JPH03294182A - Electrocast grinding wheel - Google Patents

Abstract

PURPOSE:To perform grinding at a high speed while holding a good cutting face roughness with smaller chipping, by forming plural abrasive grain layers in a lamellar shape with the dispersion plating process which uses plural kinds of plating liquids dispersing abrasive grains. CONSTITUTION:On the surface of a first abrasive grain layer 3, second abrasive grain layers 4, 5 which contain the abrasive grain in a relatively smaller grain size than the abrasive grain contained in the first abrasive grain layer 3, are formed. A main grinding is then performed on the first abrasive grain layer 3 containing the abrasive grain in a larger grain size and the small grinding at the vicinity of the contact part with a cutting face is performed on the second abrasive grain layers 4, 5 containing the abrasive grain smaller in grain size. Consequently, grinding can be performed at a high speed while holding a good cutting face roughness with less chippings.

Description

Detailed Description of the Invention "Industrial Application Field" The present invention relates to electroformed paper having a plurality of abrasive grain layers, and in particular to a grindstone for cutting or grooving, in which abrasive grains with good sharpness are used. The present invention relates to an electroformed grindstone having a plurality of layers of abrasive grains, in which the cutting edge part is made up of layers, and the sides of the cutting edge part are made up of abrasive grain layers that can provide a good finished surface with less chipping.

``Prior art'' A conventional cutting or grooving grindstone has a one-layer structure composed of one type of abrasive grain layer, and the blade edge and the side part of the blade edge are coated with the same abrasive grain. It was formed by a grain layer.

``Problem to be Solved by the Invention J'' In order to use this conventional grindstone to groove ferrite used in video magnetic heads, which require high processing accuracy, the following steps were necessary.

That is, first, grooving is performed using a grooving whetstone that emphasizes machining speed, and then a finishing whetstone made of fine abrasive grains is used to remove the chipping caused by this grooving and to improve the groove. Finishing was performed on the sides to obtain the desired groove for the magnetic head.

For this reason, there have been disadvantages in that rapid processing is difficult and processing costs are also high.

An object of the present invention is to provide a novel electroformed grindstone having a plurality of abrasive grain layers that can perform such grooving in one step.

"Means and actions for solving the problem" This invention includes:
A plurality of abrasive grain layers are formed in a layered manner by a dispersion plating process using a plurality of types of plating solutions in which abrasive grains are dispersed.

In the electroformed grindstone as described above, for example, the first
On the surface of the abrasive grain layer, a second abrasive grain layer containing abrasive grains with a relatively smaller grain size than the abrasive grains contained in the first abrasive grain layer is formed, and the main grinding is performed using abrasive grains with a larger grain size. By using the first abrasive layer containing grains and performing slight grinding near the contact area with the cutting surface with the second abrasive layer containing abrasive grains of small grain size, chipping is reduced and good cutting is achieved. High-speed grinding can be performed while maintaining surface roughness.

Further, a second abrasive grain layer having a lower abrasive grain content than the first abrasive grain layer is formed on the surface of the first abrasive grain layer, and the main grinding is performed on the first abrasive grain layer.
By using a second abrasive layer to perform slight grinding near the contact area with the cut surface, high-speed grinding is possible while minimizing chipping and maintaining good cut surface roughness. It can be carried out.

Furthermore, a second abrasive grain layer containing abrasive grains having lower mechanical strength than the abrasive grains contained in the first abrasive grain layer is formed on the surface of the first abrasive grain layer, and the main grinding is performed on the surface of the first abrasive grain layer. A second abrasive layer performs slight grinding near the contact area with the cutting surface, thereby achieving high-speed grinding while minimizing chipping and maintaining good cut surface roughness. be able to.

In addition, a second abrasive layer having a binder hardness and strength lower than that of the first abrasive layer is formed on the surface of the first abrasive layer, and the main grinding is performed with the first abrasive layer, By performing slight grinding in the vicinity of the contact portion with the cut surface using the second abrasive grain layer, high-speed grinding can be performed while reducing chipping and maintaining good cut surface roughness.

Embodiment FIG. 1 shows a first embodiment of the present invention, and in this figure, reference numeral 1 indicates an electroformed grindstone. This electroformed grindstone 1 has a thin disk shape, and includes a first abrasive grain layer 3 located in the center and second abrasive grains formed on both sides of the first abrasive grain layer 3. It has a three-layer structure consisting of layers 4 and 5.

