JPH03280590A - Coater - Google Patents
CoaterInfo
- Publication number
- JPH03280590A JPH03280590A JP8251490A JP8251490A JPH03280590A JP H03280590 A JPH03280590 A JP H03280590A JP 8251490 A JP8251490 A JP 8251490A JP 8251490 A JP8251490 A JP 8251490A JP H03280590 A JPH03280590 A JP H03280590A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- adhesive
- head
- angle
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 81
- 238000000576 coating method Methods 0.000 claims abstract description 81
- 239000000853 adhesive Substances 0.000 claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 claims abstract description 37
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004834 spray adhesive Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は、回動可能な塗布ヘッド先端に設けられた複数
本の塗布ノズルより接着剤を吐出しテーブルに載tすれ
たプリント基板の所望の位置に所望の回転角度だけ回動
した前記塗布ヘッドをXY移動駆動手段により相対的に
XY移動許せて前記接着剤を塗布する塗布装置に関する
。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention is a method for applying adhesive to a printed circuit board placed on a table by discharging adhesive from a plurality of application nozzles provided at the tip of a rotatable application head. The present invention relates to a coating device that applies the adhesive by allowing the coating head, which has been rotated to a desired position by a desired rotation angle, to be relatively moved in the XY direction by an XY movement drive means.
(ロ)従来の技術
この種塗布ヘッドに塗布ノズルが複数本設けられている
塗布装置の従来技術が、特公昭61−56638号公報
に開示されている。(b) Prior Art A prior art of a coating device of this type in which a coating head is provided with a plurality of coating nozzles is disclosed in Japanese Patent Publication No. 61-56638.
しかし該従来技術では、塗布ヘッドが水平面内で所定角
度回動じて接着剤の塗布を行なう場合、塗布ヘッドの回
転の中心と回転の中心となるべき塗布の基準点(塗布ノ
ズルが2本の場合は塗布ノズルのセンター間の中点)に
はズレがあるため、正確な位置に塗布ヘッドを位t−g
せられないという欠点があった。However, in this prior art, when the coating head rotates at a predetermined angle in a horizontal plane to apply adhesive, the center of rotation of the coating head and the coating reference point that should be the center of rotation (in the case of two coating nozzles) Since there is a misalignment between the centers of the coating nozzles, please place the coating head in the correct position.
The drawback was that it was impossible to do so.
(八)発明が解決しようとする課題
そこで本発明は、塗布ヘッドが回動しても回動の影響を
なくしてプリント基板の所望の位置に接着剤を塗布でき
るようにすることを目的とする。(8) Problems to be Solved by the Invention Therefore, an object of the present invention is to eliminate the influence of rotation even when the application head rotates, and to enable adhesive to be applied to a desired position on a printed circuit board. .
(ニ)課題を解決するための手段
このため本発明は、回動可能な塗布ヘッド先端に設けら
れた複数本の塗布ノズルより接着剤を吐出しテーブルに
載置されたプリント基板の所望の位置に所望の回転角度
だけ回動した前記塗布ヘッドをXY移動駆動手段により
相対的にXY移動させて前記接着剤を塗布する塗布装置
に於いて、塗布位置を決める塗布ヘッド上の基準点と塗
布ヘッドの回転中心とのズレ距離及び該基準点と該回転
中心を結ぶ直線が塗布角度を決める塗布ヘッド上の基準
線となすズし角度を記憶する第1の記憶手段と、接着剤
を本来塗布すべきXY座標位置及び塗布角度データを記
憶する第2の記憶手段と、該第1.第2の記憶手段に記
憶された各情報に基づきプリント基板の本来の塗布位置
に本来の塗布角度で接着剤を塗布できるよう前記駆動手
段を制御する制御手段とを設けたものである。(d) Means for Solving the Problems Therefore, the present invention aims to spray adhesive from a plurality of application nozzles provided at the tip of a rotatable application head to a desired position of a printed circuit board placed on a table. In a coating device that applies the adhesive by moving the coating head, which has been rotated by a desired rotation angle, by an XY movement drive means, a reference point on the coating head and a reference point on the coating head that determines the coating position are provided. a first storage means for storing the deviation distance from the rotation center of the adhesive and the deviation angle formed with the reference line on the application head which determines the application angle by a straight line connecting the reference point and the rotation center; a second storage means for storing the desired XY coordinate position and coating angle data; and control means for controlling the driving means so that the adhesive can be applied to the original application position on the printed circuit board at the original application angle based on each piece of information stored in the second storage means.
(*)作用
制御手段は、第1の記憶手段に記憶いれたスレ距離及び
ズレ角度と第2の記憶手段に記憶された接着剤を本来塗
布すべきXY座標位置及び塗布角度データに基づき、プ
リント基板の本来の塗布位置に本来の塗布角度で接着剤
を塗布できるようXY移動駆動手段を制御する。(*) The action control means performs printing based on the scratch distance and misalignment angle stored in the first storage means and the XY coordinate position and application angle data stored in the second storage means where the adhesive should originally be applied. The XY movement driving means is controlled so that the adhesive can be applied to the original application position on the substrate at the original application angle.
