JPS6399767U - - Google Patents
Info
- Publication number
- JPS6399767U JPS6399767U JP1986195729U JP19572986U JPS6399767U JP S6399767 U JPS6399767 U JP S6399767U JP 1986195729 U JP1986195729 U JP 1986195729U JP 19572986 U JP19572986 U JP 19572986U JP S6399767 U JPS6399767 U JP S6399767U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- glass substrate
- flat cable
- metal film
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第1図は本考案に係るガラス基板端子と金属膜
端子片との接続構造を示す図、同図aは正面図、
同図bは側面図、同図cは同図aのA―A線上断
面図、同図dは同図cの一点鎖線Bで囲まれた部
分の拡大図、第2図は上記ガラス基板の平面図、
第3図はフラツトケーブルを示す一部切欠平面図
、第4図はガラス基板の端子部に熱可塑性接着剤
の層を形成した状態を示す平面図、第5図はフラ
ツトケーブルの配線パターン端子部に半田クリー
ム層を形成した状態を示す一部切欠平面図、第6
図はガラス基板の端子部にフラツトケーブルの端
子部を接続するための概略構成を示す図、第7図
a,bはガラス基板の端子部の接続構造を示す図
である。
図中、11……ガラス基板、12―1〜12―
4……端子、13……絶縁被覆、14……フラツ
トケーブル、15―1〜15―4……配線パター
ン、16―1〜16―4……導電性端子パターン
、17……熱可塑性接着剤、18……クリーム半
田。
Fig. 1 is a diagram showing a connection structure between a glass substrate terminal and a metal film terminal piece according to the present invention, and Fig. 1a is a front view;
Figure b is a side view, Figure c is a sectional view taken along the line A--A in Figure A, Figure d is an enlarged view of the area surrounded by the dashed line B in Figure c, and Figure 2 is an enlarged view of the glass substrate. Plan view,
Fig. 3 is a partially cutaway plan view showing the flat cable, Fig. 4 is a plan view showing a state in which a layer of thermoplastic adhesive is formed on the terminal portion of the glass substrate, and Fig. 5 is the wiring pattern of the flat cable. Partially cutaway plan view showing a state in which a solder cream layer is formed on the terminal part, No. 6
The figure shows a schematic structure for connecting the terminal part of a flat cable to the terminal part of a glass substrate, and FIGS. 7a and 7b show the connection structure of the terminal part of a glass substrate. In the figure, 11...Glass substrate, 12-1 to 12-
4...Terminal, 13...Insulating coating, 14...Flat cable, 15-1 to 15-4...Wiring pattern, 16-1 to 16-4...Conductive terminal pattern, 17...Thermoplastic adhesive Agent, 18...Cream solder.
Claims (1)
おいて形成されたガラス基板と、樹脂製シート表
面端子部に所定の間隔をおいて配線パターン端子
が所定の間隔をおいて形成されたフラツトケーブ
ルとを具備し、前記ガラス基板の金属膜端子上に
フラツトケーブルの配線パターン端子を半田付け
すると共にガラス基板の金属膜端子間とフラツト
ケーブルの配線パターン端子間とを熱可塑性接着
剤で接着したことを特徴とするガラス基板端子と
フラツトケーブル端子との接続構造。 A glass substrate on which a plurality of metal film terminals are formed at predetermined intervals on the surface terminal portion, and a resin sheet on which wiring pattern terminals are formed at predetermined intervals on the surface terminal portion. A wire pattern terminal of the flat cable is soldered onto the metal film terminal of the glass substrate, and a thermoplastic adhesive is used to bond between the metal film terminals of the glass substrate and the wiring pattern terminal of the flat cable. A connection structure between a glass substrate terminal and a flat cable terminal, characterized in that they are bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195729U JPS6399767U (en) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195729U JPS6399767U (en) | 1986-12-19 | 1986-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6399767U true JPS6399767U (en) | 1988-06-28 |
Family
ID=31153885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986195729U Pending JPS6399767U (en) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6399767U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223465A (en) * | 1999-11-30 | 2001-08-17 | Denso Corp | Connection method and connection structure of printed wiring board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921513A (en) * | 1972-06-29 | 1974-02-26 | ||
| JPS54144970A (en) * | 1978-05-01 | 1979-11-12 | Nitto Electric Ind Co | Adhesive tape for electric circuit components |
-
1986
- 1986-12-19 JP JP1986195729U patent/JPS6399767U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921513A (en) * | 1972-06-29 | 1974-02-26 | ||
| JPS54144970A (en) * | 1978-05-01 | 1979-11-12 | Nitto Electric Ind Co | Adhesive tape for electric circuit components |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223465A (en) * | 1999-11-30 | 2001-08-17 | Denso Corp | Connection method and connection structure of printed wiring board |