Also, the radius RO of the electroformed grindstone l is 5011, the thickness of the first abrasive grain layer 3 is 70 μm, and the thickness of the second abrasive grain layer 4.5 is 1
．． =7μl.

The first abrasive grain layer 3 contains superabrasive grains with a relatively large grain size, and the second abrasive grain layers 4 and 5 contain superabrasive grains contained in the first abrasive grain layer 3. Contains superabrasive grains with a smaller particle size than that of

Note that the superabrasive grains referred to herein refer to tire mondo abrasive grains, cubic boron nitride (CBN) abrasive grains, and the like.

Next, a method for manufacturing the electroformed grindstone having the above configuration will be explained.

First, the main points of the process are as follows.

a. Mask off the part of the substrate that is removable from the plating metal, leaving the part forming the shape of the grindstone prototype, and masking the other part.

b. Perform cleaning treatment such as degreasing on the substrate.

Dispersion plating is applied to the substrate using a first plating solution in which C abrasive grains are dispersed to form a second abrasive grain layer 4 .

d. The substrate is subjected to water washing treatment including brushing.

e Dispersion plating is applied to the substrate using a second plating solution in which abrasive grains are dispersed, and a second plating solution is applied on the second abrasive layer 4.
An abrasive layer 3 is formed.

f. The substrate is subjected to water washing treatment including brushing and the like.

g Dispersion plating is applied to the substrate using the first plating solution, and the first abrasive layer 5 is formed so as to overlap the second abrasive layer 3.

h. Perform a water washing process including brushing on the substrate.

The three-layered abrasive grain layer is peeled off from the substrate and dried.

” The peeled abrasive grain layer is punched and shaped into a grindstone shape.

k. The abrasive grain layer is subjected to a rounding process, a dressing process, and a finishing process to obtain an electroformed grindstone according to the present invention.

Details of each of the above steps are as follows.

That is, the substrate has a passivation film formed on the surface of a stainless steel plate material, and has a property that when a plating layer is formed on this surface, the plating layer can be easily peeled off. .

In addition, cleaning treatments such as masking and degreasing or washing with water are performed by conventionally known methods.

The composition of the first plating liquid in which the abrasive grains are dispersed is as follows.

Sulfamic acid Ni -------450g/(Ni monochloride...)
・10g/+2 boric acid=−=−=−−−・−−−−−・
-30g/Q brightener・・・・・・・・・・・・・・・
・・・・・・・・・・Small amount of bit prevention agent・・・・・・・
・・・・・・・・・・・・Small PH・・・・・・・・・・・・
・・・・・・・・・・・・・・・・・・Type of 40 minute dispersed grains・・・・・・・・・・・・Particle size of diamond dispersed abrasive grains・・・・・・・・・・・・・・・・Concentration of 2-4μ shoulder dispersed abrasive grains・・・・・・・・・・・・300
g/(1) The procedure of dispersion plating using this first plating solution will be explained with reference to FIG.

In the figure, reference numeral 10 denotes a plating tank, and the first plating solution 12 is stored in the plating tank 10.

Next, the electrode plate 3 constituting the anode, the substrate 14 constituting the cathode, and the stirring manual work 5 are immersed in this plating solution 12.

In this case, the surface of the substrate 14 is the grinding wheel prototype part 16.
The remaining portions except for 1 are covered with a masking material 17. Figure 3 shows the substrate 14 masked in this way.
1 shows a front view.

Next, while controlling the temperature of the plating solution 12 by a temperature control means (not shown) provided in the plating bath 10, and rotating the stirring means 15 as shown by an arrow p in the figure, the electrode plate is heated. Dispersion plating is performed by passing positive electricity to 13 and passing negative electricity to the substrate 14, respectively.

The plating conditions at this time are as follows.

Bath temperature・・・・・・・・・・・・・・・・・・・・・
...50'C cathode current density...
・・・・・・3 A/dm 'Plating time...
. . . 10 minutes As a result, a second abrasive layer 4 having the following composition is formed on the surface of the substrate 14.

Diamond content・・・・・・・・・・・・・・・・・・
1QVa1% plating thickness・・・・・・・・・・・・・・・
...7μ blade Next, the substrate 4 is subjected to a water washing process including brushing, etc. After that, the plating solution in the plating tank 10 is replaced and a second plating solution is stored in the plating tank 10. Then, a dispersion plating treatment is performed in the same manner as in the case of forming the second abrasive layer 4, and the second abrasive layer 3 is formed overlapping the second abrasive layer 4.

