JPH03295965A - Tile unit - Google Patents

Abstract

PURPOSE:To improve production efficiency by pouring concrete material containing steel bars therein on the side of the back face of a tile unit on a continuous sheet on which a ferrite plate made of electric wave absorbing material is laminated and solidifying it in a production site. CONSTITUTION:A tile unit 10 comprises a connection sheet 14, which is made of resin, rubber, or the like, laminated fast on the surface of tiles 12, which are spacedly arranged at joint intervals, and ferrite plates 18, which become wave absorbing walls, stuck in continuous state in the magnetic field direction between back legs 16 and 16 by adhesives 20. This tile unit 10 is carried in a production site for PC plates, and concrete material containing steel bars therein is poured on the side of the back face of the tiles 12 and solidified, and the connection sheet 14 is peeled. A tile PC plate is completed in such manner. As described above, PC plates can easily be produced by only pouring concrete material containing steel bars also for electric wave reflection therein alone on the back side of the tile unit 10. This constitution serves to substantially improve the production efficiency of PC plates.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a tile unit for a radio wave absorbing wall.

(Prior art) In recent years, as cities have become more and more high-rise, the problem of interference with the reflection of TV waves by buildings, that is, the problem of reflected radio waves from buildings superimposing with TV broadcast waves, causing ghosts on the screen, has come into focus. As a countermeasure, attempts have been made to construct the walls of buildings as radio wave absorbing walls.

The structure of this radio wave absorbing wall is usually, as shown in FIG. 4, by pasting decorative tiles 102 with long soles 100 on the surface of a concrete wall 104, and embedding the long soles 100 inside the concrete wall 104. A ferrite plate 106 as a radio wave absorber is sandwiched between the soles lOO and 100 on the back side of the decorative tile 102. The construction method is generally
A construction method using PC boards has been adopted.

That is, a tile PC board is manufactured by fixing decorative tiles 102 in a predetermined arrangement on the surface thereof and embedding a ferrite plate 106 in the back side of the decorative tiles 102,
The PC board is transported to the construction site and attached to the building wall.

Figure 5 shows the general manufacturing method of the PC board.
As shown in the figure, in manufacturing a PC board, first a formwork 10g is assembled, and then joint blocks 110 are laid in the formwork 108. Here, the joint 11O has a shape in which protrusions 112 corresponding to the joint spaces of the decorative tiles 102 are extended vertically and horizontally, and has recesses 114 between these protrusions 112, and these recesses 114 are filled with tiles. When the tiles 102 are fitted, the tiles 102 are arranged in a predetermined number of turns.

After the tiles 102 are placed on the joints 110 and arranged, adhesive 116 (FIG. 5(B)) is applied to the back surface between the soles 100 and 100 of the tiles 102, and then used as a radio wave absorber. A ferrite plate 106 is placed thereon, and this is adhered to the back surface of the tile 102 via an adhesive 116. After the adhesive 116 has sufficiently dried, the same figure (C)
As shown in Figure 2, a metal nozzle for radio wave reflection and 11 g of reinforcing steel are set, and then concrete material is poured and solidified to manufacture the PC board 120 (note that the joints 110
(remove from the tile surface).

(Problem to be Solved by the Invention) By the way, when manufacturing the PC board 120 by such a method,
It takes a long time for the adhesive 116 to dry (about one day), which not only does not improve the production efficiency of the PC board 120 but also increases the cost of the PC board 120.
Normally, the back surface of the decorative tile 102 has many large and small irregularities, but the ferrite plate 106 needs to be firmly attached to the back surface of the tile 102 to prevent moisture from entering between the ferrite plate 106 and the tile 102. Therefore, a resin adhesive having the required viscosity is used as such an adhesive, but in this case, it takes a very long time for the adhesive to dry sufficiently.

In addition, in the case of the wood method, in addition to this, the ferrite plate 106 is
At the manufacturing site of the PC board 120, a worker manually adheres the adhesive to the back surface of the decorative tile 102, and the work at that time is complicated.
It is also likely that 06 will be lost. If the ferrite plate 106 is damaged, the radio wave absorption characteristics may be impaired or the PC board 1 may be damaged when forming a radio wave absorption wall.
Variations in radio wave absorption characteristics occur every 20 seconds, resulting in problems such as reduced quality reliability.

(Means for Solving the Problems) The unit tile of the present invention has been devised to solve such problems, and its gist is that a plurality of tiles arranged in a predetermined arrangement, and and a connecting sheet that is fixed to the front side of the tiles to connect each tile in the array until the installation of the tiles, and a ferrite plate is bonded with adhesive to the back side of the tile. It is in.

(Operation and Effects of the Invention) As described above, the present invention connects and holds the tiles by fixing a connecting sheet to the surface of the decorative tiles arranged in a predetermined state, and also attaches a ferrite plate to the back side of the tile using an adhesive. They are glued together to form a unit.

By using such a tile unit, when manufacturing tile PC boards at a PC board manufacturing site, it is possible to omit the step of bonding the ferrite board to the decorative tile. That is, a tile PC board can be easily manufactured by simply arranging a radio wave reflecting plate and reinforcing bars, or a reinforcing bar that also serves as a radio wave reflecting plate, on the back side of the tile unit, and then pouring and solidifying concrete material.

