JPH03283379A - Manufacture of electrical connecting member - Google Patents

Abstract

PURPOSE:To easily control the thickness of a holder and the pitch of conducting members by forming multiple first holes on an electric insulating material, sticking the first substrate formed with multiple second holes to the electric insulating material so that positions of the holes are matched, and filling a conducting material into the first and second holes. CONSTITUTION:A high-energy beam is independently radiated to an electric insulating material 1 serving as a holder 35 to form multiple first holes 4 with a pattern, a resist 6 serving as the first substrate is coated on a copper foil 5 serving as the second substrate, and it is exposed and developed with a preset pattern to form multiple second holes 7. The electric insulating material 1 and the first substrate 6 are stuck so that centers of the first and second holes 4, 7 are matched, a conducting material 9 serving as conducting members 34 is filled into the first and second holes 4, 7, and the first and second substrates 6, 5 are removed. The thickness of the holder 35 and the shapes and pitch of projections of the conducting members 34 can be freely controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing an electrical connection member used for electrically connecting electrical circuit components to each other.

[Conventional technology]

Examples of methods for electrically connecting electrical circuit components include wire bonding and TAB (Tape Out).

BACKGROUND ART Methods such as bonding (mated bonding) and the like are conventionally known. However, these methods have drawbacks such as being unable to cope with an increase in the number of connection points between both electric circuit components and being expensive. In order to solve these difficulties, it is possible to electrically connect electrical circuit components to each other using an electrical connection member that has a structure in which a plurality of conductive members are insulated from each other in an insulating holder. It is publicly known (Japanese Unexamined Patent Publication No. 63-2
22437, JP-A-63-224235, etc.).

FIG. 6 is a schematic diagram showing electrical connections between electrical circuit components using such electrical connection members, and in the figure, 31 is an electrical connection member, and 32 and 33 are electrical circuit components to be connected. show. The electrical connection member 31 includes a plurality of conductive members 34 made of metal or alloy, each of which is electrically insulated from each other, and provided in a holder 35 made of an electrically insulating material. , one end 38 of the conductive member 34 is exposed to one electric circuit component 32 side, and the other end 39 of the conductive member 34 is exposed to the other electric circuit component 33 side (FIG. 6 (al), and one end 39 of the conductive member 34 is exposed to the other electric circuit component 33 side. The connecting portion 36 of the other electric circuit component 32 and one end 38 of the conductive member 34 exposed on the side of the electric circuit component 32 are joined by alloying, and the connecting portion 37 of the other electric circuit component 33 and the electric circuit component By alloying the other end 39 of the conductive member 34 exposed on the 33 side, they are joined, and the electric circuit components 32 and 33 are electrically connected to each other (FIG. 6(b)).

Such an electrical connection member has the following advantages.

(2) By reducing the size of the conductive member, it is possible to miniaturize the connecting parts of electrical circuit components and increase the number of connection points, thereby enabling higher-density connections between electrical circuit components.

■ Even if electrical circuit components have different thicknesses, by changing the thickness of the electrical connection member, it is possible to always keep the height of the electrical circuit components constant, making multilayer connections easier and creating higher-density connections. Implementation is possible.

■ By increasing the protrusion height of the conductive member that is joined to the connection part of the electric circuit component, it is possible to perform stable joining even if the connection part of the electric circuit component is dropped from the surface, and it is possible to avoid complicated connections. Even electrical circuit components having different shapes can be easily connected to each other.

■ Heat generated from electrical circuit components is radiated through the holder of the electrical connection member, so changes in electrical characteristics due to heat are extremely small. In addition, it has excellent heat dissipation characteristics, so the effect of thermal fatigue is small and reliability is high.In this case, the holder may be made of an insulating material mixed with metal or ceramic with high thermal conductivity. If ceramic with high thermal conductivity is used as the holder, the effect will be even greater.

