JPH0329005Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a board transfer device for transferring printed wiring boards from an inclined conveyor to a horizontal conveyor.

[Conventional technology]

As shown in FIG. 8, an automatic soldering device 11 for printed wiring boards having a jet soldering bath
In this case, the conveyor 12 for the printed wiring board P is provided in an upwardly inclined manner, and the printed wiring board P is conveyed in an upwardly inclined position so as to come into contact with the jet solder, thereby achieving good soldering. As shown in FIG. 9, the printed wiring board P is conveyed while being held between conveyor claws 14 provided on a pair of left and right endless chains 13 in the ascending conveyor 12, and is conveyed by a foaming fluxer 15, a preheater 16, and a jet stream. The printed wiring board P is sequentially transported above the solder bath 17 and the cooling fan 18, and the board-mounted components are soldered to the printed wiring board P.

On the other hand, the conveyor 22 of the cleaning device 21 is provided horizontally with respect to the inclined conveyor 12 of the soldering device 11. Therefore, a device 31 is required to transfer the printed wiring board P from the inclined conveyor 12 to the horizontal conveyor 22.

[Problem that the invention attempts to solve]

Conventionally, as shown in FIG. 8, the substrate transfer device 31 includes an upwardly inclined conveyor 32 having the same slope as the inclined conveyor 12 and an upwardly inclined conveyor 32 for smoothly receiving the substrates P delivered from the inclined conveyor 12. A descending inclined conveyor 33 that lowers the substrate to the same level as the horizontal conveyor 22 and a horizontal conveyor 34 that smoothly transports the substrate P to the cleaning horizontal conveyor 22 are required.

For this reason, there was a problem in that the overall length of the substrate transfer device 31 became large.

An object of the present invention is to reduce the overall length of this type of substrate transfer device.

[Means for solving problems]

In the present invention, between the inclined conveyor 12 for soldering and the horizontal conveyor 22 provided on the discharge side of this inclined conveyor 12, the inclined conveyor 1
This board transfer device transfers the printed wiring board P carried out from the board P onto the horizontal conveyor 22, and includes a large number of rotating rollers 52 arranged on both sides of the board P and rotated in a vertical state about a vertical shaft 54. , a rotating transfer surface 75 for transferring the substrate provided on the upper surface of each rotating roller 52, and a vertical shaft 5 of each rotating roller 52.
4 and a rotation transmission mechanism 55 that rotates the shaft.

[Effect]

In the present invention, the board P carried out from the inclined conveyor 12 for soldering is received by the rotation transfer surface 75 on the upper surface of the rotation rollers 52 on both sides, and each rotation roller 52 rotates in a horizontal state by a vertical shaft 54. The substrate is transferred by the force transmitted to the substrate P from the transfer surface 75 and sent to a horizontal conveyor 22 such as a cleaning device.

〔Example〕

Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in FIGS. 1 to 7.

As shown in FIGS. 6 and 7, a rack conveyor 41 on the substrate supply side, a buffer conveyor 4
2. The automatic soldering device 11, the substrate transfer device 43 according to the present invention, the cleaning device 21, the take-out conveyor 44, and the substrate recovery side rack conveyor 45
are provided sequentially and consecutively.

The board supply side rack conveyor 41 transports the rack 46 into which printed wiring boards are inserted in multiple stages to the vicinity of the buffer conveyor 42, and at this position, the rack 46 is raised in tact while the rack 46 is stopped, and the boards inside are set at a certain level. They are sequentially extruded and supplied onto a buffer conveyor 42 by a pusher (not shown).

The buffer conveyor 42 includes a horizontal conveyor 47 for receiving the board, and an inclined conveyor 4 having the same slope as the soldering inclined conveyor 12.
8, and an intermediate conveyor 49 located between the two conveyors 47 and 48, and each conveyor 4
7, 48, and 49 are belt conveyors each consisting of a pair of endless belts.

The soldering device 11 is as described in the conventional example.

The cleaning device is provided with a brush cleaning tank and a conveying nail cleaning tank inside, and the horizontal conveyor 22 is a holderless conveyor similar to the soldering inclined conveyor 12.

The take-out conveyor 44 consists of three belt conveyors: horizontal, inclined, and horizontal.

The board collecting side rack conveyor 45 is similar to the board supplying side rack conveyor 41, and sequentially collects printed wiring boards therein while moving up the empty rack in a tact.

As shown in FIGS. 4 and 5, the board transfer device 43 has a plurality of roller mounting frames 51 disposed on both sides of the printed wiring board P, which are rotated horizontally to transfer the board. Rotating roller 52
are arranged in sequence.

As shown in FIG. 1, the rotating roller 52 is integrally provided with a vertical shaft 54 rotatably fitted to the frame 51 via a bearing 53. A rotation transmission mechanism 55 for rotating each of the vertical shafts 54 is provided.

