JPH03280557A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH03280557A JPH03280557A JP2082713A JP8271390A JPH03280557A JP H03280557 A JPH03280557 A JP H03280557A JP 2082713 A JP2082713 A JP 2082713A JP 8271390 A JP8271390 A JP 8271390A JP H03280557 A JPH03280557 A JP H03280557A
- Authority
- JP
- Japan
- Prior art keywords
- aging
- semiconductor chip
- temperature
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置、特にニージンクを容易化する半
導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a semiconductor device that facilitates knee jerking.
従来の半導体装置のエージングは、恒温槽内に被試験物
を入れ通電し、その消費電力及び熱抵抗より恒温槽の雰
囲気の温度を設定し、半導体装置の加速エージングを実
施している。Conventionally, semiconductor devices are aged by placing a test object in a thermostatic chamber, energizing it, setting the temperature of the atmosphere in the thermostatic chamber based on its power consumption and thermal resistance, and performing accelerated aging of the semiconductor device.
上述した従来の半導体装置は、エージングの実施におい
て、各品種毎の消費電力及び熱抵抗の差で、同一恒温槽
にて一度に出来なくなる場合があり、エージング設備の
効率が低下する欠点がある。The above-mentioned conventional semiconductor devices have the disadvantage that when performing aging, it may not be possible to perform aging in the same constant temperature bath due to the difference in power consumption and thermal resistance of each type, resulting in a decrease in the efficiency of the aging equipment.
本発明は上述の欠点を無くする為、半導体装置ケース部
に発熱体を設ける。In order to eliminate the above-mentioned drawbacks, the present invention provides a heating element in the semiconductor device case.
［実施例〕 次に本発明について図面を参照して説明する。[Example〕 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of one embodiment of the present invention.
Ｌは半導体チップであり、Ｃは半導体ケースであり、Ｒ
は発熱抵抗体である。１．２はこの発熱抵抗体への電力
供給用の入力端子である。L is a semiconductor chip, C is a semiconductor case, and R
is a heating resistor. 1.2 is an input terminal for supplying power to this heating resistor.
ついで動作を説明する。Next, the operation will be explained.
半導体チップしての消費電力では温度上昇が十分でない
時、発熱抵抗体Ｒに電力を加える事により、半導体チッ
プＬの温度を上昇させる事によりエージング効果を上げ
る事が可能となる。When the power consumption of the semiconductor chip is not enough to raise the temperature, it is possible to increase the aging effect by increasing the temperature of the semiconductor chip L by applying power to the heating resistor R.
以上説明したように本発明の様に外部より温度上昇を制
御することが出来る為に、常温雰囲気に於いてもエージ
ング効果を高める事が可能であり、同一恒温槽内でも各
種デバイスを一度にエージングが可能となる。As explained above, since the temperature rise can be controlled externally like in the present invention, it is possible to enhance the aging effect even in a room temperature atmosphere, and it is possible to age various devices at the same time even in the same thermostatic chamber. becomes possible.
第１図は本発明の一実施例を示す断面図である。
１．２・・・発熱抵抗体入力端子、
Ｒ・・・発熱抵抗体、Ｌ・・・半導体チップ、Ｃ・・・
半導体ケース。FIG. 1 is a sectional view showing one embodiment of the present invention. 1.2...Heating resistor input terminal, R...Heating resistor, L...Semiconductor chip, C...
semiconductor case.
Claims (1)
装置。A semiconductor device characterized by having a heat generating resistor in a case portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082713A JPH03280557A (en) | 1990-03-29 | 1990-03-29 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082713A JPH03280557A (en) | 1990-03-29 | 1990-03-29 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03280557A true JPH03280557A (en) | 1991-12-11 |
Family
ID=13782053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2082713A Pending JPH03280557A (en) | 1990-03-29 | 1990-03-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03280557A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003027695A1 (en) * | 2001-09-27 | 2003-04-03 | Advanced Micro Devices, Inc. | Thermal head for maintaining a constant temperature of a dut |
| CN108508353A (en) * | 2018-05-22 | 2018-09-07 | 杭州博日科技有限公司 | The driver circuit plate high temperature accelerated test aging equipment of PCR instrument |
-
1990
- 1990-03-29 JP JP2082713A patent/JPH03280557A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003027695A1 (en) * | 2001-09-27 | 2003-04-03 | Advanced Micro Devices, Inc. | Thermal head for maintaining a constant temperature of a dut |
| CN108508353A (en) * | 2018-05-22 | 2018-09-07 | 杭州博日科技有限公司 | The driver circuit plate high temperature accelerated test aging equipment of PCR instrument |
| CN108508353B (en) * | 2018-05-22 | 2023-08-08 | 杭州博日科技股份有限公司 | High-temperature accelerated test aging device for driving circuit board of PCR instrument |
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