In this way, since the process of adhering ferrite plates is not required at the PC board manufacturing site, the production efficiency of PC boards is greatly improved, and the cost of PC boards is significantly reduced. Half of the time it took 2 days
This means that only one day is enough, and the cost is also cut in half.

In addition, according to the present invention, since the ferrite plate can be bonded at the stage of factory production of the tile unit, it is possible to do it mechanically and consistently without manual work by the operator, thereby preventing defects such as damage to the ferrite plate. It is possible to eliminate human error and improve quality reliability.

(Example) Next, embodiments of the present invention will be described in detail based on the drawings.

FIG. 1 shows an example of a tile unit,
10 is a tile unit, and 12 is a decorative tile arranged in a predetermined arrangement across a joint space. A connecting sheet 14 made of resin, rubber, paper, etc. is arranged on the surface side of each tile 12, and this sheet 14 is fixed to the surface of each tile 12 with a part of it entering the joint space, so that each The tiles 12 are maintained in an array.

The tile 12 has a pair of long soles 16 on the back side, and between the soles 16,
A rectangular ferrite plate 18 is adhered to the back surface of the tile 12 with an adhesive 20 in a continuous state in the magnetic field direction (when forming a radio wave absorption wall).

This tile unit 10 can be manufactured, for example, by the method shown in FIG. First, with the tiles 12 arranged in a predetermined arrangement, the connecting sheet 14 is fixed to the front side thereof. There are various methods for this purpose. For example, the tiles 12 are held in an array by a frame, and fluid resin is poured into the gaps on the surface of the tiles 12 and solidified, thereby forming a connecting sheet with the resin. 14 is formed and fixed to the surface of the tile 12 at the same time. Alternatively, a predetermined film is placed on the surface of the tile 12 and vacuum suction is applied.
This may be adhered to the surface of the tiles 12, or it is possible to adhere the connecting sheet (14) to the surface of the arranged tiles 12 by various other methods. The method is not limited.

After attaching the connecting sheet 14 to the surface of the tile 12,
Next, 20 tons of adhesive is applied to the back side of the tile 12. Various types of adhesives can be used as the adhesive 20, but it is preferable to use one that has good adhesive strength and does not create a gap between the tile 12 and the ferrite plate 18. Specifically, various types of synthetic resins ( For example, epoxy resin type) 1 synthetic rubber type (for example, silicone rubber type) can be used.

Now, after applying adhesive 20, continue with feynite board 18.
Place it on top of it and glue it to the tile 129 side. At that time, the ferrite plate 18 may be one having a size equivalent to one tile and may be placed on the back surface of each tile 12 and adhered, or the third rf! As shown in J, for example, a ferrite plate 22 with a length equivalent to six tiles is attached to the tile 12.
In the case of the @ type, which can be placed on the back side and adhered, there is an advantage that the number of man-hours is reduced and the work efficiency is improved.

By bonding the ferrite plates 18 (22) in this manner, a tile unit 10 is completed in which a plurality of tiles 12 are connected in an array. Therefore, this is carried to a PC board manufacturing site, reinforcing bars are arranged on the back side of the tile 12, concrete material is poured and hardened, and the connecting seam 14 on the surface of the tile is peeled off to complete one tile.

In this example, the connecting sheet 14 is placed on the surface of the decorative tile 12.
After fixing the ferrite plate 18, the ferrite plate 18 is bonded to the back surface of the tile 12. However, when the resin connecting sheet 14 is fixed to the tile surface by heating, the heating process is used to bond the ferrite plate 18 and The adhesive that has been interposed in advance between the tile 12 and the tile 12 may be reacted and solidified by heating, so that the tile 12 and the ferrite plate 18 are bonded together at the same time as the connection sheet 14 is fixed. In this case, Advantageously, the tile unit IO can be manufactured in a shorter time. This heat treatment cannot be performed at the PC board manufacturing site, and can only be performed when the tile unit IO is manufactured at the factory.

Although the embodiments of the present invention have been described in detail above, the tile unit of the present invention can be used not only when manufacturing the above-mentioned PC boards, but also when tiles are pasted on the surface at the same time as concrete is poured at a construction site. The present invention can be configured in various forms based on the knowledge of those skilled in the art without departing from the spirit thereof, such as the tile unit being able to be used in various forms other than the upper side. It is.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a tile unit that is an embodiment of the present invention, FIG. 2 is an explanatory diagram of one manufacturing method of the tile unit, and FIG. 3 is an explanation of a manufacturing method different from that shown in FIG. 2. It is a diagram. FIG. 4 is a sectional view showing an example of a general structure of a radio wave absorbing wall, and FIG. 5 is an explanatory diagram of a conventional general manufacturing method of a PC board used in its construction. lO: Tile unit 12: Decorative tile 14: Connecting sheet 16: 8 feet 18.22: Ferrite board 20: Adhesive

Claims (1)

[Claims] It has a plurality of tiles arranged in a predetermined arrangement, and a connecting sheet that is fixed to the surface side of the tiles until the tiles are pasted and connects each tile in the arrangement, and A tile unit for radio wave absorbing walls that features a ferrite plate bonded to the back side with adhesive.