JPH0331736B2 - - Google Patents
Info
- Publication number
- JPH0331736B2 JPH0331736B2 JP13898286A JP13898286A JPH0331736B2 JP H0331736 B2 JPH0331736 B2 JP H0331736B2 JP 13898286 A JP13898286 A JP 13898286A JP 13898286 A JP13898286 A JP 13898286A JP H0331736 B2 JPH0331736 B2 JP H0331736B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- impregnated
- resin
- melamine resin
- paper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 49
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 claims description 48
- 229920000877 Melamine resin Polymers 0.000 claims description 38
- 239000004640 Melamine resin Substances 0.000 claims description 35
- 239000002966 varnish Substances 0.000 claims description 32
- 239000003063 flame retardant Substances 0.000 claims description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 15
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000005011 phenolic resin Substances 0.000 claims description 11
- 229920001568 phenolic resin Polymers 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- 150000002367 halogens Chemical class 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 3
- 239000000123 paper Substances 0.000 description 32
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- 238000005470 impregnation Methods 0.000 description 10
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- -1 nitrogen-containing compound Chemical class 0.000 description 3
- 229920003987 resole Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229910000410 antimony oxide Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
〔技術分野〕
本発明は、印刷回路用銅張積層板などの製造に
用いられる樹脂含浸基材の製造方法に関するもの
である。
〔背景技術〕
印刷回路用銅張積層板は所要枚数の樹脂含浸基
材を重ね、さらにこれに銅箔などの金属箔を重ね
て加熱加圧することによつて作成される。そして
印刷回路用銅張積層板の難燃性を高めるためには
樹脂含浸基材の難燃化を進める必要がある。そし
て紙基材にフエノール系樹脂を含浸乾燥して得ら
れる樹脂含浸基材の難燃化のために従来から種々
の方法が採用されており、次にその代表的なもの
を列挙する。
含浸フエノール系樹脂にテトラブロムビスフ
エノールＡなどハロゲンやリン等を含む化合物
の難燃剤を添加する方法
紙基材をメラミン樹脂等の含窒素化合物で処
理する方法
上記のとの方法を併用する方法
三酸化アンチモンとハロゲン化合物とを併用
して樹脂とともに基材に含浸させる方法
しかしの方法では、十分な難燃効果を得るた
めには多量のハロゲンやリンを含む化合物の難燃
剤が必要であつて製造コストが高くなり、しかも
このハロゲン化合物などの難燃剤の多量配合によ
つて積層板の耐熱性が低下するという問題があ
り、の方法ではメラミン樹脂の多量の使用によ
つて積層板の機械的強度が低下するという問題が
あり、の方法ではとのそれぞれの問題を有
する。さらにの方法では三酸化アンチモンを樹
脂ワニスに添加して紙基材に含浸させるにあたつ
て、樹脂ワニス中で三酸化アンチモンが沈降し易
くて基材に三酸化アンチモンを均一に分散させる
ことが難しく、このために作業性が悪いと共に安
定した難燃性を得ることが難しいという問題があ
る。