- Since the length of connection between electrical circuit components is shortened, impedance can be reduced and it is possible to increase the speed of electrical circuit components. By mixing a metal with a low dielectric constant into the holder, it is possible to reduce the parasitic capacitance and further reduce the impedance.

A method of manufacturing the above-mentioned electrical connection member for making electrical multi-point connections between electrical circuit components is disclosed in Japanese Patent Application No. 63-
There is one proposed in No. 133401. Hereinafter, this manufacturing method will be briefly explained based on FIG. 7, which schematically shows the steps.

First, prepare a base 51 made of a metal sheet such as copper foil (Fig. 7 (δ)), apply a photosensitive polyimide resin 52 onto this base 51 using a spin coater, and pre-bake at a temperature of around 100°C. (Figure 7(b)). Note that the thickness of the polyimide resin 52 to be applied is set to be thicker than the desired thickness of the holder in the electrical connection member to be manufactured, taking into account reduction due to curing shrinkage. After the polyimide resin 52 is irradiated (exposed) with light through a photomask (not shown) having a predetermined pattern, development is performed. The polyimide resin 52 remains in the exposed portions, and the polyimide resin 52 is removed in the unexposed portions by development processing to form a plurality of holes 53 (FIG. 7(C)). 2
After curing the polyimide resin 52 by raising the temperature to 00 to 400°C, the base body 51 is immersed in an etching solution and etched to form a recess 54 in the base body 51 that communicates with the hole 53 (Fig. 7). (d)). Next, gold plating is applied using the base body 51 as a common electrode, and the holes 53. The recess 54 is filled with gold 55, and gold plating is continued until a bump is formed (FIG. 7(e)).Finally, the base 51 is removed by etching to manufacture the electrical connection member 31 (see FIG. 7(e)). Figure (f)).

In the electrical connection member 31 manufactured in this manner, gold 55 constitutes the conductive member 34, and polyimide resin 5 constitutes the conductive member 34.
2 constitutes the holding body 35. Note that the electrical connection member 31
The dimensions of each part are as follows: The thickness of the polyimide resin 52 (holding body 35) is approximately 10 μm, the diameter of the hole 53 (conductive member 34) is approximately 20 μm, the pitch is approximately 40 μm, and the amount of protrusion of the conductive member 34 on both the front and back sides is approximately 10 μm. The thickness is approximately several μm.

[Problem to be solved by the invention]

However, as mentioned above, the patent application No. 13340/1983
The manufacturing method proposed in No. 1 still has the following problems, and there is room for further improvement.

Since the polyimide resin that will become the holder is applied to the base using a spin coater, it is not possible to form a thick holder. Furthermore, polyimide resin shrinks during thermosetting and has residual stress due to its linear expansion coefficient being different from that of the base material, making it difficult to control the film thickness of the holder and the pattern dimensions of the holes to be formed.

Photosensitive polyimide resin is PL-1100, 1200
(Hitachi Chemical @) Photonice (Higashi), Propimide (Ciba Geigy), Selectilanx (E
, Mark).

There are products such as Lisocoat (Ube Industries #a), but compared to the types of polyimide resins that have already been imidized and are commercially available, the number of them is still small and the selection range of materials is small. Moreover, its price is also very high.

Since holes are formed in polyimide resin using photolithography, it is extremely difficult to achieve an aspect ratio of 1 or more.
When the thickness of the polyimide resin (holding body) is increased, it is difficult to form fine holes.

Since the substrate is etched using the holder formed by photolithography as a mask material to create a mold for the protruding shape on one side of the conductive member, if the holder is made thicker, the etching solution tends to accumulate at the bottom of the hole. It is difficult for fresh etching liquid to come into contact with the substrate, and as a result, there are large variations in etching, which causes the protruding shapes of the conductive members to become irregular.

