JPH0330454U - - Google Patents
Info
- Publication number
- JPH0330454U JPH0330454U JP8587990U JP8587990U JPH0330454U JP H0330454 U JPH0330454 U JP H0330454U JP 8587990 U JP8587990 U JP 8587990U JP 8587990 U JP8587990 U JP 8587990U JP H0330454 U JPH0330454 U JP H0330454U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- base layer
- resin coating
- resistant film
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 239000012815 thermoplastic material Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は、本考案のプリント配線基板の一例を
示す平面図、第２図は、第１図のＡ−Ａ線拡大縦
断面図、第３図は、本考案のプリント配線基板に
電気部品を取付けた状態を示す正面図、第４図は
、第３図のＢ−Ｂ線拡大縦断面図、第５図は、基
板を折り曲げるため、これを下型と上型とで挟む
前の状態を示す要部縦断正面図、第６図は、下型
と上型とで基板を挟んだ状態を示す要部縦断正面
図、第７図は、完成した基板ユニツトをケースに
挿入する前の状態を示す斜視図、第８図は、完成
した基板ユニツトをケースに取付けた状態を示す
要部の縦断正面図、第９図は、従来のプリント配
線基板の接合例を示す斜視図である。
１……べース層、２……耐熱フイルム、３……
プリント配線、４……樹脂コーテイング、５……
窓孔、６……プリント配線基板、７……孔、８…
…電気部品、８ａ……リード線、９……はんだ、
１０……凹条、１１……熱風通路、１２……下型
、１３……上型、１３ａ……押圧部、１４……基
板ユニツト、１５……ケース、１６……止めねじ
。
FIG. 1 is a plan view showing an example of the printed wiring board of the present invention, FIG. 2 is an enlarged vertical cross-sectional view taken along the line A-A in FIG. 4 is an enlarged vertical cross-sectional view taken along the line B-B in FIG. 3, and FIG. 5 is a front view showing the state in which the board is attached. FIG. Fig. 6 is a longitudinal sectional front view of the main part showing the state where the board is sandwiched between the lower mold and the upper mold, and Fig. 7 is the state before inserting the completed board unit into the case. FIG. 8 is a longitudinal sectional front view of the main parts showing the completed board unit attached to the case, and FIG. 9 is a perspective view showing an example of bonding of a conventional printed wiring board. 1...Base layer, 2...Heat-resistant film, 3...
Printed wiring, 4...Resin coating, 5...
Window hole, 6... Printed wiring board, 7... Hole, 8...
...Electrical parts, 8a...Lead wire, 9...Solder,
DESCRIPTION OF SYMBOLS 10... Groove, 11... Hot air passage, 12... Lower die, 13... Upper die, 13a... Pressing part, 14... Board unit, 15... Case, 16... Set screw.
Claims (1)
とも一面に、可撓性を有する耐熱フイルムを固着
するとともに、その表面に、可撓性を有する所望
形状の導電性プリント配線を固着し、かつプリン
ト配線の上面と、プリント配線以外の耐熱フイル
ムの表面とに、絶縁性の樹脂コーテイングを設け
、かつこの樹脂コーテイングのうち、プリント配
線と電気部品とのはんだ付け部分や接触部と対応
する部分に窓孔を設けてなる折曲可能なプリント
配線基板。 A flexible heat-resistant film is fixed to at least one surface of a flat base layer made of a thermoplastic material, and a flexible conductive printed wiring of a desired shape is fixed to the surface of the base layer. An insulating resin coating is provided on the top surface and the surface of the heat-resistant film other than the printed wiring, and a window hole is formed in the resin coating at the part corresponding to the soldering or contacting part between the printed wiring and the electrical component. A bendable printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8587990U JPH0330454U (en) | 1990-08-16 | 1990-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8587990U JPH0330454U (en) | 1990-08-16 | 1990-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330454U true JPH0330454U (en) | 1991-03-26 |
Family
ID=31635233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8587990U Pending JPH0330454U (en) | 1990-08-16 | 1990-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330454U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101954117B1 (en) * | 2017-08-28 | 2019-03-06 | (주)아이디어스 | heating device |
-
1990
- 1990-08-16 JP JP8587990U patent/JPH0330454U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101954117B1 (en) * | 2017-08-28 | 2019-03-06 | (주)아이디어스 | heating device |