーションを生じ絶縁抵抗
を低下させてしまうため内部導電体層2が露出してい葛
側面をエポキシ樹脂などで外装し防湿を行なっている。This laminated piezoelectric actuator element has a thin green sheet made of piezoelectric ceramic 14 in order to obtain low voltage drive and high displacement, and an internal conductive layer 1 made of silver or the like on top of the piezoelectric ceramic 14 formed into a thin green sheet.
5 is applied, several tens of layers are laminated and sintered, and the internal conductor layer 15 exposed on the side is coated with insulator 1 every other layer on the opposite side.
7, and then the exposed internal electrodes 15 are connected to the external electrodes 16 to form two comb-shaped electrodes. Then, by applying a voltage between the electrodes to generate longitudinal strain in the stacking direction, displacement and force are extracted in the stacking direction of the stacked piezoelectric actuator element. However, in the laminated piezoelectric actuator element having the above structure, the internal conductor f
I15 is exposed, and in a high humidity atmosphere, the silver in the internal conductor layer 15 will migrate and reduce the insulation resistance, so the internal conductor layer 2 is exposed and the side surface is covered with epoxy resin etc. It is moisture-proofed.
上述した従来のa層型圧電アクチュエータ素子は、端面
18にエポキシ樹脂が付着した状態で使用されると変位
または力がエポキシ樹脂に吸収され、変位や力が減少す
るため、外装を行なう場合、端面18にマスキング用ゴ
ムを貼付けたり、テフロン樹脂や金属製の治具にて端面
18を覆い、端面18に外装用樹脂が侵入しないように
した後、液状または粉末状エポキシ樹脂を積層型圧電ア
クチュエータ素子表面に被着させ、樹脂を硬化させた後
に、端面部を覆うマスキング用ゴムや治具を取外すと共
に、端面付近のエポキシ樹脂を削り成形しており、この
作業を行なうために多くの作業工数が必要で、積層型圧
電アクチュエータ素子のコストが高くなるという欠点が
ある。When the conventional A-layer piezoelectric actuator element described above is used with epoxy resin attached to the end face 18, the displacement or force is absorbed by the epoxy resin and the displacement or force is reduced. After applying masking rubber to the end face 18 or covering the end face 18 with a Teflon resin or metal jig to prevent the exterior resin from entering the end face 18, liquid or powdered epoxy resin is applied to the laminated piezoelectric actuator element. After applying it to the surface and curing the resin, the masking rubber and jig covering the end face are removed, and the epoxy resin near the end face is shaved and molded, which requires a lot of man-hours. However, there is a disadvantage that the cost of the laminated piezoelectric actuator element increases.
本発明の積層型圧電アクチュエータの外装方法は、未反
応エポキシ粉末樹脂をあらかじめプレス機にて加圧して
成形体を作り、積層型圧電アクチュエータ素子を前記成
形体で挟装みこんだ後加熱してエポキシ樹脂を硬化させ
、外装することを特徴とする。The method for packaging the laminated piezoelectric actuator of the present invention is to press unreacted epoxy powder resin with a press in advance to make a molded body, sandwich the laminated piezoelectric actuator element between the molded bodies, and then heat the epoxy powder resin. It is characterized by hardening the resin and covering it.
未反応エポキシ粉末樹脂をあらかじめ成形しておくので
、積層型圧電アクチュエータ素子の端面にまったく樹脂
が付着しない外装を容易に行なうことができる。Since the unreacted epoxy powder resin is molded in advance, it is possible to easily package the stacked piezoelectric actuator element so that no resin adheres to the end face.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の積層型圧電アクチュエータの外装方法
の一実施例による外装治具の断面図、第2図から第4図
まではプレス機において成形金具の動きを示す成形金具
型の断面図、第5図は本実施例における成形体の斜視図
である。FIG. 1 is a cross-sectional view of an exterior jig according to an embodiment of the packaging method for a laminated piezoelectric actuator of the present invention, and FIGS. 2 to 4 are cross-sectional views of a molding die showing the movement of the molding metal fitting in a press machine. , FIG. 5 is a perspective view of the molded body in this example.
