JPH032807A - Optical semiconductor module - Google Patents
Optical semiconductor moduleInfo
- Publication number
- JPH032807A JPH032807A JP13761989A JP13761989A JPH032807A JP H032807 A JPH032807 A JP H032807A JP 13761989 A JP13761989 A JP 13761989A JP 13761989 A JP13761989 A JP 13761989A JP H032807 A JPH032807 A JP H032807A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- holding member
- semiconductor module
- adhesive
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 230000003287 optical effect Effects 0.000 title claims abstract description 25
- 239000013307 optical fiber Substances 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器用光源、光ファイバ通信システム等に
用いられる光半導体モジュールに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an optical semiconductor module used in light sources for measuring instruments, optical fiber communication systems, and the like.
（従来の技術）
発光ダイオードで発生した光を効率よく光ファイバに伝
送するため、発光ダイオードと光ファイバを一体にした
光半導体モジュールが一般に使用されている。(Prior Art) In order to efficiently transmit light generated by a light emitting diode to an optical fiber, an optical semiconductor module in which a light emitting diode and an optical fiber are integrated is generally used.
第２図はこのような光半導体モジュールの構成例を示し
たものである。ステンレス材等で構成された保持部材１
３は、集束性ロッドレンズ５を固定し、一方の端部の外
周にネジ結合部１１が設けられている。そして、この保
持部材１３の他方の端部には発光ダイオード素子２０が
半田７により固定され、一方の端部にはステンレス部材
等から成る光ファイバ端末部材１４がナツト１０により
螺合されている。光ファイバ端末部材１４は、光ファイ
バ２および光ファイバ２を被っている光ファイバ外被３
を固定している。そして、これら発光ダイオード素子２
０、集束性ロッドレンズ５および光ファイバ２は同一の
軸線上に位置されるように固定される。このような構成
にすることにより、′発光ダイオード素子２０で発生し
た光は、集束性ロッドレンズ５により収束されて光ファ
イバ２に効率よく伝送される。しかし、ナットト０は振
動その他の原因によりゆるむので、伝送効率が悪くなる
場合がある。このような事態が発生するのを防止するた
め、従来はネジ結合部１１に接着剤を充填して硬化させ
てゆるみを防止している。FIG. 2 shows an example of the configuration of such an optical semiconductor module. Holding member 1 made of stainless steel etc.
3 fixes the focusing rod lens 5, and a screw coupling part 11 is provided on the outer periphery of one end. A light emitting diode element 20 is fixed to the other end of the holding member 13 by solder 7, and an optical fiber terminal member 14 made of a stainless steel member or the like is screwed to one end by a nut 10. The optical fiber terminal member 14 includes an optical fiber 2 and an optical fiber jacket 3 covering the optical fiber 2.
is fixed. And these light emitting diode elements 2
0, the focusing rod lens 5 and the optical fiber 2 are fixed so as to be located on the same axis. With this configuration, the light generated by the light emitting diode element 20 is converged by the focusing rod lens 5 and efficiently transmitted to the optical fiber 2. However, since the nut 0 becomes loose due to vibration or other causes, the transmission efficiency may deteriorate. In order to prevent such a situation from occurring, conventionally, the threaded joint 11 is filled with an adhesive and cured to prevent loosening.
（発明が解決しようとする課題）
上述したように、従来の光半導体モジュールは、ネジ結
合部に接着剤を充填してネジのゆるみを防止している。(Problems to be Solved by the Invention) As described above, in the conventional optical semiconductor module, the screw joint portion is filled with an adhesive to prevent the screw from loosening.
従って、■接着剤の硬化温度は光半導体モジュールの使
用可能な温度範囲より狭いので、接着剤の硬化温度によ
り光半導体モジュールの使用可能な温度範囲が限定され
てしまう、■ネジ結合部に充填する接着剤の量を適切に
管理しなければならない、このように従来の光半導体モ
ジュールには解決すべき課題があった。Therefore, ■The curing temperature of the adhesive is narrower than the temperature range in which the optical semiconductor module can be used, so the temperature range in which the optical semiconductor module can be used is limited by the curing temperature of the adhesive.■ Filling the screw joints Conventional optical semiconductor modules have had problems to be solved, such as the need to appropriately manage the amount of adhesive.
