JPH032933Y2 - - Google Patents

Description

[Detailed Description of the Invention] A. Field of Industrial Application The present invention relates to a light emitting diode display suitable for a connectable dot matrix display device.

B. Prior Art Conventionally, light emitting diode lamps have been arranged in rows and columns and incorporated into dot matrix display devices, as disclosed in, for example, JP-A-60-107084 and JP-A-61-28990. ing. In such a light emitting diode display, as shown in FIG. are provided at approximately equal intervals.

However, in such a light emitting diode display device, the lead pins 42, 42, . . . of the light emitting diode lamps 4, 4, . This is, for example, a light emitting diode lamp 4,4
This is because if a large number of light emitting diode lamps 4, 4, etc. are inserted into a board and attempted to be soldered by reflow or the like, problems such as the light emitting diode lamps 4, 4, etc. falling out or falling out, resulting in uneven display heights will occur.

Therefore, like an automatic insertion machine, the lead pins 42, 42
I thought about bending the tip of the...but there were two problems. This is because in a dot matrix display, when the distance between dots increases, the display quality deteriorates, so the light emitting diode lamps 4, 4, . . . must be provided relatively close to each other. On the other hand, in order to bend the lead pins 42, 42... to prevent them from coming off, they must be shaped into an approximately eight-shape (including an inverted eight-shape), but since the lamps are close to each other, if they are bent, the lead pins that are close to each other will be shorted by soldering. It's an easy thing to do. Another point is that it is common practice to prepare substrates of unit length and connect them later, rather than preparing substrates of the band display length. However, as described above, when the light emitting diode lamps are close to each other, there is little margin between the lead pins 42 and the edge 31 of the substrate 3. For example, when lamps with a diameter of 5 mm are arranged at 7 mm intervals, the distance between the lead pins at the ends and the edge of the board is only about 2 mm.
Although a wiring pattern is provided on the substrate 3, solder tends to accumulate between this pattern and the bent lead pins, so when manufacturing a large number of display devices, this solder often swells up. If this bulge of solder occurs in the direction in which the boards are connected, not only short circuits may occur, but also the distance between the dots will widen (the boards cannot be brought close to each other due to the bulge of solder), resulting in the disadvantage of deterioration of display quality.

C. Problems that the invention aims to solve This invention was made in consideration of the above points.
This invention relates to a light emitting diode display device which has good assembly workability, is free from solder short circuit accidents, and can be connected at a constant dot interval.

D. Means for Solving the Problems The present invention arranges the lead pin directions of adjacent light emitting diode lamps to be substantially orthogonal to each other, and also connects the adjacent light emitting diode lamps so that their lead pin directions are approximately perpendicular to each other, and the side surface of the board in the connection direction is spaced at intervals approximately equal to the alignment pitch of the lamps. It is formed by forming unevenness.

E. Effect This prevents adjacent devices from short-circuiting even if the lead pins of the light emitting diode lamp are bent, and also makes it possible to secure a space for collecting solder at the tip of the lead pin.

Embodiment FIG. 1 is a rear view a and a side view b of a light emitting diode display according to an embodiment of the present invention. In the figure, reference numeral 1 denotes a substrate such as a printed circuit board, which is provided with a large number of through holes for lead pins and a wiring pattern (not shown).
2, 2... are light emitting diode lamps, for example, a plurality of lead pins 22, 22 (in the example of a monochrome lamp, there are two lead pins, but three or more in the case of multiple colors) are protruded from a transparent resin 21 with a diameter of 5 mm. The plurality of lead pins 22, 22 are located within one plane.
The light emitting diode lamps 2, 2... are placed on the substrate 1 so that the display surface (the tip of the translucent resin 21) is approximately the same and at a constant pitch (for example, 7 mm).
The lead pins 22, 22 are inserted into the through holes, and the surfaces including the lead pins 22, 22 of adjacent light emitting diode lamps 2, 2, . . . are arranged so as to be substantially perpendicular to each other. That is,
In FIG. 1, the lead pins 22, 22 are arranged vertically and horizontally alternately. The tips of the lead pins 22, 22 are bent approximately 1.5 mm into an eight-shape on the back surface of the board 1 and soldered to the wiring pattern of the board, but since the directions of the lead pins are orthogonal, the bending process Never come close.

In addition, the side surfaces 11, 11 on the connection side of the board 1 have unevenness that matches the alignment pitch of the light emitting diode lamps 2, 2, etc. so that the lead pins 22, 22 have concave portions on the vertical side and convex portions on the horizontal side. It is formed. The unevenness may be rectangular or wavy in addition to the trapezoidal shape shown in the figure. Since the soldering of the horizontal lead pins is done on this convex portion, the solder does not protrude from the board. When connecting a plurality of these display devices, the light emitting diode lamps 2,
2 can form a long matrix with equal intervals.

Effects of the invention As described above, since the lead pins of adjacent light-emitting diode lamps are oriented in different directions, they can be bent according to a certain rule (for example, toward the outside of the lamp). This improves work efficiency by performing reflow soldering after inserting the lamp, and short-circuit accidents do not occur due to this. and foreign objects (conductive objects) that cross the edge of the board.
(For example, lead pin tips and solder) are not formed, so for example, a 30 x 7 matrix display device can be constructed by connecting 6 x 7 matrix light emitting diode displays, in which case the dot pitch is constant and the display surface The display quality is high because both images can be placed in the same plane.

[Brief explanation of the drawing]

FIG. 1 is a rear view a and a side view b of a light emitting diode display according to an embodiment of the present invention, and FIG. 2 is a side view of a conventional display. 1... Board, 2, 2... Light emitting diode lamp.

Claims (1)

[Claims for Utility Model Registration] A light-emitting diode display device having a substrate and a light-emitting diode lamp arranged vertically and horizontally on the substrate and having lead pins in one plane, wherein the planes of the lead pins of the light-emitting diode lamps are adjacent to each other. A light-emitting diode display device, characterized in that a light-emitting diode lamp is provided so as to be substantially orthogonal to each light-emitting diode lamp, and at least one side surface of the substrate has unevenness at intervals substantially equal to the alignment pitch of the light-emitting diode lamps. .