(へ)実施例 以下本発明の一実施例を図に基づき説明する。(f) Example An embodiment of the present invention will be described below based on the drawings.
第1図及び第2図に於いて、(1)壮プリント基板(2
)が載置されるXY子テーブル、X軸モータ駆動回路(
3)により回動ネれるX軸モータ(4)によりX方向移
動し、Y軸モータ駆動回路(5)により回動されるY軸
モータ(6)によりX方向移動する。(7)は前記XY
子テーブル1)上に載置されたプリント基板(2)に接
着剤(8)を塗布する塗布ヘッド(9)ヲ有するデイス
ペンサーユニットである。In Figures 1 and 2, (1) main printed circuit board (2
) is placed on the XY child table, the X-axis motor drive circuit (
It moves in the X direction by an X-axis motor (4) which is rotated by 3), and moves in the X-direction by a Y-axis motor (6) which is rotated by a Y-axis motor drive circuit (5). (7) is the above XY
This dispenser unit has an application head (9) that applies adhesive (8) to a printed circuit board (2) placed on a sub-table (1).
(10)はプリント基板(2)を搬送し供給する供給コ
ンベアであり、(11)は該基板(2)を搬送し排出す
る排出コンベアである。 (12)はプリント基板(2
)の乗せ換えユニットで、供給コンベア(10)上の基
板(2)をXY子テーブル1)上に乗せ換えると共に、
XY子テーブル1)上の基板(2)を排出コンベア(1
1)上に乗せ換える。(10) is a supply conveyor that transports and supplies the printed circuit board (2), and (11) is a discharge conveyor that transports and discharges the board (2). (12) is a printed circuit board (2
) is used to transfer the board (2) on the supply conveyor (10) onto the XY child table 1),
The board (2) on the XY child table 1) is transferred to the discharge conveyor (1).
1) Place it on top.
該プリント基板(2)上には下流にある図示しない部品
装着装置により、図示しない抵抗、コンデンサ等の角型
チップ部品が、塗布され、た接着剤(8)の位置に合わ
せて装着されることになる。Square chip components such as resistors and capacitors (not shown) are applied onto the printed circuit board (2) by a downstream component mounting device (not shown), and are mounted in alignment with the positions of the adhesive (8). become.
以下第3図に基づきデイスペンサーユニット(7)につ
いて詳述する。The dispenser unit (7) will be described in detail below with reference to FIG.
前記塗布ヘッド(9)の上部には接着剤(8)が充填さ
れたシリンジ(14)が設けられており、該ヘッド(9
)の下部に設けられ該シリンジ(14〉と連通ずる2本
の塗布ノズル(Is)(15)より該接着剤(8)は吐
出きれる。該シリンジ(14)には接着剤(8)をノズ
ル(15)(15)より吐出させるため圧縮空気を送り
込むエアホース(16)が、取付けられている。A syringe (14) filled with adhesive (8) is provided at the top of the application head (9), and the application head (9) is provided with a syringe (14) filled with adhesive (8).
) The adhesive (8) can be completely discharged from the two application nozzles (Is) (15) provided at the bottom of the syringe (14) and communicating with the syringe (14). (15) An air hose (16) is attached to send compressed air to be discharged from (15).
(17)は支軸(18)を介して支持部材(19)に回
動自在に軸支きれている上下動レバーで、一端のローラ
(20)は前記塗布ヘッド(9)上部に設けられた一対
の係止部(21)(21)間に嵌合きれ、他端のローラ
(22)はバネ(23)により駆動カム(24)に圧接
するように付勢されている。前記カム(24)は、カム
駆動回路(25)により回動きれる上下動モータ(26
)により回動きれる。(17) is a vertically moving lever rotatably supported on a support member (19) via a support shaft (18), and a roller (20) at one end is provided on the top of the coating head (9). It is completely fitted between the pair of locking parts (21), and the roller (22) at the other end is biased by a spring (23) so as to come into pressure contact with the drive cam (24). The cam (24) is driven by a vertical motor (26) that is rotated by a cam drive circuit (25).
) can be rotated.
また塗布ヘッド(9)はギア(27〉に嵌着きれ、回転
ギアモータ駆動回路(28)により駆動される回転ギア
モータ(29〉により回動されるギア(30)と噛合さ
れている0回転ギアモータ(29)及びギアク30)は
プリント基板(2)に対して上下動せず固定されており
、ギア(27)はギア(30)に対して上下動しなから
噛合し回動することになる。Further, the application head (9) is fully fitted into the gear (27>), and the 0-rotation gear motor ( The gears 29) and 30) are fixed to the printed circuit board (2) without moving up and down, and the gear (27) does not move up and down with the gear (30), but meshes with and rotates.
