JPH0328528Y2 - - Google Patents
Info
- Publication number
- JPH0328528Y2 JPH0328528Y2 JP1983154482U JP15448283U JPH0328528Y2 JP H0328528 Y2 JPH0328528 Y2 JP H0328528Y2 JP 1983154482 U JP1983154482 U JP 1983154482U JP 15448283 U JP15448283 U JP 15448283U JP H0328528 Y2 JPH0328528 Y2 JP H0328528Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- base
- emitting diodes
- emitting diode
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
イ 産業上の利用分野
本考案はプリンタ用ヘツド等に用いる発光ダイ
オードアセンプリに関する。[Detailed Description of the Invention] A. Field of Industrial Application The present invention relates to a light emitting diode assembly used in printer heads and the like.
ロ 従来技術
従来発光ダイオードプリンタ等に用いるヘツド
等においては、第１図に示すようにセラミツク等
の基台１１に複数の発光ダイオード１２，１２…
をその発光部１３が整列するように配置してい
た。この時、例えばA4用のライン印字ヘツドで
は216mmにわたつて2048ドツトとなるように32個
の発光ダイオードを並べるが、それは1/10mmの等
間隔に発光部が整列しなければならない。しかし
発光ダイオード１２，１２…は連続配置可能なよ
うに対称形をなしており、１ドツト分（約1/10
mm）位置が離れて載置されても、ワイヤボンド工
程又は点灯、印字試験まで気づかない事が多い。B. Prior Art In a conventional head used in a light emitting diode printer or the like, as shown in FIG. 1, a plurality of light emitting diodes 12, 12...
were arranged so that their light emitting parts 13 were aligned. At this time, for example, in an A4 line printing head, 32 light emitting diodes are lined up so that there are 2048 dots over 216 mm, but the light emitting parts must be arranged at equal intervals of 1/10 mm. However, the light emitting diodes 12, 12... have a symmetrical shape so that they can be arranged consecutively, and the light emitting diodes 12, 12...
mm) Even if they are placed far apart, it is often not noticed until the wire bonding process, lighting, or printing test.
ハ 考案の目的
本考案は発光ダイオードの載置作業が容易に行
なえる発光ダイオードアセンブリを提供するもの
である。C. Purpose of the Invention The present invention provides a light emitting diode assembly in which the light emitting diode can be easily mounted.
ニ 考案の構成
本考案は基台上の結線部が発光部に対応してい
ることに着目し、基台の配線パターンを発光ダイ
オードの端部の位置がわかるよう特長付けるもの
で、以下本考案を実施例に基づいて詳細に説明す
る。D. Structure of the invention The present invention focuses on the fact that the wiring part on the base corresponds to the light emitting part, and features the wiring pattern of the base so that the position of the end of the light emitting diode can be seen. will be explained in detail based on examples.
ホ 実施例
第２図は本考案実施例の発光ダイオードアセン
ブリの要部平面図、第３図はその断面図である。
図において１はセラミツク等の基台で、２，２…
はその基台１の略中央部に一列に整列載置された
発光ダイオードである。この発光ダイオード２，
２…は例えばGaAsPとからGaAlAsからなり一列
に整列配置されたドツト間隔1/6乃至1/16mmの発
光部３，３…を有しており、発光ダイオード２，
２…はこの発光部３，３…が１ライン上に並ぶよ
うに配置される。４，４…は基台１の表面に設け
られた配線で、金又はコバルトニツケル等の印
刷、蒸着あるいはメタライズ層からなり、発光ダ
イオード２，２…の載置場所の近傍にはワイヤボ
ンドのための結線部５，５…が整列して発光部
３，３…に対し１対１に対応するように設けてあ
る。６，６…は駆動用の集積回路で、発光ダイオ
ード２，２…に対しその容量（ビツト数）に応じ
１対１、１対0.5、１対２等の割合の個数用いら
れ、基台１上に載置されている。７，７…は配線
を行なう金属細線でワイヤボンド法等が適用され
る。E. Embodiment FIG. 2 is a plan view of essential parts of a light emitting diode assembly according to an embodiment of the present invention, and FIG. 3 is a sectional view thereof.
In the figure, 1 is a base made of ceramic, etc., and 2, 2...
are light emitting diodes arranged in a line approximately in the center of the base 1. This light emitting diode 2,
2... has light emitting parts 3, 3... made of, for example, GaAsP to GaAlAs and arranged in a line with dot spacing of 1/6 to 1/16 mm, and the light emitting diodes 2,
2... are arranged so that the light emitting parts 3, 3... are lined up on one line. 4, 4... are wirings provided on the surface of the base 1, which are made of printed, vapor-deposited, or metallized layers of gold or cobalt nickel, etc., and there are wirings for wire bonding near the mounting locations of the light-emitting diodes 2, 2... The connecting portions 5, 5, . . . are arranged in a one-to-one correspondence with the light emitting portions 3, 3, . 6, 6... are driving integrated circuits, which are used in a ratio of 1:1, 1:0.5, 1:2, etc. to the light emitting diodes 2, 2... according to their capacity (bit number). is placed on top. 7, 7... are thin metal wires for wiring, and a wire bonding method or the like is applied.