In this case, the composition of the second plating solution, the abrasive grains to be dispersed, and the plating conditions are as follows.

Composition of plating solution: Same type of abrasive grains as the first plating solution:・
・Particle size of diamond abrasive grains・・・・・・・・・・・・・・・
・・・8～20μl Abrasive grain concentration・・・・・・・・・
・・・・・・・・・・・・150 g/Q bath temperature・・・・・・
・・・・・・・・・・・・・・・・・・・・・・・・5
0℃ plating time・・・・・・・・・・・・・・・・・・
...90 minutes The composition of the first abrasive layer 3 thus formed is as follows.

Diamond content・・・・・・・・・・・・・・・25
Thickness of Vo1% abrasive layer・・・・・・・・・・・・・・・
...70 μl After this plating process is completed, wash with water again.

After that, the substrate 1 is coated again using the first plating solution.
4 is subjected to a dispersion plating treatment to form a first abrasive layer 5 overlapping the first abrasive layer 3.

The plating conditions, the abrasive grain layer formed, etc. at this time are the same as in the case of forming the first abrasive grain layer 3.

Next, the abrasive grain layer with the three-layer structure obtained in this way is applied to the substrate 1.
It is peeled off from 4, washed with water and dried, and then punched into the shape of a grindstone.

Furthermore, this is processed into a perfect circle, and a dressing process is applied to the peeled surface and the part that constitutes the cutting edge.
After cleaning, an electroformed grindstone 1 according to the present invention as shown in FIG. 1 is obtained.

When cutting or grooving is performed with this electroformed grindstone 1, the outer peripheral part of the first abrasive grain layer 3 becomes the cutting edge for grinding, but the particle size of the diamond abrasive grains contained in this abrasive grain layer 3 is 8~2
0μ! Since it is large in size and has a high content of 25 VOI%, it is possible to grind extremely efficiently and at high speed.

On the other hand, both sides of the first abrasive grain layer 3 are formed by second abrasive grain layers 4 and 5, and these second abrasive grain layers 4
The particle size of the diamond abrasive grains contained in 5 and 5 is as small as 2 to 4μ, and the content is as low as 1QVo1%, so
No chipping occurs on the side surfaces of the cut portion or groove portion ground by the second abrasive grain layers 4 and 5, and a finished surface with high finishing accuracy is obtained.

As a result of actual grinding using the electroformed grindstone 1 of this example, the chipping was 1/4 and the finished surface roughness was good compared to a conventional single-layer structure grindstone with a diamond abrasive grain size of 8 to 20 μl. However, the processing speed was the same.

Therefore, with the electroformed grindstone 1 of this embodiment, there is no need to finish the side surfaces of the groove when grooving is performed. Precision machining such as insertion can be performed in one process at high speed.

Further, according to the method for manufacturing the electroformed grindstone 1 of this embodiment, as described above, an extremely useful and novel grindstone can be obtained relatively easily and quickly.

Furthermore, when changing the composition of each abrasive grain layer according to the processing purpose, it is only necessary to change the type, amount, or particle size of the abrasive grains to be dispersed, the composition of the plating solution, or the plating conditions. Since no changes are required, a wide variety of electroformed grindstones can be manufactured efficiently and at low cost.

In addition, in this method, the step of exposing the abrasive grains on the surface peeled off from the substrate 14 is also carried out during the dressing step in the finishing step, and a separate abrasive grain exposing step is omitted. is simple.

Next, a second embodiment of the electroformed grindstone of the present invention will be described. The electroformed grindstone of this example has a first abrasive layer 3 in FIG.
The content of abrasive grains (diamond grains) contained in the second abrasive grain layer 4 and 5 is set higher than the content of diamond grains contained in the second abrasive grain layers 4 and 5, and the types of other abrasive grains, the particle size of the abrasive grains, The mechanical strength, etc. of the abrasive grains were set to be equal.

When performing a dispersion plating process with such an electroformed grindstone, the concentration of diamond grains dispersed in the first plating solution is the same as that of the diamond grains dispersed in the first plating solution in the manufacturing method of the first embodiment. It is manufactured by setting the plating concentration higher than the concentration, setting the plating time in the second plating solution longer than the plating time in the first plating solution, and setting other conditions equally.

The specific conditions for the dispersion plating treatment are as follows.