第4図において、(32〉はプリント基板<2〉上の接
着剤(8)を塗布すべきXY座標位置及び塗布ヘッド(
9)の回転ギアモータ(29)の回動による水平面での
上方から見た回転角度であるθ回転角度位置データを塗
布順番毎に格納する塗布位fNcデータを記憶するRA
Mであり、(33〉は塗布動作に関するプログラムが収
納されているROMである。In FIG. 4, (32> is the XY coordinate position and application head (
RA for storing application position fNc data that stores θ rotation angle position data, which is the rotation angle seen from above on a horizontal plane due to the rotation of the rotary gear motor (29) of 9), for each application order.
M, and (33>) is a ROM in which programs related to coating operations are stored.
該θ回転角度位置の0(ゼロ)度は、塗布ヘッド(9)
の2本のノズル(15)(15)のセンター(一方のセ
ンターをN11他方のセンターをN、とする、)間を結
ぶ直線がXYテーブル(1)のY軸に平行となる2つの
回転角度位置のどちらか一方の回転角度位置としている
。すなわち、X軸にはN1゜N、を結ぶ直線に直角な直
線が平行となる。このθ回転角度位置データは、部品装
着装置により装着されるチップ部品のθ方向の回転角度
位置のデータと一致することになる。0 (zero) degree of the θ rotation angle position is the coating head (9)
Two rotation angles at which the straight line connecting the centers of the two nozzles (15) (15) (one center is N1 and the other center is N) is parallel to the Y axis of the XY table (1). The rotation angle position is one of the two positions. That is, a straight line perpendicular to the straight line connecting N1°N is parallel to the X-axis. This θ rotation angle position data coincides with data on the rotation angle position in the θ direction of the chip component mounted by the component mounting device.
塗布ヘッド(9)に設けられた2本の塗布ノズル(15
)(15)のノズルセンターN、、N、間の中点(以下
塗布ノズル間中点と記す。)の位置が、前述の塗布すべ
きXY座標位置に位置されるもので、この点が接着剤(
8)の塗布位置を決める塗布の基準点となる。塗布ノズ
ル(15)(15)は、塗布ノズル間中点と塗布ヘッド
の回動の中心である塗布ヘッド回転センターをなるべく
一致させるよう設けられるのであるが、まったく一致さ
せることはできず、例えば上方から塗布ヘッド(9〉を
見た場合の図である第5図に示されるようにズレが生じ
る。Two coating nozzles (15) provided on the coating head (9)
) (15) The midpoint between the nozzle centers N, , N (hereinafter referred to as the midpoint between coating nozzles) is located at the XY coordinate position to be coated, and this point is Agent (
8) This serves as a coating reference point for determining the coating position. The coating nozzles (15) (15) are installed so that the middle point between the coating nozzles and the rotation center of the coating head, which is the center of rotation of the coating head, coincide as much as possible, but it is not possible to make them coincide at all. As shown in FIG. 5, which is a view when looking at the coating head (9>), a shift occurs.
そこでRA M (32)にはさらに、塗布ノズル間中
点OMと塗布ヘッド回転センター〇、の間のズレである
距離!及び0.よりOMを通る半直線を半直線0.0、
とし、03より各ノズル(15)のセンター間を結ぶ直
線に直角に引いた半直線を半直線Ot Xとするときの
半直線0.Xより反時計方向に半直線0.OMまでの角
度である第5図に表わされるような角度αが、記憶され
ている。Therefore, RAM (32) further contains the distance that is the deviation between the midpoint OM between the coating nozzles and the coating head rotation center 〇! and 0. The half line passing through OM is half line 0.0,
The half line Ot Half line 0. counterclockwise from X. The angle α as represented in FIG. 5, which is the angle to OM, is stored.
半直線O1Xは接着剤(8〉の塗布角度を決める塗布ヘ
ッド上の基準線であり、第5図の状態では半直線0.X
はXYテーブル(1)のX軸に平行であり、塗布ヘッド
(9)は0(ゼロ)度のθ回転角度位置にある。この角
度αは、塗布の基準点である02が回転の中心であるO
lより半直線o8Xからみてどの方向にあるかを示すこ
とになる。The half line O1X is the reference line on the application head that determines the application angle of the adhesive (8〉).
is parallel to the X axis of the XY table (1), and the coating head (9) is at a θ rotation angle position of 0 (zero) degree. This angle α is calculated from 02, which is the coating reference point, and 0, which is the center of rotation.
l indicates which direction it is in when viewed from the half line o8X.