The present invention has been made in view of the above circumstances, and solves the above-mentioned problems, makes it easy to control the film thickness of the holder and the pitch of the conductive member, and eliminates the need to use photosensitive resin. An electrical connection member that has stable characteristics such as being able to form fine holes and recesses of a certain size with high precision even when the holder is thick, and that there is no variation in the protruding shape of the conductive member. An object of the present invention is to provide a method for manufacturing an electrical connection member that can be manufactured at low cost.

[Means to solve the problem]

A method for manufacturing an electrical connection member according to a first aspect of the present application includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state, each of the above-mentioned A method for manufacturing an electrical connection member, wherein one end of the conductive member is exposed on one surface of the holder, and the other end of each conductive member is exposed on the other surface of the holder, wherein the holder irradiating a plurality of regions of an electrically insulating material with a high-energy beam to form a plurality of first holes in the electrically insulating material; a step of providing a first base body formed at a predetermined position on a second base body in accordance with the formation interval of the holes; and aligning the center of the first hole and the center of the second hole. , a step of bonding the electrically insulating material and the first base; The method is characterized by comprising a step of filling a conductive material to become a conductive member, and a step of removing the first base and the second base.

In the method for manufacturing an electrical connection member according to a second aspect of the present application, in the first aspect, before the step of laminating the electrical insulating material and the first base, the first hole and/or the The second hole is filled with a material different from the electrically insulating material, and after the step of bonding the electrically insulating material and the first base, the second hole is filled with a material different from the electrically insulating material. Second
The method is characterized by comprising a step of removing the material filled in the hole.

[Effect]

In the method of manufacturing an electrical connection member of the present invention, a plurality of first holes are patterned by individually irradiating a high-energy beam onto an electrical insulating material serving as a holder. Therefore,
There is no need to consider shrinkage during heat curing as in the conventional method, and the film thickness of the holder can be easily controlled, and the hole formation pattern can also be easily controlled. Furthermore, it is no longer necessary to use a photosensitive resin as an electrical insulating material, allowing for a wider selection of materials and lowering costs. Furthermore, even if the electrically insulating material (holding body) is thick, fine holes with an aspect ratio of 1 or more can be formed. Furthermore, since the second hole that defines the protruding shape of the conductive member is formed independently in the first base without using the holder as a mask material, the second hole can be formed regardless of the thickness of the holder. Therefore, there is no variation in the size of the second hole, and the protruding shape of each conductive member in the manufactured electrical connection member is uniform.

In the second invention, the hole formed in the electrically insulating material and/or
Alternatively, after filling the holes formed in the first base with a soluble resin, the electrical insulating material and the first base are bonded together with an adhesive. By doing so, these holes will not be filled with adhesive and the adhesive will be easier to remove.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof.

(First example) FIG. 1 is a schematic cross-sectional view showing the steps of the first embodiment.

First, a polyimide resin film 1, which is an electrical insulating material, is prepared (FIG. 1(a)). Positive type masks 2, 2 having a predetermined pattern are placed on both sides of the polyimide resin film 1, and a high energy beam of excimer laser light 3 such as KrF or ArF is irradiated thereon. excimer laser
The molecular bonds of the polyimide resin in the irradiated portions are separated by the photon energy of the light 3, and a plurality of holes 4 (first holes) are formed that penetrate the polyimide resin film l (Fig. 1(b)). . At this time, since the same area is irradiated with excimer laser light 3 from both sides, it is possible to form a hole 4 with a smaller diameter and deeper than when irradiating from the - direction. As a method of irradiating the excimer laser light 3 with a desired size onto a predetermined position of the polyimide resin film 1, for example, the polyimide resin film 1 is placed on an X-Y stage, and the It is sufficient to control the amount of movement and the timing of spot irradiation. Alternatively, the excimer laser light 3 may be made into parallel light and irradiated onto the polyimide resin film 1 through the mask 2.