Abrasive diamond particle diameter to be dispersed in the first plating solution
8-20μ shoulder concentration・・・・・・・・・・・・・・・・・・
・・・・・・・・・・・・50g/(!Plating time...
・・・・・・・・・・・・・・・ 30 minutes Abrasive diamond particle size to be dispersed in the second plating solution・・・・・・・・・・・・・・・・・・・・・・・・
・Same concentration as above・・・・・・・・・・・・・・・・・・
・・・・・・・・・・・・・・・150 g/ρ plating time・・・・・・・・・・・・・・・・・・90 minutes Each grinding of the resulting whetstone The composition of the grain layer is as follows.

First abrasive layer diamond content・・・・・・・・・・・・・・・2
5Vo 1% plating thickness・・・・・・・・・・・・・・・
・・・・・・90μ second abrasive layer diamond content・・・・・・・・・・・・・・・・l Q
Vo 1% plating thickness・・・・・・・・・・・・−
- 20μ back According to the electroformed grindstone having the above configuration, chipping was 10% less than that of a conventional single-layer structure grindstone consisting of only the second abrasive grain layer, and the cut surface roughness was also good.

Next, a third embodiment of the electroformed grindstone of the present invention will be described. The electroformed grindstone of this example has a first abrasive layer 3 in FIG.
The mechanical strength such as the crushing strength of the abrasive grains (diamond grains) contained in the second abrasive grain layer 4 and 5 is set higher than the mechanical strength of the diamond grains contained in the second abrasive grain layers 4 and 5, and other types of abrasive grains, The particle size of the abrasive grains, the content of the abrasive grains, etc. are set to be the same.

When carrying out dispersion plating treatment, such an electroformed grindstone allows the diamond grains to be dispersed in the second plating solution in the manufacturing method of the first embodiment to be machined more easily than the diamond grains to be dispersed in the first plating solution. It is manufactured by making it highly durable and by setting other conditions equally.

The specific conditions for the dispersion plating treatment are as follows.

Abrasive diamond particle diameter to be dispersed in the first plating solution
・4-6μl concentration・・・・・・・・・・・・・・・・・・
・・・・・・・・・200g/f! Diamond type...
・・・・・・・・・・・・・・・Tomei Diamond IRM (Product name) Plating time・・・・・・・・・・・・15 minutes Abrasive to be dispersed in the second plating solution Grain diamond particle size, concentration...Same tire type as above...Tomei Diamond IMM (product name) With the above configuration According to the electroformed grindstone, there was less chipping and the roughness of the cut surface was good compared to the conventional grindstone with a single layer structure made of IMM grains.

Next, a fourth embodiment of the electroformed grindstone of the present invention will be described. The electroformed grindstone of this example has a first abrasive layer 3 in FIG.
The binder hardness and strength of the second abrasive grain layer 4 and 5 are set higher than the binder hardness and strength of the second abrasive grain layer 4 and 5, and other abrasive grain types, abrasive grain diameters, abrasive grain mechanical strength, etc. They are set equal.

Such an electroformed grindstone is manufactured by making the composition and plating conditions of the first plating solution different from those of the second plating solution when performing the dispersion plating treatment.

The specific conditions for the dispersion plating treatment are as follows.

First plating solution composition Ni sulfamate...450 g/(
Ni monochloride・・・・・・・・・・・・・10
g, Q boric acid −= ・= ・= −= =−−−−−
= -=-30g / (!Bit inhibitor...
・・・・・・・・・・・・Small PH・・・・・・・・・・・・
・・・・・・・・・・・・・・・・・・・・・4. 0 Diamond particle size・・・・・・・・・・・・・・・4～6
μl diamond grain concentration・・・・・・・・・・・・・・・
- The conditions for plating using the first plating solution at 300 g/kg are as follows.

Bath temperature・・・・・・・・・・・・・・・・・・・・・
・・・・・・50℃Cathode current density・・・・・・・・・・
・・・・・・3 A/dm 'Plating time...
・・・・・・・・・・・・・・・15 minutes Second plating solution composition Ni sulfamic acid 450 g/ρ CO sulfamic acid 50 g/f! Ni chloride...
・・・・・・・・・・・・・・・・l Og/f2 boric acid---30g/(1P,
・・・・・・・・・・・・・・・Small PH・・・・・・
・・・・・・・・・・・・・・・・・・4.0 diamond grains, concentration ・・・・・・・・・・・・・・・This second plating liquid is the same as the first plating liquid. The plating conditions using the plating solution were the same as those for the first plating solution except that the plating time was 120 minutes.