(34)はCPUであり、RAM(32)及びROM(
34)に記憶されているデータ、プログラムに基づき、
インターフェース(35)を介して各駆動回路(3)(
5)(25)(28)を制御することにより塗布動作の
制御を行なう。(34) is the CPU, RAM (32) and ROM (
Based on the data and programs stored in 34),
Each drive circuit (3) (
5) The coating operation is controlled by controlling (25) and (28).
RAM(32)に格納されているn番目の塗布位置座標
が(Xn、Yn)であり、θ回転角度位置がθnであり
、該データに基づき回転センターO6の位置が(Xn、
Yn)にあるようにXYテーブル(1)を移動し00度
の角度位置に回転ギアモータ(29)を回動させ塗布ヘ
ッド(9)を位置させると、Oyの位置はX = Xn
+ l cos(θn+ a ) 、 Y = Yn+
esin (θn+a)で表わされるため、CPU(
34>は上述の計算の後X方向にff1cos(θn+
α)モしてY方向に1sin(θn+α)補正した距離
XY子テーブル1)を移動させ、Oうを第6図のように
X−Xn−1cos(θn+a )、Y=Yn−1si
n(θn+α)に停止させ0、を(Xn、Yn)に位置
させる。The nth coating position coordinates stored in the RAM (32) are (Xn, Yn), the θ rotation angle position is θn, and based on the data, the position of the rotation center O6 is (Xn, Yn).
When the XY table (1) is moved and the rotary gear motor (29) is rotated to the angular position of 00 degrees to position the application head (9) as shown in Yn), the position of Oy is X = Xn
+ l cos(θn+ a ), Y = Yn+
Since it is expressed as esin (θn+a), the CPU (
34> is ff1cos(θn+
α) Move the distance XY child table 1) corrected by 1 sin (θn+α) in the Y direction, and move O as X−Xn−1cos(θn+a), Y=Yn−1si
It is stopped at n(θn+α) and 0 is located at (Xn, Yn).
塗布ヘッド(9)の回動は、図示しない回転原点検出手
段に検出される回転原点位置を基準角度位置として所定
回転角度位置に回動するようCPU(34)が回転ギア
モータ駆動回路(28)を制御して回転ギアモータ(2
9)の回動によりなされるのであるが、塗布ヘッド(9
)上の前記半直線O1Xの角度位置が回転原点位置を基
準としてどれだけズしているかを示すズし角度量が、前
記RA M (32)には記憶されており、塗布ヘッド
(9)の取付は方により回転原点位置に対し半直線O1
Xの角度位置が変っても補正できるようになされている
。The CPU (34) controls the rotary gear motor drive circuit (28) to rotate the application head (9) to a predetermined rotational angle position using the rotational origin detected by a rotational origin detection means (not shown) as a reference angular position. Control and rotate gear motor (2
This is done by rotating the application head (9).
) is stored in the RAM (32) and indicates how much the angular position of the half line O1X on the axis of rotation is shifted from the rotation origin position, and is stored in the RAM (32). Depending on the direction of installation, it may be a half-straight line O1 relative to the rotation origin position.
Even if the angular position of X changes, it can be corrected.
以上のような構成により、以下動作について説明する。The operation of the above configuration will be described below.
本実施例では前述のPが0.5mで、αは30度である
ものとする。In this embodiment, it is assumed that the above-mentioned P is 0.5 m and α is 30 degrees.
先ず、プリント基板(2)は供給フンヘア(1o)に搬
送されて来て、乗せ換えユニット(12)に、lXYテ
ーブル(1)に乗せ換えられ載置される。このときCP
U(33)は、回転ギア駆動回路(28)を制御し回
転ギアモータ(29)を回動芒せ、ギア(27)及びギ
ア(30)を介して塗布へラド(9)をθ回転角度位置
が0(ゼロ)度の位置まで回動させて停止させる。First, the printed circuit board (2) is conveyed to the supply board (1o), transferred to the transfer unit (12), and placed on the lXY table (1). At this time, CP
U (33) controls the rotary gear drive circuit (28) to rotate the rotary gear motor (29), and moves the coating rod (9) to the θ rotation angle position via the gear (27) and gear (30). Rotate to the 0 (zero) position and stop.
また、XYテーブル(1)はプリント基板(2)の原点
(0,0)がOIIに位置するよう移動される。Further, the XY table (1) is moved so that the origin (0,0) of the printed circuit board (2) is located at OII.
