JPH0328514Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an improvement of a hybrid IC board in which chip parts, resistors, capacitors, etc. constituting a predetermined circuit are provided on the board.

(Prior art) Conventional hybrid IC boards are described, for example, on pages 26 to 32 of "Electronic Technology Vol. 27, No. 3" (published by Nikkan Kogyo Shimbun Co., Ltd. on March 1, 1985). Those described are known.

This conventional publication describes a ceramic substrate using a ceramic material as a hybrid material, and this ceramic substrate is often used in general.

As shown in FIG. 4, this conventional hybrid IC substrate B generally includes a ceramic substrate 100,
A film material 101 and a circuit element 10 such as a chip component
2,103.

There are three types of film materials 101: conductors, resistors, and dielectrics. Among the dielectrics, there are insulating pastes for circuit insulation, protective glass pastes for resistors and circuits, pastes for forming capacitors, etc. There is.

(Problem that the invention attempts to solve) However, such conventional hybrid
In the case of IC board B, since a simple plate-shaped ceramic substrate was used, there was a problem in that the heat dissipation area was small and a high heat dissipation effect could not be expected.

For example, even if you try to use a power transistor as a circuit element, the heat dissipation of a ceramic substrate is too low compared to the power transistor's heat dissipation, so it cannot be incorporated into a hybrid IC board. It had to be installed separately.

(Means for Solving the Problems) The present invention was made with the purpose of solving the above-mentioned problems, and to achieve this purpose, the present invention uses ceramics as a substrate material. In a hybrid IC board using a substrate, a plurality of heat dissipation fins are formed integrally with the ceramic substrate, and holes are provided in the heat dissipation fins to serve as passages for a forced heat dissipation medium.

(Function) Therefore, in the hybrid IC board of the present invention,
As mentioned above, by forming a plurality of heat dissipation fins integrally with the ceramic substrate and providing holes in the heat dissipation fins that serve as passages for the forced heat dissipation medium, the heat dissipation area can be expanded and the heat dissipation area can be increased by the forced heat dissipation medium passing through the holes. High heat dissipation efficiency can be obtained by suppressing the temperature rise around the heat dissipation fins.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
In describing this embodiment, a hybrid IC board installed in an automobile equipped with an air conditioner will be taken as an example.

First, the configuration of the embodiment will be explained.

The hybrid IC substrate A of the embodiment includes a ceramic substrate 1, a film material 2, and a circuit element 3, as shown in FIGS. 1 and 2.

The ceramic substrate 1 is a substrate molded using a ceramic material, and this ceramic substrate 1 includes:
A plurality of heat dissipation fins 11 are formed by integral molding, and heat pipe holes 12 are formed in the heat dissipation fins 11 in a direction perpendicular to the direction of the fins.

The film material 2 is provided by being printed on the ceramic substrate 1 and fired together with the substrate, and three types of material, conductor, resistor, and dielectric material, are arranged depending on the circuit layout.

The circuit element 3 is provided on the film material 2, and as the circuit element 3, an IC chip 31, a power transistor 32, etc. are used.

In this example, the temperature of the hybrid IC board is controlled by simultaneously firing the POSISTOR 4 when firing the ceramic substrate 1, and then adding the electrode 5 by conductor printing and connecting the power line to this POSISTOR electrode. It is possible to add a fail-safe function that cuts off the power when ascending.

Next, the operation of the embodiment will be explained.

First, the hybrid IC board A of the embodiment is installed with the heat pipe 6 inserted into the heat pipe hole 12 of the heat radiation fin 11, as shown in FIG.

When the hybrid IC board A is used, the entire ceramic board 1 becomes hot due to heat generated from the power transistors 32, etc., and the temperature of the board gradually increases. 11 is provided, the rate of temperature rise can be suppressed by expanding the heat dissipation area, and the heat pipe 6 through which the refrigerant passes is provided to remove heat from the outer periphery of the heat pipe hole 12. This cooling effect makes it possible to forcibly lower the temperature of the ceramic substrate 1, and the temperature of the ceramic substrate 1 does not increase even if the amount of heat generated from the power transistor 32 and the like is large.

Although the embodiments of the present invention have been described above in detail with reference to the drawings, the specific configuration is not limited to these embodiments, and the present invention may be modified without departing from the gist of the present invention. included.

For example, in the embodiment, a hybrid IC board installed in a car equipped with an air conditioner is shown, but the present invention may be applied to various types of equipment other than automobiles, and the scope of application is not limited to the embodiment.

In addition, in the example, a thick film type hybrid IC substrate in which a film is formed by firing was shown, but
It can also be applied to thin-film type hybrid IC substrates on which films are formed by vapor deposition, etc., as well as multilayer wiring substrates and special function substrates.

In addition, in the embodiment, a preferable example was shown in which a heat pipe through which a refrigerant having a cooling effect passes as a forced heat dissipation medium is inserted through a hole. It may be arranged in a ventilation passage or a cold air passage.

Note that the forced heat dissipation medium includes not only a medium having a cooling effect such as a refrigerant or cold air, but also a blowing air that can enhance the heat dissipation effect by diffusing the radiant heat from the heat dissipation fins.

In addition, in the example, a circular hole that matches the shape of the pipe is shown as a hole provided in the heat dissipation fin, but
Depending on the installation location, required heat dissipation capacity, etc., a plurality of holes or holes of various shapes other than circular may be provided.

(Effects of the invention) As explained above, in the hybrid IC board of the invention, a plurality of heat dissipation fins are formed integrally with the ceramic substrate, and holes are provided in the heat dissipation fins to serve as passages for the forced heat dissipation medium. Therefore, a high heat dissipation effect can be obtained by expanding the heat dissipation area and suppressing the temperature rise around the heat dissipation fins by the forced heat dissipation medium passing through the holes.

Further, by forming the heat dissipation fins integrally with the ceramic substrate, not only can the heat dissipation effect be enhanced, but the number of parts does not increase, and it is also advantageous in terms of manufacturing cost.

[Brief explanation of drawings]

Fig. 1 is a front view showing a hybrid IC board according to an embodiment of the present invention, Fig. 2 is a side view of the embodiment board, Fig. 3 is a usage state diagram of the embodiment board, and Fig. 4 is a diagram showing a conventional hybrid IC board. FIG. 1... Ceramic substrate, 11... Heat dissipation fin,
12...Hole for heat pipe.

Claims (1)

[Scope of utility model registration request] A hybrid IC board using a ceramic substrate using ceramic as a substrate material, characterized in that a plurality of heat dissipation fins are formed integrally with the ceramic substrate, and holes are provided in the heat dissipation fins to serve as passages for a forced heat dissipation medium. IC board.