On the other hand, after coating the copper foil 5, which is the second substrate, with a resist 6, which will become the first substrate, it is exposed and developed in a predetermined pattern.
Forming a plurality of holes 7 (second holes) (Fig. 1(C))
. At this time, the diameter of the hole is larger than the diameter of the hole 4 formed in the polyimide resin film 1 and smaller than half the distance to the outer periphery of the adjacent hole 4. By doing so, in the manufactured electrical connection member, adjacent conductive members will not be electrically connected to each other, and there will be no omission of conductive members. Further, the width of the hole to be formed is made equal to the pinch of the hole 4 formed in the polyimide resin film l.

Next, each person holds the polyimide resin film 1 with a plurality of holes 4 formed therein and the resist 6 with a plurality of holes 7 formed therein.
The positions are aligned so that the center of each person 7 coincides with the center of each person 7, and they are pasted together using an adhesive 8. Then, the unnecessary adhesive 8 remaining in the holes 4 and 7 is removed by etching to completely communicate the corresponding holes 4 and 7, and the copper foil 5 is exposed (FIG. 1(d)). .

Next, the holes 4 and 7 are filled with gold 9 by gold plating using the copper foil 5 as a common electrode, and the polyimide resin film l
Gold plating is continued until the gold 9 protrudes from the surface, forming the conductive member 34 (FIG. 1(e)).Finally, the copper, resist 6 and adhesive 8 are etched, but the gold 9 and the polyimide resin are etched. Copper foil 5. The resist 6 and adhesive 8 are completely removed by etching to produce an electrical connection member 31 (FIG. 1(f)).

In the electrical connection member 31 manufactured in this way, the gold 9 constitutes the conductive member 34 and the polyimide resin film 1 constitutes the holder 35.

In addition, in the above-mentioned process, the polyimide resin film l
Another method of forming a plurality of holes 4 is possible. FIG. 2 is a schematic cross-sectional view showing this process. First, excimer laser light 3 is irradiated from one side of the polyimide resin film 1 to form holes up to about half the thickness (FIG. 2(a)), and then, The excimer laser beam 3 may be irradiated again toward the hole from the opposite side (FIG. 2(b)) to form a penetrating hole 4.

(Second Embodiment) FIG. 3 is a schematic sectional view showing the steps of a second embodiment of the present invention. Similarly to the first embodiment, a polyimide resin film 1 is prepared (FIG. 3(a)), and excimer laser light 3 is irradiated through a mask 2.2 to form a plurality of holes 4 in the polyimide resin film 1. (Figure 3(b)). Next, the soluble resin 10 is poured into the holes 4 formed in the polyimide resin film l to fill the holes 4 (FIG. 3(C)).

On the other hand, similarly to the first embodiment, a plurality of holes 7 are formed by exposing and developing the resist 6 applied to the copper foil 5 (Fig. 3(d)
)). Note that the relationship between the diameters and formation pitches of the holes 7 and 4 to be formed is the same as in the first embodiment.

Next, the polyimide resin film 1 and the resist 6 are aligned so that the center of the large size 4 and the center of the large size 7 coincide with each other, and bonded together using the adhesive 8 (FIG. 3(e)).
. Next, the soluble resin 10 filling the hole 4 is dissolved,
The hole 4 is formed again, and the unnecessary adhesive 8 is removed by etching, so that the hole 4 and the hole 7 are completely communicated with each other (FIG. 3(f)). As in the first embodiment, after filling the holes 4 and 7 with gold 9 by gold plating (FIG. 3(g)), the copper foil 5. The resist 6 and adhesive 8 are removed by etching to produce an electrical connection member 31 (FIG. 3(h)).

In the second embodiment described above, since the hole 4 is filled with the soluble resin lO, the adhesive 8 does not swell up on the side of the hole 4.
The hole 4 is not filled with the adhesive 8, and the etching removal of the adhesive 8 can be performed stably.

In addition, in the process of forming the holes 4, it goes without saying that a method as shown in FIG. 2 may be adopted.

(Third example) FIG. 4 is a schematic sectional view showing the steps of the third embodiment.