未反応エポキシ粉末樹脂2は第2図に示すようにポツパ
ー3より振動子4の振動と重力によりパイプ5を通りダ
イス6中に充てんされる。この時下パンチ7はA点で停
止している0次に、ポツパー3下部のスクレッパ8が移
動し、ダイス6上面上の未反応エポキシ粉末樹脂2を掃
き除き、ダイス6中の空間を埋める未反応エポキシ粉末
樹脂2の量が一定量となるようにする0次に、第3図に
示すように下パンチ7がB点まで下降すると共に1パン
チ9も下降していき、未反応エポキシ粉末樹脂2はダイ
ス6中で加圧され上パンチ9と下パンチ7の先端に下降
された形状に従い、第5図に示すような形の成形体1が
できる0次に、第4図に示すように、上パンチ9が上昇
し、その後下パンチ7が成形体1を押し上げながらダイ
ス6の上面まで上昇し成形体1をダイス6中から押出す
。この後、スクレッパ8がダイス6の穴まで再度移動し
、成形体lを収容箱10まで移動させると共に再度振動
と重力により未反応エポキシ粉゛末樹脂2をダイス6中
に充てんする。As shown in FIG. 2, the unreacted epoxy powder resin 2 is filled from the popper 3 into the die 6 through the pipe 5 due to the vibration of the vibrator 4 and gravity. At this time, the lower punch 7 is stopped at point A. Next, the scraper 8 at the bottom of the popper 3 moves to sweep away the unreacted epoxy powder resin 2 on the upper surface of the die 6, and remove the unreacted epoxy powder resin 2 filling the space inside the die 6. Next, as shown in FIG. 3, the lower punch 7 descends to point B and the first punch 9 also descends to remove the unreacted epoxy powder resin. 2 is pressurized in the die 6 and lowered to the tips of the upper punch 9 and lower punch 7 to form a molded body 1 as shown in FIG. 5. Next, as shown in FIG. , the upper punch 9 rises, and then the lower punch 7 rises to the upper surface of the die 6 while pushing up the molded body 1, and extrudes the molded body 1 from the die 6. Thereafter, the scraper 8 moves again to the hole in the die 6, moves the molded body 1 to the storage box 10, and fills the die 6 with unreacted epoxy powder resin 2 again by vibration and gravity.
このようにして成形された成形体1を第1図のテフロン
製の外装治具12の溝11に入れる6次に、積層型圧電
アクチュエータ素子13を成形体lの溝に入れる。さら
に、成形体1を積層型圧電アクチュエータ素子13を挟
むように置く0次に、恒温槽中で外装治具12を150
@01時間加熱すると未反応エポキシ樹脂は一度軟化し
、積層型圧電アクチュエータ素子表面に密着した後硬化
する。冷却後、外装治具12より積層型圧電アクチュエ
ータ素子13を取出す。The molded body 1 thus formed is placed in the groove 11 of the Teflon exterior jig 12 shown in FIG. 1. Next, the laminated piezoelectric actuator element 13 is placed in the groove of the molded body l. Furthermore, the molded body 1 is placed so that the laminated piezoelectric actuator element 13 is sandwiched therebetween, and then the exterior jig 12 is placed in a constant temperature bath for 150 minutes.
When heated for @01 hour, the unreacted epoxy resin is once softened, and then hardened after coming into close contact with the surface of the laminated piezoelectric actuator element. After cooling, the laminated piezoelectric actuator element 13 is taken out from the exterior jig 12.
このような製造方法により積層型圧電アクチュエータ素
子の端面にまったく樹脂が付着しない外装を容易に行な
うことができる。By such a manufacturing method, it is possible to easily package the end face of the laminated piezoelectric actuator element with no resin attached at all.
以上説明したように本発明は、未反応エポキシ粉末樹脂
をあらかじめ成形しておくことにより、下記のような効
果がある。As explained above, the present invention has the following effects by molding unreacted epoxy powder resin in advance.
(1)積層型圧電アクチュエータ素子端面への外装樹脂
付着防止のため、マスキングが不用となり、外装作業工
数がほぼζ以下に減少する。(1) Masking is not required to prevent the exterior resin from adhering to the end face of the laminated piezoelectric actuator element, and the number of exterior work steps is reduced to approximately ζ or less.
(2)未反応エポキシ粉末樹脂の使用効率が10%から
60%に向上する。(2) The usage efficiency of unreacted epoxy powder resin is improved from 10% to 60%.
(3)外装樹脂中の空コウ率が減少し1歩留が5%向上
する。(3) The void ratio in the exterior resin is reduced and the yield per unit is improved by 5%.