本発明は、このような事情に鑑みてなされたものであり
、その目的は、接着剤を使用しなくとも光ファイバ端末
部材を保持部材に固定することができる光半導体モジュ
ールを提供することにある。The present invention has been made in view of the above circumstances, and an object thereof is to provide an optical semiconductor module in which an optical fiber terminal member can be fixed to a holding member without using an adhesive. .
（課題を解決するための手段）
本発明の光半導体モジュールは、上記目的を達成するた
めに、光半導体素子および集束性ロッドレンズを保持す
る保持部材の外周に雌ネジを形成し、前記保持部材に光
ファイバを保持する光ファイバ端末部付をナツトで螺合
した後接着剤で前記ナツトを固定している光半導体モジ
ュールにおいて、
前記保持部材と前記光ファイバ端末部材とを溶着する。(Means for Solving the Problems) In order to achieve the above object, an optical semiconductor module of the present invention includes a female thread formed on the outer periphery of a holding member that holds an optical semiconductor element and a focusing rod lens, and In an optical semiconductor module in which an optical fiber end part holding an optical fiber is screwed together with a nut and the nut is fixed with an adhesive, the holding member and the optical fiber end member are welded together.
（実施例）
次に、本発明の実施例について図面を参照して詳細に説
明する。(Example) Next, an example of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例の光半導体モジュールの断面
図である。第２図と同一符号は同一部分を示す、保持部
６と光ファイバ端末部材４とにネジ結合部８を設けて両
者を螺合し、結合部９Ａ。FIG. 1 is a sectional view of an optical semiconductor module according to an embodiment of the present invention. The same reference numerals as in FIG. 2 indicate the same parts. A screw coupling part 8 is provided on the holding part 6 and the optical fiber terminal member 4, and the two are screwed together to form a coupling part 9A.
９Ｂを高出力レーザ等によりスポット溶接を行う。9B is spot welded using a high-power laser or the like.
このようにスポット溶接を行うことにより、保持部材６
と光ファイバ端末部材４のゆるみを防止することができ
る。また、発光ダイオード素子１を発光ダイオード素子
保持部材１２で保持し、発光ダイオード素子保持部材１
２を保持部材６に同様にスポット溶接する。By performing spot welding in this way, the holding member 6
This makes it possible to prevent the optical fiber terminal member 4 from loosening. Further, the light emitting diode element 1 is held by the light emitting diode element holding member 12, and the light emitting diode element holding member 1 is held by the light emitting diode element holding member 12.
2 is similarly spot welded to the holding member 6.
このような構成の光半導体モジュールは次のようにして
埋立てる。まず、保持部材６で集束性ロッドレンズ５を
保持させる。そして、光ファイバ２の外被である光ファ
イバ外被３を保持している光ファイバ端末部材４を保持
部材６に入れ、ネジ結合部８により両者に隙間がないよ
うに螺合する。The optical semiconductor module having such a configuration is disposed of in a landfill as follows. First, the focusing rod lens 5 is held by the holding member 6. Then, the optical fiber terminal member 4 holding the optical fiber jacket 3, which is the jacket of the optical fiber 2, is put into the holding member 6, and screwed together with the screw coupling part 8 so that there is no gap between them.
次に、保持部材６と光ファイバ端末部材４との接合部９
Ａ、９Ｂを高出力レーザ等によりスポット溶接する。Next, the joint 9 between the holding member 6 and the optical fiber terminal member 4 is
Spot weld A and 9B using a high-power laser or the like.
その後、発光ダイオード素子１で発光した光が光ファイ
バ２に最も効率よく光ファイバ２に入射する最適な位置
に発光ダイオード素子１を調整する。そして、発光ダイ
オード素子保持部材１２と保持部材６との接合部９Ｃ，
９Ｄを同様にスポット溶接をする。Thereafter, the light emitting diode element 1 is adjusted to an optimal position where the light emitted by the light emitting diode element 1 enters the optical fiber 2 most efficiently. Then, a joint portion 9C between the light emitting diode element holding member 12 and the holding member 6,
Spot weld 9D in the same way.
