JPS6399767U - - Google Patents

Info

Publication number
JPS6399767U
JPS6399767U JP1986195729U JP19572986U JPS6399767U JP S6399767 U JPS6399767 U JP S6399767U JP 1986195729 U JP1986195729 U JP 1986195729U JP 19572986 U JP19572986 U JP 19572986U JP S6399767 U JPS6399767 U JP S6399767U
Authority
JP
Japan
Prior art keywords
terminal
glass substrate
flat cable
metal film
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986195729U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986195729U priority Critical patent/JPS6399767U/ja
Publication of JPS6399767U publication Critical patent/JPS6399767U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係るガラス基板端子と金属膜
端子片との接続構造を示す図、同図aは正面図、
同図bは側面図、同図cは同図aのA―A線上断
面図、同図dは同図cの一点鎖線Bで囲まれた部
分の拡大図、第2図は上記ガラス基板の平面図、
第3図はフラツトケーブルを示す一部切欠平面図
、第4図はガラス基板の端子部に熱可塑性接着剤
の層を形成した状態を示す平面図、第5図はフラ
ツトケーブルの配線パターン端子部に半田クリー
ム層を形成した状態を示す一部切欠平面図、第6
図はガラス基板の端子部にフラツトケーブルの端
子部を接続するための概略構成を示す図、第7図
a,bはガラス基板の端子部の接続構造を示す図
である。 図中、11……ガラス基板、12―1〜12―
4……端子、13……絶縁被覆、14……フラツ
トケーブル、15―1〜15―4……配線パター
ン、16―1〜16―4……導電性端子パターン
、17……熱可塑性接着剤、18……クリーム半
田。
Fig. 1 is a diagram showing a connection structure between a glass substrate terminal and a metal film terminal piece according to the present invention, and Fig. 1a is a front view;
Figure b is a side view, Figure c is a sectional view taken along the line A--A in Figure A, Figure d is an enlarged view of the area surrounded by the dashed line B in Figure c, and Figure 2 is an enlarged view of the glass substrate. Plan view,
Fig. 3 is a partially cutaway plan view showing the flat cable, Fig. 4 is a plan view showing a state in which a layer of thermoplastic adhesive is formed on the terminal portion of the glass substrate, and Fig. 5 is the wiring pattern of the flat cable. Partially cutaway plan view showing a state in which a solder cream layer is formed on the terminal part, No. 6
The figure shows a schematic structure for connecting the terminal part of a flat cable to the terminal part of a glass substrate, and FIGS. 7a and 7b show the connection structure of the terminal part of a glass substrate. In the figure, 11...Glass substrate, 12-1 to 12-
4...Terminal, 13...Insulating coating, 14...Flat cable, 15-1 to 15-4...Wiring pattern, 16-1 to 16-4...Conductive terminal pattern, 17...Thermoplastic adhesive Agent, 18...Cream solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面端子部に複数の金属膜端子が所定の間隔を
おいて形成されたガラス基板と、樹脂製シート表
面端子部に所定の間隔をおいて配線パターン端子
が所定の間隔をおいて形成されたフラツトケーブ
ルとを具備し、前記ガラス基板の金属膜端子上に
フラツトケーブルの配線パターン端子を半田付け
すると共にガラス基板の金属膜端子間とフラツト
ケーブルの配線パターン端子間とを熱可塑性接着
剤で接着したことを特徴とするガラス基板端子と
フラツトケーブル端子との接続構造。
A glass substrate on which a plurality of metal film terminals are formed at predetermined intervals on the surface terminal portion, and a resin sheet on which wiring pattern terminals are formed at predetermined intervals on the surface terminal portion. A wire pattern terminal of the flat cable is soldered onto the metal film terminal of the glass substrate, and a thermoplastic adhesive is used to bond between the metal film terminals of the glass substrate and the wiring pattern terminal of the flat cable. A connection structure between a glass substrate terminal and a flat cable terminal, characterized in that they are bonded together.
JP1986195729U 1986-12-19 1986-12-19 Pending JPS6399767U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986195729U JPS6399767U (en) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986195729U JPS6399767U (en) 1986-12-19 1986-12-19

Publications (1)

Publication Number Publication Date
JPS6399767U true JPS6399767U (en) 1988-06-28

Family

ID=31153885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986195729U Pending JPS6399767U (en) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPS6399767U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223465A (en) * 1999-11-30 2001-08-17 Denso Corp Connection method and connection structure of printed wiring board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921513A (en) * 1972-06-29 1974-02-26
JPS54144970A (en) * 1978-05-01 1979-11-12 Nitto Electric Ind Co Adhesive tape for electric circuit components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921513A (en) * 1972-06-29 1974-02-26
JPS54144970A (en) * 1978-05-01 1979-11-12 Nitto Electric Ind Co Adhesive tape for electric circuit components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223465A (en) * 1999-11-30 2001-08-17 Denso Corp Connection method and connection structure of printed wiring board

Similar Documents

Publication Publication Date Title
JPS6413144U (en)
JPS6399769U (en)
JPH0268452U (en)
JPH0338926U (en)
JPS63127077U (en)
JPH0213764U (en)
JPS6183080U (en)
JPS6449923U (en)
JPS6284921U (en)
JPH02189U (en)
JPS6180597U (en)
JPS6265863U (en)
JPS6168497U (en)
JPH0423161U (en)
JPS6389283U (en)
JPS6284970U (en)
JPS61134035U (en)
JPH0330454U (en)
JPS6287449U (en)
JPH03128937U (en)
JPS6176988U (en)
JPS61153373U (en)
JPS6247171U (en)
JPH03124643U (en)
JPS6285100U (en)