CPU(34)は第7図のようにRAM(32)に格納
されている塗布位tNcデータのうち第1番目の塗布位
tX−200,Y−250(単位はm5−c’ある。)
及びθ回転角度θ−0(ゼロ)度を読出し、前述の計算
式に基づき、Oおを座標(200,250)に位置させ
るため0.の停止すべき位置をX=200−0.5Xc
os30°露20〇−0,257T、Y−250−0,
5Xsin30°奪249.75と算出する。そして、
CPU(34)はX軸モータ駆動回路(3)及びY軸モ
ータ駆動回路(5)を夫々制御し、X軸モータ(4)及
びY軸モータ(6)を回動きせXY子テーブル1)の上
記算出結果の位置に0.を位置きせる。こうして塗布ノ
ズル間中点(OM)は、XY子テーブル1)に載置され
たプリント基板(2)の座標(200,250)の位置
に停止する。The CPU (34) calculates the first coating position tX-200, Y-250 (the unit is m5-c') among the coating position tNc data stored in the RAM (32) as shown in FIG.
and θ rotation angle θ-0 (zero) degrees, and based on the above calculation formula, set 0 to position O at the coordinates (200, 250). The position to stop is X=200-0.5Xc
os30°dew 200-0,257T, Y-250-0,
Calculate 5X sin 30° deprivation 249.75. and,
The CPU (34) controls the X-axis motor drive circuit (3) and the Y-axis motor drive circuit (5), respectively, and rotates the X-axis motor (4) and Y-axis motor (6) to rotate the XY child table 1). 0 at the position of the above calculation result. position. In this way, the midpoint (OM) between the coating nozzles stops at the position of the coordinates (200, 250) of the printed circuit board (2) placed on the XY child table 1).
そして、CPU(34)はカム駆動回路(25)を制御
し上下動モータ(26)を回動させる。すると駆動カム
(24)が回動され、ローラ(22)を介して上下動レ
バー(17)がバネ(23)の付勢力により第3図の反
時計方向に支軸(18)のまわりに回動し、ローラ(2
0)及び係止部(21)を介して塗布ヘッド(9)が、
ギア(27)がギア(30)を摺動する状態で下降する
。このときすでに、エアホース(16)を介して圧縮空
気によりシリンジ(11)内の接着剤(8)が塗布ノズ
ル(15)(15)の先端部に吐出きれており、塗布ヘ
ッド(9)の下降によりプリント基板(2)上に塗布き
れる。The CPU (34) then controls the cam drive circuit (25) to rotate the vertical movement motor (26). Then, the drive cam (24) is rotated, and the vertical lever (17) is rotated counterclockwise in FIG. 3 around the support shaft (18) via the roller (22) due to the biasing force of the spring (23). move, roller (2
0) and the locking part (21), the application head (9)
The gear (27) descends while sliding on the gear (30). At this time, the adhesive (8) in the syringe (11) has already been completely discharged to the tip of the application nozzle (15) by compressed air via the air hose (16), and the application head (9) is lowered. The coating can be completely applied onto the printed circuit board (2).
さらに上下動モータ(26)が回動すると、上下動レバ
ー(17)は時計方向に回動し塗布ヘッド(9)は上昇
し第1番目の塗布動作が終了する。When the vertical movement motor (26) further rotates, the vertical movement lever (17) rotates clockwise, the coating head (9) rises, and the first coating operation ends.
次にCPU(34)は、RAM(32)より第2番目の
塗布位tX=150.Y−200及びθ=30度を読出
し、第1番目の塗布と同様に0.の停止すべき位置をX
= 150−0.5 Xcos60°=149.75
、 Y=200−0.5Xsit+60@=20o−0
,25,1−丁と算出する。そこでCPU(34)は、
第1番目の0.の停止位置より算出した第2番目のO6
の停止位置までの移動距離を、XY子テーブル1)が移
動するようX軸モータ(4)及びY軸モータ(6)を回
動移せる。Next, the CPU (34) selects the second application position tX=150. from the RAM (32). Read Y-200 and θ=30 degrees, and apply 0. The position to stop is X
= 150-0.5 Xcos60°=149.75
, Y=200-0.5Xsit+60@=20o-0
, 25, 1-cho. Therefore, the CPU (34)
The first 0. The second O6 calculated from the stop position of
The X-axis motor (4) and the Y-axis motor (6) can be rotated so that the XY child table 1) moves the moving distance to the stop position.
また、CPU(34)は回転ギアモータ駆動回路(28
)を制御し回転ギアモータ(29)を回動させ、ギア(
27〉及びギア(30)を介して塗布ヘッド(9)を上
方から見て反時計方向に30度回動させる。こうして、
OMはプリント基板(2)の座標(150,200)の
位置に停止する。The CPU (34) also operates a rotary gear motor drive circuit (28).
) to rotate the rotary gear motor (29), and the gear (
27> and the gear (30), the coating head (9) is rotated 30 degrees counterclockwise when viewed from above. thus,
OM stops at the position of coordinates (150, 200) on the printed circuit board (2).
そして、CPU(34)は駆動回路(25)を制御し上
下動モータ(26)を回動させ、第1番目の塗布動作と
同様にして接着剤(8〉をプリント基板(2)上に塗布
する。Then, the CPU (34) controls the drive circuit (25) to rotate the vertical movement motor (26), and applies the adhesive (8>) onto the printed circuit board (2) in the same manner as the first application operation. do.