以上の実施例では、光半導体素子として発光ダイオード
素子を用いたが、半導体レーザ素子、アバランシュ・フ
ォトダイオード素子、Ｐ Ｉ Ｎ−ＰＤ素子でもよい。In the above embodiments, a light emitting diode element was used as the optical semiconductor element, but a semiconductor laser element, an avalanche photodiode element, or a PIN-PD element may also be used.
また、光半導体素子を保持する保持部材、および光ファ
イパート用端末部材の材質はステンレスに限定されるも
のではない。Further, the material of the holding member that holds the optical semiconductor element and the terminal member for the optical fiber part is not limited to stainless steel.
（発明の効果）
以上に説明したように、本発明の光半導体モジュールは
、保持部材と光ファイバ端末部材とをスポット溶接によ
り固定する。従って、■接着剤を使用しなくてよいので
、光半導体モジュ、−ルの使用可能な範囲は、接着剤の
硬化温度に影響されない、また、■光半導体の保持部剤
と光ファイバコード用端末部剤はネジ結合部により固定
されているので保持部材と端末部材間に荷重を加えるこ
となく溶接することができる。(Effects of the Invention) As explained above, in the optical semiconductor module of the present invention, the holding member and the optical fiber terminal member are fixed by spot welding. Therefore, (1) there is no need to use adhesives, so the usable range of optical semiconductor modules is not affected by the curing temperature of the adhesive, and (2) optical semiconductor holding parts and terminals for optical fiber cords. Since the parts are fixed by the threaded joint, welding can be performed without applying any load between the holding member and the terminal member.
第１図は本発明の一実施例の光半導体モジュールの断面
図、
第２図は従来の光半導体モジュールの断面図である。
１．２０・・・発光ダイオード素子、２・・・光ファイ
バ、３・・・光ファイバ外被、４，１４・・・光ファイ
バ端末部材、５・・・集束性ロッドレンズ、６゜１３・
・・保持部材、７・・・半田、８．１１・・・ネジ結合
部、９Ａ、９Ｂ、９Ｃ，９Ｄ・・・接合部、１０・・・
ナツト、１２・・・発光ダイオード素子保持部材。FIG. 1 is a sectional view of an optical semiconductor module according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional optical semiconductor module. 1.20... Light emitting diode element, 2... Optical fiber, 3... Optical fiber jacket, 4, 14... Optical fiber terminal member, 5... Focusing rod lens, 6°13.
...Holding member, 7...Solder, 8.11...Screw connection part, 9A, 9B, 9C, 9D...Joint part, 10...
Nut, 12... Light emitting diode element holding member.
Claims (1)
部材の外周に雄ネジを形成し、前記保持部材に光ファイ
バを保持する光ファイバ端末部材をナットで螺合した後
接着剤で前記ナットを固定している光半導体モジュール
において、 前記保持部材と前記光ファイバ端末部材とが溶着してあ
ることを特徴とする光半導体モジュール。[Claims] A male thread is formed on the outer periphery of a holding member that holds an optical semiconductor element and a focusing rod lens, and an optical fiber terminal member that holds an optical fiber is screwed onto the holding member with a nut, and then an adhesive is applied. An optical semiconductor module in which the nut is fixed in the optical semiconductor module, wherein the holding member and the optical fiber terminal member are welded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13761989A JPH032807A (en) | 1989-05-31 | 1989-05-31 | Optical semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13761989A JPH032807A (en) | 1989-05-31 | 1989-05-31 | Optical semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032807A true JPH032807A (en) | 1991-01-09 |
Family
ID=15202910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13761989A Pending JPH032807A (en) | 1989-05-31 | 1989-05-31 | Optical semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032807A (en) |
-
1989
- 1989-05-31 JP JP13761989A patent/JPH032807A/en active Pending
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