JPH0444435B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode assembly suitable for providing a large number of light emitting parts with dot pitches of 0.05 to 0.3 mm aligned over 100 mm or more.

In recent years, light emitting diodes for light emitting diode printers have light emitting parts 15 arranged as shown in FIG.
Monolithic light emitting diodes 14, 14, 14 having light emitting portions 15, 15, . . . 15, . However, because of the yield, the light emitting diodes 14, 14, 14 can only be made in a length of ten or so mm at most, and are usually 5 to 9 mm long, so they are lined up in a straight line with a constant dot pitch, and then wired and inspected. is an extremely complicated job.

The present invention corrects the above-mentioned drawbacks by performing fine work within a small area, and provides a light emitting diode assembly that is easy to wire, inspect, repair, and adjust by combining light emitting diode drive elements. The present invention will be described in detail below based on examples.

FIG. 2 is a plan view of a light emitting diode assembly 1 , 1 , 1 according to an embodiment of the present invention, in which 2, 2, 2 have wiring patterns 3, 3, etc. provided on the surface by printing, metallization, etc. With a substrate such as ceramic,
It is square or rectangular. 4, 4, 4 are light emitting parts 5, 5... arranged on a straight line at equal pitches, and lead parts 6, 6... extending from the light emitting parts 5, 5...
A light emitting diode made of GaP, GaAs, etc. with
The pitch of the light emitting parts 5, 5, . . . is 0.3 to 0.05 mm.

The light emitting diodes 4, 4, 4 are placed on the wiring patterns 3, 3, 3 of the substrates 2, 2, 2 using a conductive adhesive (not shown) or the like; , 2 and the alignment direction of the light emitting parts 5, 5, . In the example shown in the figure, the lead parts 6, 6... are provided so as to be oriented in one direction relative to the light emitting parts 5, 5..., so it is only necessary to arrange them near the sides that are desired to be parallel.
At this time, if similar light emitting diode assemblies 11 are arranged opposite to this with the positions of the light emitting parts being 1/2 pitch from each other, the light emitting parts will be arranged in a staggered manner to form a double density recording head. I can do it. Furthermore, as shown in FIG. 1 as a conventional example, when lead parts 16, 16... are provided on both sides of the light emitting parts 15, 15..., it is better to place the light emitting diode approximately in the center of the board, since the wiring pattern and the light emitting This is convenient for aligning the diode assembly.
In this case, since the position of the light emitting diode cannot be the reference side, a wiring pattern or the like may be provided in advance so as to be parallel to the reference side.
In either case, since the pitch of the light emitting parts 5, 5... is small, the light emitting diode assemblies 1, 1,
Since the substrates 2, 2, 2 tend to become an obstacle to maintaining the same pitch in the alignment of the diodes 4, 1, it is preferable that the diodes 4, 2, 2, 2, 2, 2, 2, 2,
The ends of 4, 4 need to protrude from the edges of the substrates 2, 2, 2. Considering workability, if the light emitting diode is 8 mm, it is better to make the width of the substrate 7.8 mm so that 2 to 20 light emitting parts protrude.

7, 7, 7 are integrated circuit elements having a driver function with a decoder for driving the light emitting parts 5, 5... of the light emitting diodes 4, 4, 4, and 8, 8... are the integrated circuit elements for the light emitting diodes 4, 4, 4 and the integrated circuit elements These are thin metal wires for wiring circuit elements 7, 7, 7. Although not shown in the drawings, if necessary, a protective resin coating may be applied to the substrate surface or element surface (the material is epoxy resin or silicone resin, and a light-shielding one is particularly preferable when used for integrated circuit elements 7, 7, 7). It may be covered with

As described above, the present invention includes a substrate having a desired wiring pattern, a light emitting diode having light emitting parts arranged at equal pitches on a straight line, and a light emitting diode mounted and fixed on the substrate, and a method for driving the light emitting diode. Since this is a light emitting diode assembly including an integrated circuit element mounted and fixed on a substrate, it is easy to handle the rows of minute light emitting parts because all you have to do is handle the substrate. Furthermore, since at least one end of the light emitting diode that intersects with the alignment direction of the light emitting parts protrudes from the substrate, the substrate does not become an obstacle in aligning the light emitting diode assembly. Therefore, the mutual spacing between the light emitting parts at the assembly connection portion can be easily adjusted, and work efficiency is improved. Since a desired pitch can be obtained between the light-emitting parts of the connection part, there is no non-uniformity in brightness at the connection part, and printing quality is improved. Also,
Since the light emitting parts are arranged parallel to one side of the substrate, the linearity of the light emitting parts can be determined by checking the linearity of one side of a large number of light emitting diode assemblies arranged in a long shape. Therefore, confirmation work can be easily performed.

Furthermore, a wiring pattern for supplying drive element signals and a power supply voltage is provided on the other side of the substrate opposite to one side of the substrate on which the light emitting diode is mounted and in the vicinity thereof. That is, since this wiring pattern is formed on the other side of the substrate where the light emitting diode and the integrated circuit element are not mounted and in the vicinity thereof, there is no obstacle for wire bonding, making it easier to connect to the outside. Although the brightness characteristics may differ depending on the light emitting diode, in the present invention, it can be adjusted by adjusting the resistance of the integrated circuit element of the board or the common terminal, etc., and such adjustment can be made by adjusting the quality of the wiring, etc., for each board. This can be done together with the inspection.

[Brief explanation of drawings]

Figure 1 is a plan view of a conventional light emitting diode array.
FIG. 2 is a plan view of the light emitting diode assembly 1 , 1 , 1 according to the embodiment of the present invention. 2, 2, 2... Board, 3, 3... Wiring pattern, 4, 4, 4... Light emitting diode, 5, 5...
Light emitting section, 7, 7, 7... integrated circuit element.

Claims (1)

[Claims] 1. A board with a desired wiring pattern, a light emitting diode having light emitting parts arranged in a straight line at equal pitches and mounted and fixed on the board, and a light emitting diode mounted on the board so as to drive the light emitting diode. A light emitting diode assembly comprising a fixed integrated circuit element, wherein at least one end of the light emitting diode that intersects with the alignment direction of the light emitting parts protrudes from the substrate.