In the third embodiment, the steps in FIGS. 4(a) to 4(Q) are the same as those in FIG.
) to the process in Figure 1 (C), so
Identical parts are given the same numbers and their explanations will be omitted.

Soluble resin 11 is poured into the holes 7 formed in the resist 6 to fill the holes 7 (FIG. 4(d)). Next, the polyimide resin film 1 and the resist 6 are aligned so that the center of the bulge 4 coincides with the center of each hole, and the polyimide resin film 1 and the resist 6 are bonded together using an adhesive 8 (FIG. 4(e)).

Next, the adhesive 8 exposed at the bottom of the hole 4 is removed by etching, and the soluble resin 11 filling the hole 7 is dissolved to form the hole 7 again, and the hole 4 and hole 7 are completely closed. (Fig. 4(f)). As in the first embodiment, after filling the holes 4 and 7 with gold 9 by gold plating (FIG. 4(g)), the copper foil 5. The resist 6 and adhesive 8 are removed by etching to manufacture the electrical connection member 31 (see FIG. 4(h)
)).

In the third embodiment, since the soluble resin 11 is filled in the hole 7, the adhesive 8 does not bulge down on the side surface of the hole or fill the hole 7 with the adhesive 8. Etching can be removed stably. Furthermore, it is clear that by combining the above-described second embodiment and this third embodiment, it is possible to further prevent the adhesive 8 from going around.

It goes without saying that even in the third embodiment, the method shown in FIG. 2 may be adopted in the step of forming the holes 4.

(Fourth example) FIG. 5 is a schematic cross-sectional view showing the steps of the fourth embodiment.

In the same way as in the first embodiment, a polyimide resin film 1 is prepared, and as shown in FIG. 5(b)).

On the other hand, a metal foil 12, which is a first substrate, in which a plurality of through holes 7 (second holes) are formed is prepared (see FIG. 5).
C)). The diameter of the hole to be formed is larger than the diameter of the hole 4 formed in the polyimide resin film 1 (less than half the distance to the outer periphery of the adjacent hole 4, and the pinch of the hole is larger than the diameter of the hole 4 formed in the polyimide resin film 1). Make it equal to the pinch of the hole 4 formed. The metal foil 12 may be manufactured by photolithography and etching, or by laser beam irradiation for drilling holes in the polyimide resin film 1. Next, this metal foil 12 and the copper foil 5, which is the second base, are bonded together using an adhesive 13, and unnecessary adhesive 13 is removed by etching so that no adhesive 13 remains at the bottom of the hole. (Figure 5(d)).

Next, each person 4 holds the polyimide resin film 1 with a plurality of holes 4 formed therein and the metal foil 12 with a plurality of holes 7 formed therein.
The center of each person 7 is aligned so that the center of the person 7 matches the center of the person 7, and the images are pasted together using an adhesive 14. Then, the remaining unnecessary adhesive 14 is removed by etching, and the corresponding hole 4 is removed.
and the hole 7 are completely communicated with each other, and the copper foil 5 is exposed (
Figure 5 ((!l).

Next, the holes 4 and 7 are filled with gold 9 by gold plating using the copper foil 5 as a common electrode, and the polyimide resin film 1 is
Gold plating is continued until the gold 9 protrudes from the surface of the plate, forming a conductive member 34 (FIG. 5(f)).Finally, the copper, metal foil 12 and adhesives 13 and 14 are etched, but the gold 9 and polyimide are etched. Copper foil 5. Using an etching solution that does not etch the resin. The electrical connection member 31 is manufactured by completely removing the metal foil 12 and adhesives 13 and 14 by etching (FIG. 5 (gl)).

In addition, in this fourth embodiment, when the above-mentioned second embodiment and/or third embodiment is applied, that is, when the formed holes 4 and/or holes 7 are filled with a soluble resin, Needless to say, the adhesive 14 can be stably removed by etching.

Also in the fourth embodiment, it goes without saying that the method shown in FIG. 2 may be adopted in the step of forming the holes 4.