第1図は本発明の積層型圧電アクチュエータの外装方法
の一実施例による外装治具の断面図、第2図、第3図、
第4図は本実施例により成形用金型の動きを示す成形体
用金型の断面、第5図は本実施例における成形体の斜視
図、第6図は外装前の積層型圧電アクチュエータ素子の
斜視図である。
1・・・・・・成形体、
2・・・・・・未反応エポキシ粉末樹脂、3・・・・・
・ポツパー、 4・・・・・・振動子、5・・・・・
・パイプ、 6・・・・・・ダイス、7・・・・
・・下パンチ、 8・・・・・・スクレツパ、9・・
・・・・上パンチ、 lO・・・・・・収容箱、11
・・・・・・溝、 12・・・・・・外装治具
、13・・・・・・積層型圧電アクチュエータ素子、1
4・・・・・・圧電セラミックス、
15・・・・・・内部導電体層、1B・・・・・・外部
電極、17・・・・・・絶縁体、 18・・・・・
・端面。FIG. 1 is a sectional view of an exterior jig according to an embodiment of the exterior packaging method for a laminated piezoelectric actuator of the present invention, FIGS. 2 and 3,
Figure 4 is a cross section of a mold for a molded body showing the movement of the molding die according to this example, Figure 5 is a perspective view of the molded body in this example, and Figure 6 is a laminated piezoelectric actuator element before being packaged. FIG. 1... Molded object, 2... Unreacted epoxy powder resin, 3...
・Popper, 4... Vibrator, 5...
・Pipe, 6...Dice, 7...
...lower punch, 8...scretsupa, 9...
...Top punch, lO...Storage box, 11
... Groove, 12 ... Exterior jig, 13 ... Laminated piezoelectric actuator element, 1
4...Piezoelectric ceramics, 15...Inner conductor layer, 1B...External electrode, 17...Insulator, 18...
·End face.
Claims (1)
てなる積層型圧電アクチュエータ素子の外装方法におい
て、未反応エポキシ粉末樹脂をプレス機にて加圧して成
形体を作り、積層型圧電アクチュエータ素子を前記成形
体で挟みこんだ後、加熱してエポキシ樹脂硬化させ、外
装することを特徴とする積層型圧電アクチュエータ素子
の外装方法。1. In a method for packaging a laminated piezoelectric actuator element in which piezoelectric ceramic layers and internal conductor layers are alternately laminated, unreacted epoxy powder resin is pressed in a press to form a molded body, and the laminated piezoelectric actuator element is A method for packaging a laminated piezoelectric actuator element, which comprises sandwiching the element between molded bodies, heating it to harden the epoxy resin, and then packaging the element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2079894A JPH03280480A (en) | 1990-03-28 | 1990-03-28 | Sheathing of laminated piezoelectric actuator element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2079894A JPH03280480A (en) | 1990-03-28 | 1990-03-28 | Sheathing of laminated piezoelectric actuator element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03280480A true JPH03280480A (en) | 1991-12-11 |
Family
ID=13702983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2079894A Pending JPH03280480A (en) | 1990-03-28 | 1990-03-28 | Sheathing of laminated piezoelectric actuator element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03280480A (en) |
-
1990
- 1990-03-28 JP JP2079894A patent/JPH03280480A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5357399A (en) | Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor | |
| US5139973A (en) | Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet | |
| JPH0738426B2 (en) | Manufacturing method of integrated circuit package | |
| CN208410457U (en) | A kind of power transmitting device conducting ring encapsulating die | |
| CN210129501U (en) | Semiconductor device | |
| JPH03280480A (en) | Sheathing of laminated piezoelectric actuator element | |
| US3715423A (en) | Plastic encapsulation of semiconductor devices | |
| JPH0831696A (en) | Solid-state capacitor and its manufacturing method | |
| KR101718551B1 (en) | Method for producing power semiconductor substrates | |
| JPS59110217A (en) | Piezoelectric oscillating parts in chip shape and its manufacture | |
| JP2508314B2 (en) | Method for manufacturing laminated piezoelectric element | |
| JPH0563096B2 (en) | ||
| JP3393563B2 (en) | Pressure forming apparatus for sheet-like piezoelectric element and pressure forming method using the same | |
| JPH0471280A (en) | Manufacture of laminated piezoelectric element | |
| JPH0558647B2 (en) | ||
| JPH0614467Y2 (en) | Solid electrolytic capacitor | |
| EP0893808B1 (en) | Preforms for the fabrication of surface mountable solid state capacitors and method for manufacturing said capacitors | |
| JPH0531813B2 (en) | ||
| GB1507333A (en) | Piezoelectric devices | |
| CN119388647A (en) | Coil potting tool and coil potting method | |
| JPH0966523A (en) | Manufacture of semiconductor sealing resin molding | |
| CN104051386B (en) | Packaging part with the step that moulding compound is formed | |
| JPS598038B2 (en) | Manufacturing method of elastic connector | |
| JPH0230578B2 (en) | ||
| JPH0364012A (en) | Exterior packaging of capacitor |