The hardness of each abrasive grain layer of the electroformed grindstone obtained by this method is as follows.

First abrasive layer・・・・・・・・・・・・・・・H
V=500 Second abrasive layer・・・・・・・・・・・・・・・
Hv = 200 As a result of conducting a ferrite cutting test using the electroformed grindstone obtained in this way, chipping was 30% less than when using a conventional grinding wheel consisting of a single layer of abrasive grains with HV = 500, and cutting performance was reduced by 30%. The surface roughness was also good.

In addition, in the above first to fourth embodiments, an example was described in which the second abrasive grain layer was formed on both sides of the first abrasive grain layer to form a three-layer structure, but depending on the processing application, , 1st
The second abrasive grain layer may be formed only on one side of the abrasive grain layer to form a two-layer structure, or four or more abrasive grain layers may be formed in a layered manner.

Further, in each of the above embodiments, a case has been described in which an electroformed grindstone having a plurality of abrasive grain layers is manufactured by dispersion plating treatment using electroplating, but it may be manufactured by electroless plating. Although electroless plating requires a long plating time, it is advantageous when the abrasive layer contains a large amount of abrasive grains.

"Effects of the Invention" As explained above, the electroformed grindstone of the present invention has a plurality of abrasive grain layers formed in layers through a dispersion plating process using a plurality of types of plating solutions in which abrasive grains are dispersed. So,
For example, an electroformed grindstone is configured with a first abrasive grain layer and a second abrasive grain layer formed on the surface of the first abrasive grain layer,
On the surface of the abrasive grain layer, a second abrasive grain layer containing abrasive grains with a relatively smaller grain size than the abrasive grains contained in the first abrasive grain layer is formed, and the main grinding is performed using abrasive grains with a larger grain size. By using the first abrasive layer containing grains and performing slight grinding near the contact area with the cutting surface with the second abrasive layer containing abrasive grains of small grain size, chipping is reduced and good cutting is achieved. High-speed grinding can be performed while maintaining surface roughness.

Further, a second abrasive grain layer having a lower abrasive grain content than the first abrasive grain layer may be formed on the surface of the first abrasive grain layer, or a second abrasive grain layer having a lower abrasive grain content than the first abrasive grain layer may be formed on the surface of the first abrasive grain layer. A second abrasive grain layer containing abrasive grains having lower mechanical strength than the abrasive grains contained in the abrasive grain layer is formed, or a binder is added to the surface of the first abrasive grain layer from the first abrasive grain layer. By forming a second abrasive grain layer with low hardness and strength, performing main grinding with the first abrasive grain layer, and performing slight grinding near the contact area with the cut surface with the second abrasive grain layer, High-speed grinding can be performed while minimizing chipping and maintaining good cut surface roughness.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of an electroformed grindstone according to an embodiment of the present invention, FIG. 2 is an explanatory diagram for explaining the dispersion plating process, and FIG.
FIG. 3 is a front view of a masked substrate. l... Electroformed grindstone, 3... First abrasive layer 4
．． 5... Second abrasive layer, 10... Plating tank, 12... First plating solution, 13... Electrode plate, 14...・Substrate, 15... Stirring means,
16... Part that forms the grindstone prototype shape, 17...
...Masking material.

Claims (5)

[Claims] (1) An electroformed whetstone characterized by having a plurality of abrasive grain layers formed in layers through a dispersion plating process using a plurality of types of plating liquids in which abrasive grains are dispersed. (2) A second abrasive layer containing abrasive grains having a relatively smaller particle size than the abrasive grains contained in the first abrasive grain layer is formed on the surface of the first abrasive grain layer. Characteristic claim 1
Electroformed grindstone as described in section. (3) Claim 1, characterized in that a second abrasive grain layer having a lower abrasive grain content than the first abrasive grain layer is formed on the surface of the first abrasive grain layer. The electroformed grindstone described. (4) A second abrasive grain layer containing abrasive grains having lower mechanical strength than the abrasive grains contained in the first abrasive grain layer is formed on the surface of the first abrasive grain layer. An electroformed grindstone according to claim 1. (5) A second abrasive grain layer having lower binder hardness and strength than the first abrasive grain layer is formed on the surface of the first abrasive grain layer. Electroformed grindstone as described in section.