In the embodiment described above, KrF,
Although an excimer laser beam such as ^rF was used, any laser beam having enough energy to perforate the polyimide resin film 1 to a desired size may be used. For example, in addition to excimer laser light, CO□ laser light, YAG laser light, N2 laser light, ^r laser light, Kr laser light, etc. can be used. Focused ion beam etching (FIBE)
), ion beam etching (IBB), electron beam etching (EBE), sputter etching, etc., which use ion beams, and electrical discharge machining, which uses electric beams. It is necessary to create a vacuum state, and in electric discharge machining, it is difficult to perform minute hole machining due to the processing restrictions of the probe.Currently, it is optimal for the present invention to use a laser beam as a high-energy beam.

In addition, although it was decided to fill gold 9, which will become the conductive member 34, by a plating method, other methods, such as CVD (chew
Alternatively, selective growth may be performed using ical vapor deposition.

In the electrical connection member manufactured according to the present invention, a plurality of conductive members are exposed on a holder made of an electrically insulating material. Also,
Some have wiring patterns. At that time, the wiring pattern may be present inside the holder, or may be present on one or both surfaces of the holder. The individual conductive members provided and the wiring pattern may or may not be electrically connected. Further, the electrical connection may be made inside the holder, or may be made on one or both sides of the holder.

The material of the wiring pattern is not limited to metal materials, but may be other conductive materials. Note that it is preferable that the end of the connecting portion of the conductive member has a convex shape. Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

Further, in this embodiment, gold 9 was used as the material of the conductive member 34, but in addition to gold (Au), Cu, Be, Ca
.

Mg, Mo+ Ni+ W, Fe, Ti+ In
, Tar Zn, AI+ Sn.

Metals or alloys such as Pb-5n can be used. The conductive member 34 may be made of one kind of metal or alloy, or may be made of a mixture of several kinds of metals and alloys. Alternatively, a metal material containing one or both of an organic material and an inorganic material may be used. Note that the cross-sectional shape of the conductive member 34 can be circular, square, or other shapes, but a shape without corners is desirable in order to avoid excessive concentration of stress. Further, the conductive member 34 is connected to the holding body 3
It is not necessary to arrange them perpendicularly in the holding body 35, but they may be arranged obliquely from one side of the holding body 35 to the other side of the holding body 35.

Further, the thickness of the conductive member 34 is not particularly limited. In addition,
The exposed portion of the conductive member 34 may be on the same surface as the holder 35, or may protrude from the surface of the holder 35. however,
In order to stably connect to the connection part of the electric circuit component and ensure reliability of the connection part, the conductive member 34 connected to the connection part of the electric circuit component should stably protrude from the holder 35. It is desirable to do so.

Further, in this embodiment, the polyimide resin film 1 is used as the electrical insulating material serving as the holder 35, but other films such as epoxy resin, silicone resin, etc. may also be used. In addition, powder, fibers,
One or more types of inorganic materials and metal alloy materials may be dispersed and contained in a desired shape such as a plate-like body, a rod-like body, and a spherical body. Specifically, the contained metal material 1 alloy material is ^U, 8g Cu, AI+ B
e, Ca, AgtMo, Fe, Ni, Co+
Mn+ W, Cr, Nb+ Zr, Ti+ T
a.

Examples include Zn, Sn+ Pb4n, etc., and the contained inorganic materials include 5IOz+ BzOs+ 8t, o, +
Na2O, K, 0+ Cab.

ZnO, Bad, PbO, 5bzO: ++ 85
z03+ Lazy3. Zr0z+ PJs+
Ti0z, MgO+ 4; +C, Bed, Bp,
BN+ AINI B4CI TaC.

TiBz+ CrBz+ TiN+ Si3N4+ T
Ceramics such as ag's.

Examples include diamond, glass, carbon, and boron.

Further, in this example, the copper foil 5 was used as the second base, but
Not limited to this, ＾u, Agt Be, Ca, Ag
t Mo.

