JPH0329180B2 - - Google Patents

Info

Publication number
JPH0329180B2
JPH0329180B2 JP21099083A JP21099083A JPH0329180B2 JP H0329180 B2 JPH0329180 B2 JP H0329180B2 JP 21099083 A JP21099083 A JP 21099083A JP 21099083 A JP21099083 A JP 21099083A JP H0329180 B2 JPH0329180 B2 JP H0329180B2
Authority
JP
Japan
Prior art keywords
resin
series
emitting diode
sealed
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP21099083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60103650A (ja
Inventor
Teru Okunoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP58210990A priority Critical patent/JPS60103650A/ja
Publication of JPS60103650A publication Critical patent/JPS60103650A/ja
Publication of JPH0329180B2 publication Critical patent/JPH0329180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Polyethers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58210990A 1983-11-11 1983-11-11 発光ダイオ−ド Granted JPS60103650A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58210990A JPS60103650A (ja) 1983-11-11 1983-11-11 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58210990A JPS60103650A (ja) 1983-11-11 1983-11-11 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS60103650A JPS60103650A (ja) 1985-06-07
JPH0329180B2 true JPH0329180B2 (cs) 1991-04-23

Family

ID=16598490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58210990A Granted JPS60103650A (ja) 1983-11-11 1983-11-11 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS60103650A (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101264A (en) * 1988-03-31 1992-03-31 Mitsui Petrochemical Ind. Light-emitting or receiving device with smooth and hard encapsulant resin
TW414924B (en) * 1998-05-29 2000-12-11 Rohm Co Ltd Semiconductor device of resin package
JP2005142174A (ja) 2002-04-25 2005-06-02 Opto Device Kenkyusho:Kk 発光ダイオード及びその製造方法

Also Published As

Publication number Publication date
JPS60103650A (ja) 1985-06-07

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