上述の例において配線４，４…の結線部５，５
…は発光部３，３…の２倍のピツチ等で等間隔に
設けてあるが、発光ダイオード２，２…の略中央
部ではそのまま平行にパターンが設けてあるけれ
ど、発光ダイオード２，２…の端部においてはく
さび状の空所８，８…を設けるように傾斜してパ
ターンが設けてある。これは発光ダイオード２，
２…と集積回路６，６…の個数比から、発光ダイ
オード２，２…に対応して集積回路６，６…を配
置できることに着目し、発光ダイオード２，２…
の端部における配線４，４…の長さを、発光ダイ
オード２，２…の中央部におけるそれよりも長く
することによつて形成することが出来る。そして
発光ダイオード２，２…を載置するときは、この
空所８，８…が矢印の如く作業者又はパターン認
識装置に観察されるので、位置の確認が極めて容
易となる。 In the above example, the connection parts 5, 5 of the wirings 4, 4...
... are provided at equal intervals, such as twice the pitch of the light emitting parts 3, 3..., but the patterns are provided in parallel in the approximate center of the light emitting diodes 2, 2... A pattern is provided at an angle so as to provide wedge-shaped cavities 8, 8, . . . at the ends thereof. This is light emitting diode 2,
2... and the integrated circuits 6, 6..., it is noted that the integrated circuits 6, 6... can be arranged corresponding to the light emitting diodes 2, 2..., and the light emitting diodes 2, 2...
It can be formed by making the length of the wires 4, 4... at the ends of the light emitting diodes 2, 2... longer than that at the center of the light emitting diodes 2, 2.... When placing the light emitting diodes 2, 2, . . ., the spaces 8, 8, .
ヘ 考案の効果
以上の如く本考案は、基台と、整列配置された
発光部を有し、基板上に整列載置された複数の発
光ダイオードと、発光ダイオードの載置場所の近
傍の基台上に整列配置した結線部を有する配線と
を具備し、発光ダイオードの端部に位置する配線
のパターンを他の配線のパターンと異ならしめた
ものであるから作業性がよい。F. Effects of the invention As described above, the present invention has a base, a plurality of light emitting diodes arranged in an array, and a plurality of light emitting diodes arranged on a substrate, and a base near the place where the light emitting diodes are placed. It is easy to work because the pattern of the wiring located at the end of the light emitting diode is different from that of the other wirings.
第１図は従来の発光ダイオードアセンブリの要
部平面図、第２図は本考案実施例の発光ダイオー
ドアセンブリの要部平面図、第３図はその断面図
である。
１…基台、２，２…発光ダイオード、３，３…
発光部、４，４…配線、５，５…結線部、６，６
…集積回路、７，７…金属細線、８，８…空所。
FIG. 1 is a plan view of main parts of a conventional light emitting diode assembly, FIG. 2 is a plan view of main parts of a light emitting diode assembly according to an embodiment of the present invention, and FIG. 3 is a sectional view thereof. 1...Base, 2,2...Light emitting diode, 3,3...
Light emitting part, 4, 4... Wiring, 5, 5... Connection part, 6, 6
...Integrated circuit, 7,7...Metal thin wire, 8,8...Empty space.
Claims (1)
に整列載置された複数の発光ダイオードと、発光
ダイオードの載置場所の近傍の基台上に略等間隔
に整列配置した結線部を有する配線とを具備し、
前記配線は、発光ダイオードの端部に位置する結
線部に接続された配線パターンを、基台上に略く
さび状の空所をもつ様に傾斜させたことを特徴と
する発光ダイオードアセンブリ。 A base having a light emitting unit arranged in an array, a plurality of light emitting diodes arranged in an array on the base, and wiring arranged in a row at approximately equal intervals on the base near the place where the light emitting diodes are placed. and a wiring having a part,
A light-emitting diode assembly, wherein the wiring pattern is connected to a connection portion located at an end of the light-emitting diode and is inclined so as to have a substantially wedge-shaped space above the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983154482U JPS6061748U (en) | 1983-10-04 | 1983-10-04 | light emitting diode assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983154482U JPS6061748U (en) | 1983-10-04 | 1983-10-04 | light emitting diode assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6061748U JPS6061748U (en) | 1985-04-30 |
| JPH0328528Y2 true JPH0328528Y2 (en) | 1991-06-19 |
Family
ID=30341472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983154482U Granted JPS6061748U (en) | 1983-10-04 | 1983-10-04 | light emitting diode assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6061748U (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5780077A (en) * | 1980-11-06 | 1982-05-19 | Matsushita Electric Ind Co Ltd | Heat-sensitive recording head |
-
1983
- 1983-10-04 JP JP1983154482U patent/JPS6061748U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6061748U (en) | 1985-04-30 |
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