次にCPU(34)は、RA M (32)より第3番
目の塗布位置X=170.Y=100及びθ=90度を
読出し、前述と同様に06の停止すべき位置をX= 1
70−0.5 Xcosl 20°=170.25 、
Y= 100−0.5Xsin120″″=1000
.251丁と算出し、この位置に前述と同様にしてOつ
を停止させると共に、塗布ヘッドを60度反時計方向に
回動きせ、90度のθ回転角度位置とする。こうして、
OMをプリント基板(2)の座標(170,100)に
位置させた後、前述と同様に塗布ヘッド(9)を下降さ
せ接着剤(8)をプリント基板(2)に塗布させる。Next, the CPU (34) selects the third coating position X=170. from the RAM (32). Read Y = 100 and θ = 90 degrees, and set the position where 06 should stop as described above to X = 1
70-0.5 Xcosl 20°=170.25,
Y= 100-0.5Xsin120″″=1000
.. 251 teeth is calculated, and in the same manner as described above, the coating head is stopped at this position, and the coating head is rotated counterclockwise by 60 degrees to reach the θ rotation angle position of 90 degrees. thus,
After positioning the OM at the coordinates (170, 100) of the printed circuit board (2), the coating head (9) is lowered to apply the adhesive (8) to the printed circuit board (2) in the same manner as described above.
以下同様にして塗布動作を続行し、当該プリント基板(
2)の全ての塗布位置に対する塗布が終了したとき、乗
せ換えユニット(12)は該基板(2)を排出コンベア
(11)に移載する。すると、排出フンベア(11)は
該基板(2)を搬送し、次工稈に排出する。The coating operation is continued in the same manner, and the printed circuit board (
When the coating of all the coating positions in step 2) is completed, the transfer unit (12) transfers the substrate (2) to the discharge conveyor (11). Then, the discharge carrier (11) transports the substrate (2) and discharges it to the next culm.
尚、塗布ヘッド(9〉のO(ゼロ)度のθ回転角度位置
は上述の位置でなくとも0(ゼロ)度ときめた角度位置
でのXY子テーブル1)のX軸からの半直線OヮOMの
角度位置の値をRA M (32)が記憶して上述のα
の代りに用いればどの位置でもよいが、チップ部品を装
着する際のθ回転角度データとのズレ角度は記憶してお
き、角度ズレがおきないように補正されなければならな
い。Note that the θ rotation angle position of the coating head (9>) at O (zero) degrees does not have to be the above-mentioned position, but is a half line O from the X axis of the XY child table 1) at the angular position determined as 0 (zero) degrees. RAM (32) stores the value of the angular position of ヮOM and calculates the value of α as described above.
Any position may be used instead of , but the angle of deviation from the θ rotation angle data when mounting the chip component must be memorized and corrected to prevent angular deviation.
また、半直線0.0.がX軸に平行になる塗布ヘッド(
9)のθ回転角度位置を0(ゼロ)度の位置としても用
いる塗布位置データが前述と同じ基準線を0(ゼロ)度
として示きれるならば前述のαをRA M (32)に
記憶して前述と同一の計算式に基づきXY移動の制御を
行なうことになる。Also, the half line 0.0. is parallel to the X-axis (
If the application position data using the θ rotation angle position in 9) as the 0 (zero) degree position can indicate the same reference line as above as 0 (zero) degree, then the above α should be stored in RAM (32). The XY movement will be controlled based on the same calculation formula as described above.
また、上記実施例では0.とOwのズレ量を距離Pと角
度αを用いて表わしたが、ノズルセンター間を結ぶ直線
に平行な成分と直角方向の成分としてズレを表わし記憶
し、これら成分データに基づきθ回転による補正量を計
算して補正移動させるようにしてもよい。Further, in the above embodiment, 0. The amount of deviation between and Ow is expressed using the distance P and angle α, but the deviation is expressed and memorized as a component parallel to the straight line connecting the nozzle centers and a component in the perpendicular direction, and based on these component data, the amount of correction by θ rotation is calculated. It is also possible to calculate and perform a corrective movement.
さらに、上記実施例では、塗布ノズル間中点をRAM(
32)に格納されたXY座標データの位置に停止きせる
ようにXY子テーブル移動を補正したが、第2の実施例
として塗布ヘッド(9)に取付けられた2本の塗布ノズ
ル(15)(15)のセンター間を結ぶ直線方向のズレ
のみを補正するようにしてもよい。Furthermore, in the above embodiment, the midpoint between the coating nozzles is stored in RAM (
The movement of the XY child table was corrected so as to stop at the position of the XY coordinate data stored in ) may be corrected only in the straight line direction connecting the centers.
すなわち、RAM(32)内のデータがX=Xn。That is, the data in the RAM (32) is X=Xn.
