JPH0330835U - - Google Patents
Info
- Publication number
- JPH0330835U JPH0330835U JP9175089U JP9175089U JPH0330835U JP H0330835 U JPH0330835 U JP H0330835U JP 9175089 U JP9175089 U JP 9175089U JP 9175089 U JP9175089 U JP 9175089U JP H0330835 U JPH0330835 U JP H0330835U
- Authority
- JP
- Japan
- Prior art keywords
- mounting member
- contact surface
- plate
- conductor
- sensor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 3
- 238000013021 overheating Methods 0.000 claims 3
- 239000013013 elastic material Substances 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図はこの考案の実施例１の構成及びその取
付状態を示す斜視図、第２図は実施例１の正面図
、第３図は実施例１における変形例の取付状態を
示す斜視図、第４図は実施例１における他の変形
例を示す構成説明図、第５図及び第６図は実施例
２及びその変形例の構成を示す構成説明図、第７
図及び第８図は実施例３及びその変形例の構成を
示す構成説明図、第９図は実施例４の構成を示す
構成説明図である。
１……過熱センサ本体、２ａ……底面、４……
ガス発生手段、５……箱状体、６ａ，６ｂ……板
バネ、７，１０……銅バー。
FIG. 1 is a perspective view showing the structure of Embodiment 1 of this invention and its mounting state, FIG. 2 is a front view of Embodiment 1, and FIG. 3 is a perspective view showing the mounting state of a modification of Embodiment 1. FIG. 4 is a configuration explanatory diagram showing another modification of the first embodiment, FIGS. 5 and 6 are configuration explanatory diagrams showing the configuration of the second embodiment and its modification, and FIG.
8 and 8 are configuration explanatory diagrams showing the configuration of the third embodiment and its modification, and FIG. 9 is a configuration explanatory diagram showing the configuration of the fourth embodiment. 1...Overheat sensor body, 2a...Bottom surface, 4...
Gas generating means, 5... Box-shaped body, 6a, 6b... Leaf spring, 7, 10... Copper bar.
Claims (1)
状導体との接面を構成壁として有し、少なくとも
その接面を良熱伝導性材料で構成した箱状体及び
その内部に位置し所定温度に達した際にガスを発
生する手段からなる過熱センサ本体と、この過熱
センサ本体に設けられ、前記接面を前記板状導体
に対向して着脱可能に挟持させるための弾性材か
らなる取付部材とからなる過熱センサ。 ２ 取付部材が、前記接面に隣接する背向側壁か
らそれぞれ延び、前記板状導体の両側縁を着脱可
能に挟持する１対の板バネからなる請求項１記載
の過熱センサ。[Claims for Utility Model Registration] 1. A box-shaped box having as a constituent wall a surface in contact with a plate-like conductor that electrically connects electrical elements in an electrical device, and at least the contact surface is made of a material with good thermal conductivity. an overheating sensor body consisting of a body and a means located inside the body and generating gas when a predetermined temperature is reached; and an overheating sensor body provided on the overheating sensor body, and detachably sandwiched with the contact surface facing the plate conductor. An overheat sensor consisting of a mounting member made of an elastic material and a mounting member made of an elastic material. 2. The overheat sensor according to claim 1, wherein the mounting member comprises a pair of leaf springs each extending from a rear side wall adjacent to the contact surface and detachably sandwiching both side edges of the plate-shaped conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175089U JPH0330835U (en) | 1989-08-03 | 1989-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9175089U JPH0330835U (en) | 1989-08-03 | 1989-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330835U true JPH0330835U (en) | 1991-03-26 |
Family
ID=31641218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9175089U Pending JPH0330835U (en) | 1989-08-03 | 1989-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330835U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009066111A (en) * | 2007-09-12 | 2009-04-02 | Takazono Sangyo Co Ltd | Drug packaging device |
| JP2020173112A (en) * | 2019-04-08 | 2020-10-22 | Tdk株式会社 | Temperature sensor unit |
-
1989
- 1989-08-03 JP JP9175089U patent/JPH0330835U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009066111A (en) * | 2007-09-12 | 2009-04-02 | Takazono Sangyo Co Ltd | Drug packaging device |
| JP2020173112A (en) * | 2019-04-08 | 2020-10-22 | Tdk株式会社 | Temperature sensor unit |
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