Ni, W, Fe, Ti, In, T
a, Zn, 81. Sn, Pb-5n
A thin plate of metal or alloy such as can be used. However, since the substrate is selectively etched away in the final step,
It is necessary that the material of the conductive member 34 and the material used for the base body be different.

〔Effect of the invention〕

In the manufacturing method of the present invention, the plurality of first holes are formed by irradiating the electrically insulating material serving as the holder with a high-energy beam, so the material of the electrically insulating material is limited to photosensitive resin. This eliminates the problem of curing, making it possible to use even resins that have undergone curing reactions, increasing the range of material selection. Furthermore, it is possible to manufacture the electrical connection member using not only a resin but also an inorganic material as the holder in the same process.

Further, since the material can be freely selected, the thickness of the holder can be freely designed, and it is possible to provide an electrical connection member that is suitable for electrical circuit components. Furthermore, it is possible to significantly simplify the process compared to manufacturing electrical connection members using conventional photosensitive resins, and it is possible to significantly reduce costs.

Further, since the electrical insulating material serving as the holder is processed alone, it is possible to perform fine hole processing even when the thickness is increased, and it is possible to manufacture an electrical connection member with a high aspect ratio.

Furthermore, since the second hole that defines the protruding shape of the conductive member is formed independently in the first base body without using an electrically insulating material, the shape of the hole can be easily controlled. The protrusion shape can be freely controlled.

Therefore, even if the size of the conductive member or the pinch becomes extremely small, the amount of protrusion is stable, and it is possible to manufacture electrical connection members without missing conductive members or short circuits between adjacent conductive members, making it possible to manufacture electrical circuit components. It is possible to make higher density and finer connections between the two. Furthermore, it is possible to control the amount of protrusion of the conductive member according to the connection portion of the electric circuit components to be joined, and the reliability of joining can be improved.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing the steps of the first embodiment of the manufacturing method according to the present invention, FIG. 2 is a schematic sectional view showing the steps of a modification of the first embodiment, and FIG. 3 is the present invention. FIG. 4 is a schematic cross-sectional view showing the steps of the second embodiment of the manufacturing method according to the present invention, FIG. 5 is a schematic cross-sectional view showing the steps of the third example of the manufacturing method according to the present invention. FIG. 6 is a schematic cross-sectional view showing an example of the use of the electrical connection member; FIG. 7 is a schematic cross-sectional view showing the steps of a conventional manufacturing method. . ■...Polyimide resin film 2...Mask 3.
...Excimer laser light 4...Hole 5...Copper foil 6
...Resist 7...Hole 8...Adhesive 9...
・Gold 10, 11...Soluble resin 12...Metal FA
13... Adhesive 14... Adhesive 31... Electrical connection member 34... Conductive member 35... Holder

Claims (2)

[Claims] 1. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body insulated from each other, one end of each of the conductive members being exposed on one surface of the holding body. The method for manufacturing an electrical connection member in which the other end of each conductive member is exposed on the other surface of the holder includes irradiating a plurality of regions of the electrically insulating material serving as the holder with a high-energy beam. forming a plurality of first through holes in the electrical insulating material; and a step of forming a plurality of through first holes in the electrical insulating material; providing a base on a second base, aligning the center of the first hole and the center of the second hole, and bonding the electrical insulating material and the first base. a step of filling the first hole and the second hole with a conductive material that becomes the conductive member so as to be flush with or protrude from the surface of the electrically insulating material; A method for manufacturing an electrical connection member, comprising the step of removing a base and the second base. 2. Before the step of bonding the electrically insulating material and the first base, the method includes a step of filling the first hole and/or the second hole with a material different from the electrically insulating material. ,
The electrical insulator according to claim 1, further comprising the step of removing the material filled in the first hole and/or the second hole after the step of laminating the electrically insulating material and the first base. A method for manufacturing a connecting member.