Y=Yn、θ=θnであり、補正しないで移動きせると
第8図のように回転中心である0、が(Xn。Y=Yn, θ=θn, and if the movement is made without correction, the rotation center 0, as shown in FIG. 8, becomes (Xn).
Yn)に位置し、塗布へ・yド(9)のθ回転角度位置
がθnに位置することになるのを、上記第1の実施例で
は塗布ノズル(15)のセンターN 8. N z間の
中点であるOlの位置が01の位置となるように補正し
ていたが、0.よりノズル(15)(15)センター間
を結ぶ直線に下した垂線の足の位t(第8図中0、)に
OMが位置するように補正するもので、ノズル間を結ぶ
直線上でのズレ量をd(前述の実施例でいうとd z
l sinα)として計算式で表わすと、01の停止位
置がX = Xn+ d sinθn、Y=Yn−dc
osθnである位i[AとなるようにXY子テーブル1
)を移動させることになる。In the first embodiment, the center N8 of the coating nozzle (15) is located at the center N of the coating nozzle (15). The position of Ol, which is the midpoint between Nz, was corrected to be at the 01 position, but the 0. This is a correction so that the OM is located at the foot position t (0, in Fig. 8) of the perpendicular line drawn to the straight line connecting the nozzles (15) (15) centers. The amount of deviation is d (in the above example, d z
When expressed in a calculation formula as (l sin α), the stopping position of 01 is
XY child table 1 so that osθn is i [A
) will be moved.
なぜこの方向のみの補正をするかというと、塗布ノズル
(15)(15)間を結ぶ直線方向にズレがある場合は
、わずかなズし量でも次工程で図示しないチップ部品を
接着剤(8〉の塗布位置に装着した場合に、2点塗布し
ているうち一方の接着剤(4)が部品に隠れてしまって
紫外線硬化性の接着剤の場合接着しなくなってしまった
り、あるいは一方の接着剤(8)の位置が部品に対して
外れてしまい接着できなくなることがあるが、この方向
に水平面内で直交する方向にわずかなスレ量があっても
部品の接着には影響しないから、塗布−ノズル(15)
(15)間を結ぶ直線方向のズしのみを補正するもので
ある。The reason for correcting only this direction is that if there is a deviation in the straight line direction connecting the coating nozzles (15) (15), even if the deviation is only a small amount, the chip parts (not shown) can be fixed with adhesive (8) in the next process. > If the adhesive (4) is applied to two points, one of the adhesives (4) will be hidden by the component and the adhesive will not adhere if it is an ultraviolet curable adhesive, or one of the adhesives will The adhesive (8) may be misaligned with respect to the parts, making it impossible to bond them, but even if there is a slight amount of scratching in a direction perpendicular to this direction in the horizontal plane, it will not affect the adhesion of the parts, so please apply it carefully. -Nozzle (15)
(15) Only the deviation in the straight line direction connecting the gaps is corrected.
また、上述の実施例は、XYケチ−ル(1)カXY移動
する例を説明したが、塗布ヘッド(9)がXY移動する
場合も同様に制御することができる。Further, in the above-described embodiment, an example in which the XY cutter (1) moves in XY is explained, but the same control can be performed when the coating head (9) moves in XY.
さらにまた、塗布ノズルが3本以上ある場合でも、塗布
の基準点を定め、その位置と塗布ヘッド回転中心とのズ
レ及び塗布角度を決める塗布ヘッド上の基準線と該基準
点のヘッド回転中心からの方向のズし角度を記憶するよ
うにすれば、同様に制御可能である。Furthermore, even when there are three or more coating nozzles, a reference point for coating is determined, and the deviation between that position and the center of rotation of the coating head and the coating angle are determined from the reference line on the coating head and the center of rotation of the head at the reference point. If the shift angle in the direction is memorized, control can be performed in the same way.
(ト〉発明の効果
以上のようにしたため本発明は、塗布へ・・・どの回転
の中心と塗布の基準点の間にスレがあってもプリント基
板の所望の位置に接着剤を塗布できる。(G) Effects of the Invention As described above, the present invention can apply adhesive to a desired position on a printed circuit board even when there is a thread between the center of rotation and the reference point of application.
