JPH0331082Y2 - - Google Patents

Description

[Detailed Description of the Invention] "Industrial Application Field" This invention relates to a suction and holding device used in the process of processing and inspecting semiconductor wafers.

"Prior Art" Conventionally, when trying to suction semiconductor wafers of different sizes onto a sample stand, when holding a semiconductor wafer on a sample stand consisting of several concentric grooves with suction holes, the wafer It was necessary to change the conditions of the sample stage according to the size of the sample.

``Problem that the invention seeks to solve'' In other words, in the process of semiconductor wafer processing and inspection, each time the type of semiconductor wafer to be processed or inspected changes, unnecessary suction holes are created in advance according to the size of the wafer. It was necessary to close unnecessary suction holes and grooves, or by rotating the sample stage and changing the connection with the vacuum pressure channel.

The semiconductor wafer suction/holding device of this invention is capable of suctioning a wafer even if the wafer to be suctioned changes, without requiring any of the above-mentioned operations in advance.

``Means for Solving the Problems'' The semiconductor wafer suction and holding device of this invention is shown in FIGS. 1 to 4 showing one embodiment thereof.
Several concentric grooves 2 to 8 are formed on the surface of the sample stage 1.
A plurality of first suction holes 9 are provided in each of the plurality of first concentric grooves 5 to 8 within the area for sucking the smallest diameter wafer 13. The second wafer within the area that attracts the larger diameter wafers 23 to 43 accommodated in the
A second suction hole 10 is provided in one of the concentric grooves 2 to 4, and a vertical groove 11 is formed in which the second concentric groove 2 to 4 has the same cross-sectional area as the second suction hole 10. and 12, the wafer can be sucked onto the sample stage 1 without any work or setting in advance.

``Embodiment'' An embodiment of the semiconductor wafer suction and holding device of this invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a sample stage, on the surface of which concentric grooves 2, 3, 4, 5, 6, 7, and 8 are bored. A first concentric groove 5 within the outer shape of the wafer 13 with the smallest diameter to be adsorbed;
6, 7, and 8 are provided with a plurality of first suction holes 9 to introduce vacuum pressure into each groove, and each suction hole 9
are connected by a vacuum pressure path 14. The second concentric groove 4 having a diameter slightly larger than the diameter of the minimum diameter wafer 13 has a single second suction hole 10;
The other second concentric grooves 2, 3 without a suction hole are the vertical grooves 11, 1 at the location of the second suction hole 10.
It is connected to the concentric groove 4 via the groove 2.

Next, a case in which four types of wafers with different diameters are actually picked up is shown in FIGS. 2 to 4. First, when the wafer to be picked up has the smallest diameter, the wafer 13 is placed in the first concentric groove 5, as shown in FIG.
6, 7, and 8 are closed. Vacuum pressure is introduced into each groove via a plurality of first suction holes 9 and a vacuum pressure conduit 14. In this case, the second suction hole 1
Although a little more than 0 air is introduced into the vacuum pressure guide path 14, the cross-sectional area of this second suction hole 10 is smaller than that of the wafer 1.
Compared to the vacuum pressure that requires sufficient adsorption force to adsorb 3, the size is such that it does not matter if it leaks. As an example, a plurality of first suction holes 9 are provided in each groove, and only one second suction hole 10 is provided in the second concentric groove 4.

FIG. 3 shows a case where a wafer 23 with a larger diameter is picked up. This wafer 23 is placed so as to close the second concentric groove 4 and the first concentric grooves 5, 6, 7, and 8. Vacuum pressure conduit 14 as in FIG.
When vacuum pressure is introduced through the wafer 23, the wafer 23 is attracted to the sample stage 1. In this case, some air is introduced into the guide path 14 from the vertical groove 11, but this vertical groove 1
By making the cross-sectional area of the second suction hole 10 substantially the same as the cross-sectional area of the second suction hole 10, the wafer 23 can be suctioned under the same conditions as when the wafer 13 of FIG. 2 is suctioned.

FIG. 4 shows a case where a wafer 33 with a larger diameter is attracted. The wafer 33 has a second concentric groove 3,
4 and the first concentric grooves 5, 6, 7, and 8 are closed. In this case, some air flows from the outer concentric groove 2 to the vertical groove 12 into the guide path 14.
However, by making the cross-sectional area of the vertical groove 12 almost the same as the cross-sectional area of the second suction hole 10, the wafer 33 can be suctioned under the same conditions as when the wafer 13 in FIG. 2 is suctioned. can. Of course, the shapes of the second suction hole 10 and the vertical grooves 11, 12 are not limited to these and can be arbitrarily selected as long as the above objectives can be achieved.

"Effect of the invention" Since this invention is configured as described above, when picking up various types of wafers from the smallest diameter wafer to the largest diameter wafer, it is possible to pick up wafers without any work settings being required in advance. can. Further, by making the cross-sectional area of the second suction hole 10 and the cross-sectional area of the vertical groove 11 or 12 substantially the same, it is possible to obtain a desired suction force accurately with a simple structure.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of this invention, and FIGS. 2 to 4 are cross-sectional views taken along line A-A in FIG.
FIG. 2 shows a case where a wafer with the smallest diameter is picked up, FIG. 3 shows a case where a wafer slightly larger than the smallest diameter wafer is picked up, and FIG. 4 shows a case where a wafer with the largest diameter is picked up. 1... Sample stage, 2, 3, 4... Second concentric groove, 5, 6, 7, 8... First concentric groove, 9...
...First suction hole, 10...Second suction hole, 11,
12... Vertical groove, 13... Wafer, 14... Vacuum pressure guide.

Claims (1)

[Scope of utility model registration request] Several concentric grooves are bored on the surface of the sample stage, and a plurality of first suction holes are provided in each of the first concentric grooves within the area that attracts the smallest diameter wafer. housed within concentric grooves of the
A second suction hole is provided in one of the plurality of second concentric grooves within the area for suctioning a wafer with a larger diameter, and the second concentric groove has the same cross-sectional area as the second suction hole. By connecting with vertical grooves drilled in the
A semiconductor wafer suction/holding device characterized by being able to suction a wafer to a sample stage without any work or setting in advance.