JPH0462188B2 - - Google Patents
Info
- Publication number
- JPH0462188B2 JPH0462188B2 JP57164211A JP16421182A JPH0462188B2 JP H0462188 B2 JPH0462188 B2 JP H0462188B2 JP 57164211 A JP57164211 A JP 57164211A JP 16421182 A JP16421182 A JP 16421182A JP H0462188 B2 JPH0462188 B2 JP H0462188B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- emitting diode
- light emitting
- resin composition
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Polyethers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57164211A JPS5954277A (ja) | 1982-09-21 | 1982-09-21 | 発光ダイオ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57164211A JPS5954277A (ja) | 1982-09-21 | 1982-09-21 | 発光ダイオ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5954277A JPS5954277A (ja) | 1984-03-29 |
| JPH0462188B2 true JPH0462188B2 (cs) | 1992-10-05 |
Family
ID=15788773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57164211A Granted JPS5954277A (ja) | 1982-09-21 | 1982-09-21 | 発光ダイオ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954277A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61203644A (ja) * | 1985-03-06 | 1986-09-09 | Suriibondo:Kk | 電子部品の製造方法 |
| JP2001196642A (ja) | 2000-01-11 | 2001-07-19 | Toyoda Gosei Co Ltd | 発光装置 |
| MY145695A (en) | 2001-01-24 | 2012-03-30 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3107087A1 (de) * | 1980-02-29 | 1981-12-24 | CIBA-GEIGY AG, 4002 Basel | "photopolymerisierbare gemische und verfahren zur photopolymerisation von kationisch polymerisierbaren verbindungen" |
| JPS58219781A (ja) * | 1982-06-15 | 1983-12-21 | Showa Denko Kk | 発光ダイオ−ド素子の封止方法 |
| JPS5919381A (ja) * | 1982-07-23 | 1984-01-31 | Hitachi Chem Co Ltd | 樹脂で封止された発光ダイオ−ドの製造法 |
-
1982
- 1982-09-21 JP JP57164211A patent/JPS5954277A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5954277A (ja) | 1984-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3492178B2 (ja) | 半導体発光装置及びその製造方法 | |
| US20220123186A1 (en) | Light emitting device | |
| US8247263B2 (en) | Method for producing an optical, radiation-emitting component and optical, radiation-emitting component | |
| KR100355473B1 (ko) | 반도체발광장치및그제조방법 | |
| US4822536A (en) | Method of encapsulating an electronic component with a synthetic resin | |
| JP4763122B2 (ja) | 発光ダイオード及びその製造方法 | |
| JPS59161054A (ja) | 回路の選択領域の包封方法 | |
| CN107248547A (zh) | 一种大功率led芯片集成封装结构及其封装方法 | |
| JP2003073452A (ja) | 紫外発光素子用のエポキシ樹脂及びエポキシ樹脂材料 | |
| JP2003152229A (ja) | 半導体発光装置 | |
| JP3153171B2 (ja) | 光半導体装置および光半導体封止用エポキシ樹脂組成物 | |
| CN103579464A (zh) | 一种白光led封装方法及相应封装结构 | |
| CN206116449U (zh) | 一种白光led封装器件 | |
| CN112786769A (zh) | 一种防硫化led器件及其制备方法 | |
| JP2003163380A (ja) | 光半導体装置及びその製造方法 | |
| JPH0329180B2 (cs) | ||
| JP3266680B2 (ja) | 発光ダイオードの製造方法 | |
| CN1885571A (zh) | Led的封装结构及封装方法 | |
| KR102050575B1 (ko) | 방열 조성물 및 이의 제조 방법, 방열 조성물을 포함하는 발광소자 패키지 | |
| CN106356437A (zh) | 一种白光led封装器件及其制备方法 | |
| CN106299042A (zh) | 一种紫外led光源无机封装方法 | |
| JPH0529663A (ja) | 光半導体装置およびその樹脂封止方法 | |
| JP3259968B2 (ja) | 半導体装置の製法 | |
| JP2922672B2 (ja) | 半導体装置の製法 | |
| CN219591415U (zh) | 一种cob封装体 |