第1図は本発明を適用せる塗布装置の平面図、第2図は
同装置の要部斜視図、第3図はデイスペンサーユニット
の側面図、第4図は本発明の制御系統のブロック図、第
5図及び第6図はXYテーブル上での塗布ノズルとノズ
ルセンター間の中点と塗布ヘッドの回転の中心の上方か
ら見た位置関係を表わす図、第7図は塗布位置NCデー
タを示す図、第8図は第2の実施例の説明のためのXY
テーブル上での塗布ノズルとノズルセンター間の中点と
塗布ヘッドの回転の中心の上方から見た位置関係を表わ
す図である。
(1)・・・XY子テーブル (2)・・・プリント基
板、〈3)・・・X軸モータ駆動回路、 (5)・・・
Y軸モータ駆動回路、 (8)・・・・・・接着剤、
(9〉・・・塗布ヘッド、(27)・・・ギア、 (2
8)・・・回転ギアモータ駆動回路、(30〉・・・ギ
ア、 <32)・・・RAM、 (34)・・・CPU
。FIG. 1 is a plan view of a coating device to which the present invention is applied, FIG. 2 is a perspective view of essential parts of the device, FIG. 3 is a side view of a dispenser unit, and FIG. 4 is a block diagram of a control system of the present invention. , Figures 5 and 6 are diagrams showing the positional relationship between the midpoint between the coating nozzle and the nozzle center on the XY table and the center of rotation of the coating head when viewed from above, and Figure 7 shows the coating position NC data. The diagram shown in FIG. 8 is an XY diagram for explaining the second embodiment.
FIG. 3 is a diagram showing the positional relationship between the midpoint between the coating nozzle and the nozzle center on the table and the center of rotation of the coating head when viewed from above. (1)...XY child table (2)...Printed circuit board, <3)...X-axis motor drive circuit, (5)...
Y-axis motor drive circuit, (8)...Adhesive,
(9>... Application head, (27)... Gear, (2
8)...Rotating gear motor drive circuit, (30>...Gear, <32)...RAM, (34)...CPU
.
Claims (1)
塗布ノズルより接着剤を吐出しテーブルに載置されたプ
リント基板の所望の位置に所望の回転角度だけ回動した
前記塗布ヘッドをXY移動駆動手段により相対的にXY
移動させて前記接着剤を塗布する塗布装置に於いて、塗
布位置を決める塗布ヘッド上の基準点と塗布ヘッドの回
転中心とのズレ距離及び該基準点と該回転中心を結ぶ直
線が塗布角度を決める塗布ヘッド上の基準線となすズレ
角度を記憶する第1の記憶手段と、接着剤を本来塗布す
べきXY座標位置及び塗布角度データを記憶する第2の
記憶手段と、該第1、第2の記憶手段に記憶された各情
報に基づきプリント基板の本来の塗布位置に本来の塗布
角度で接着剤を塗布できるよう前記駆動手段を制御する
制御手段とを設けたことを特徴とする塗布装置。(1) Adhesive is discharged from multiple application nozzles provided at the tip of a rotatable application head, and the application head, which has been rotated by a desired rotation angle, is placed at a desired position on a printed circuit board placed on a table. Relatively XY movement by XY movement drive means
In a coating device that moves to apply the adhesive, the deviation distance between the reference point on the coating head that determines the coating position and the rotation center of the coating head, and the straight line connecting the reference point and the rotation center determine the coating angle. a first storage means for storing the deviation angle made with a reference line on the application head to be determined; a second storage means for storing the XY coordinate position and application angle data at which the adhesive should originally be applied; and a control means for controlling the driving means so that the adhesive can be applied to the original application position of the printed circuit board at the original application angle based on each piece of information stored in the storage means according to item 2. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082514A JPH0828564B2 (en) | 1990-03-29 | 1990-03-29 | Coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2082514A JPH0828564B2 (en) | 1990-03-29 | 1990-03-29 | Coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03280590A true JPH03280590A (en) | 1991-12-11 |
| JPH0828564B2 JPH0828564B2 (en) | 1996-03-21 |
Family
ID=13776635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2082514A Expired - Fee Related JPH0828564B2 (en) | 1990-03-29 | 1990-03-29 | Coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0828564B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6562406B1 (en) | 1998-03-31 | 2003-05-13 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for applying viscous fluid |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS618998A (en) * | 1984-06-22 | 1986-01-16 | 松下電器産業株式会社 | Method of coating adhesive |
| JPH01310600A (en) * | 1988-06-09 | 1989-12-14 | Matsushita Electric Ind Co Ltd | Device for automatic installation of electronic component |
| JPH0263196A (en) * | 1988-08-29 | 1990-03-02 | Matsushita Electric Ind Co Ltd | Method for mounting electronic component |
-
1990
- 1990-03-29 JP JP2082514A patent/JPH0828564B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS618998A (en) * | 1984-06-22 | 1986-01-16 | 松下電器産業株式会社 | Method of coating adhesive |
| JPH01310600A (en) * | 1988-06-09 | 1989-12-14 | Matsushita Electric Ind Co Ltd | Device for automatic installation of electronic component |
| JPH0263196A (en) * | 1988-08-29 | 1990-03-02 | Matsushita Electric Ind Co Ltd | Method for mounting electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6562406B1 (en) | 1998-03-31 | 2003-05-13 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for applying viscous fluid |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0828564B2 (en) | 1996-03-21 |
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