As shown in FIG. 2, in this rotation transmission mechanism 55, upper and lower sprockets 56, 57 are integrally fitted to the vertical shaft 54 except for the final shaft, and the upper and lower sprockets 56 and 57 are connected to each other. An endless chain 58 is wound between the lower sprockets 57, and as shown in FIG. A drive chain 63 is wound around the diameter sprocket 62, and rotation is sequentially transmitted to each roller 52. The chain 63 is tensioned by a tension sprocket 64.

Returning to FIG. 1, 65 is the motor cover;
Reference numeral 66 denotes a base frame, and a mounting plate 67 is provided on this base frame 66.
The roller mounting frame 51 is fixed via 8. Further, the sprocket 64 and the like are attached to the mounting plate 67 via a mounting plate 69 and the like.

As shown in FIG.
is formed separately from the vertical shaft 54 from stainless steel, etc., which is highly resistant to corrosion against flux attached to the printed wiring board P, and the flange of the vertical shaft 54 is formed in the center shaft hole 71 of the rotating roller 52. The upper part 73 of the part 72 is press-fitted and integrated.

As shown in FIG. 3, the rotating roller 52 has an upper convex portion 74 and a tapered upper surface around the convex portion 74 to support and transport the left and right sides of the printed wiring board P, respectively. A rotating transfer surface 75 is formed. Therefore, the printed wiring board P is stably supported by the tapered transfer surfaces 75 of the plurality of rotating rollers 52 on both sides, and does not meander during transfer.
There is no risk of engagement with 4.

Further, as shown in FIGS. 4 and 5, a mounting base 81 is fixed to the base frame 66,
Mounting plates 82 and 83 are mounted on this mounting base 81.
The board is fixed movably by a screw 85 inserted into a long hole 84 of 2, and is further fixed to the mounting plate 83 on both sides of the mounting plate 83 through a mounting plate 86 which is movable and adjustable in the vertical direction. A presser roller 87 is rotatably attached to the shaft.

This substrate holding roller 87 prevents the substrate P from floating when it is about to be transferred from the inclined conveyor 12 of the automatic soldering device 11 onto the rotating roller 52 of this substrate transfer device 43, and rotates the substrate P on both sides. It is guided onto the tapered transfer surface 75 of the roller 52. Next, the operation of this embodiment will be explained.
The substrate P carried out from the inclined conveyor 12 is
It is inserted from above between the rotating rollers 52 on both sides while being prevented from floating by the presser roller 87,
Tapered transfer surfaces 75 of the rotating rollers 52 on both sides
placed horizontally on top. Since the tapered transfer surface 75 of each roller 52 on both sides is rotated in a horizontal state by the vertical shaft 54 so that the inner side moves toward the cleaning device 21, the substrate P is affected by the rotational force of the rotation transfer surface 75. and sent to the horizontal conveyor 22 of the cleaning device 21.

[Effect of idea]

According to the present invention, a large number of rotating rollers horizontally rotated about vertical axes are arranged on both sides of the substrate, and a rotating transfer surface for transferring the substrate is provided on the upper surface of each rotating roller. Since the upper side of the transfer surface is open, the printed wiring board that is carried out in an inclined manner from the inclined conveyor changes its posture to be compatible with the horizontal conveyor when it is transferred onto the rotating rollers, and then is transferred to the horizontal conveyor by the rotating rollers. sent. Therefore, there is an advantage that the substrate transfer device constituted by the rotating rollers can be made compact.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing one embodiment of the substrate transfer device of the present invention, Fig. 2 is a sectional view taken along the line - - in Fig. 1, Fig. 3 is an enlarged view of its rotating roller, and Fig. 4 is this substrate. A plan view of the transfer device, FIG. 5 is a sectional view taken along the line -- in FIG. 4, FIG. 6 is a plan view of the automatic soldering line, FIG. 7 is a front view thereof, and FIG. 8 is a conventional automatic soldering line. FIG. 9 is a front view of the soldering device. 12... Inclined conveyor, 22... Horizontal conveyor, 52... Rotating roller, 54... Vertical axis, 55
...Rotation transmission mechanism, 75...Rotation transfer surface, P...
Printed wiring board.

Claims (1)

[Claims for Utility Model Registration] (1) Between an inclined conveyor for soldering and a horizontal conveyor provided on the output side of this inclined conveyor, a printed wiring board carried out from said inclined conveyor is transferred to a horizontal conveyor. This is a substrate transfer device that includes a number of rotating rollers arranged on both sides of the substrate and rotated in a horizontal state about a vertical axis, a rotating transfer surface for transferring the substrate provided on the top surface of each of the rotating rollers, and a rotating transfer surface for transferring the substrate. A substrate transfer device comprising: a rotation transmission mechanism that rotates a vertical axis of each of the rotating rollers. (2) The substrate transfer device according to claim 1, wherein the rotation transfer surface of each rotation roller is formed in a tapered shape.