〔発明の目的〕
本発明は、上記の点に鑑みて為されたものであ
り、積層板の耐熱性や機械的強度を低下させるこ
となく安定した難燃性を得ることができる樹脂含
浸基材の製造方法を提供することを目的とするも
のである。
〔発明の開示〕
しかして本発明に係る樹脂含浸基材の製造方法
は、五酸化アンチモンが配合されたメラミン樹脂
ワニスを紙基材に一次含浸させたのちに、ハロゲ
ン系難燃剤が配合されたフエノール系樹脂ワニス
を紙基材に含浸させ、これを乾燥することを特徴
とするものであり、以下本発明を詳細に説明す
る。
五酸化アンチモン（Sb2O5・4H2O）は三酸化
アンチモンと同様にハロゲン系難燃剤の難燃助剤
として作用すると共に樹脂ワニスに均一に分散す
る。本発明はかかる知見に基づいてなされたもの
であつて、まず五酸化アンチモンを配合して一次
含浸用のメラミン樹脂ワニスを調製する。メラミ
ン樹脂ワニスに対する五酸化アンチモンの添加量
は、樹脂固形分に対して0.5〜15重量％に設定す
るのが好ましい。ここでメラミン樹脂ワニスにお
いて溶媒の中に水を含む場合には五酸化アンチモ
ンはより良好に均一に分散し、ワニス中で安定に
存在して沈降しないために、メラミン樹脂ワニス
はその溶媒として水を30％以上含有するものであ
ることが好ましく、他にメタノール、トルエン、
アセトン、メチルエチルケトンなどの揮発性有機
溶媒を併用することもできる。水は紙基材に浸透
し易く、従つて紙基材へのメラミン樹脂ワニスの
合浸を促して五酸化アンチモンを均一に紙基材に
付着させる作用もなす。また有機溶媒はメラミン
樹脂ワニスを含浸したのちの乾燥を速める作用を
なす。
しかして、紙基材としてはクラフト紙やリンタ
ー紙などが用いられ、この紙基材に五酸化アンチ
モンを配合したメラミン樹脂ワニスを一次含浸と
して含浸させて乾燥する。このように五酸化アン
チモン入りのメラミン樹脂ワニスを一次含浸する
ことによつて、紙基材内に五酸化アンチモンとメ
ラミン樹脂とを浸透させて付着させる。このよう
にして一次含浸がなされた紙基材にさらにフエノ
ール樹脂または変性フエノール樹脂を含浸樹脂と
したフエノール系樹脂ワニスを含浸させる。この
二次以降に含浸されるフエノール系樹脂ワニスに
はハロゲン系難燃剤を添加して用いる。このよう
に二次以降の含浸をおこなつたのちに紙基材を乾
燥することによつて樹脂含浸基材を得ることがで
きる。
このようにして作成される樹脂含浸基材を所要
枚数重ねると共にさらに銅箔などの金属箔を重
ね、これを加熱加圧することによつて例えば印刷
回路用銅張積層板を製造することができる。ここ
で、積層板の難燃性はハロゲン系難燃剤と難燃助
剤として作用する五酸化アンチモン及びメラミン
樹脂によつて向上されるが、五酸化アンチモンの
配合によつてハロゲン系難燃剤やメラミン樹脂の
使用量を低減することができ、ハロゲン系難燃剤
を多量に使用することによる積層板の耐熱性の低
下や、メラミン樹脂を多量に使用することによる
積層板の機械的強度の低下を防止することができ
るものである。
次に本発明を実施例によつてさらに説明する。
実施例 １
メラミンとホルマリンを主成分とするメラミン
樹脂80重量部、水550重量部、メタノール370重量
部、固形分48％の五酸化アンチモンゾル（日産化
学工業製）25重量部からなる溶液によつてメラミ
ン樹脂ワニスを調製し、直ちにこれを厚み10ミル
スのクラフト紙に一次含浸させた。これを120℃
の乾燥機中で10分間乾燥し、五酸化アンチモンと
メラミン樹脂とが含浸付着された紙基材を得た。
このときの紙基材中の五酸化アンチモンの付着量
は紙基材に対して２重量％、メラミン樹脂の付着
量は紙基材に対して９重量％であつた。
つぎにフエノールとホルマリンと桐油とを主成
分とするレゾール樹脂にテトラブロムフエノール
Ａ（以下TBAと略称）をレゾール樹脂に対して25
重量％添加してフエノール樹脂ワニスを調製し、
これを一次含浸を完了した上記紙基材に二次含浸
として含浸させて乾燥し、樹脂含有量が53重量％
の樹脂含浸基材を得た。
実施例 ２
メラミンとホルマリンを主成分とするメラミン
樹脂90重量部、水550重量部、メタノール360重量
部、固形分48％の五酸化アンチモンゾル（日産化
学工業製）６重量部からなる溶液によつてメラミ
ン樹脂ワニスを調製し、直ちにこれを厚み10ミル
スのリンター紙に一次含浸させた。これを120℃
の乾燥機中で10分間乾燥し、五酸化アンチモンと
メラミン樹脂とが含浸付着された紙基材を得た。
このときの紙基材中の五酸化アンチモンの付着量
は紙基材に対して0.5重量％、メラミン樹脂の付
着量は紙基材に対して10.5重量％であつた。
つぎにフエノールとホルマリンと桐油とを主成
分とするレゾール樹脂にTBAをレゾール樹脂に
対して25重量％添加してフエノール樹脂ワニスを
調製し、これを一次含浸を完了した上記紙基材に
二次含浸として含浸させて乾燥し、樹脂含有量が
53重量％の樹脂含浸基材を得た。
実施例 ３
実施例１における五酸化アンチモンを配合した
メラミン樹脂ワニスを24時間放置したのちに、こ
のメラミン樹脂ワニスを紙基材に一次含浸として
含浸させるようにした他は実施例と同様にして樹
脂含浸基材を得た。このとき一次含浸後の紙基材
中での五酸化アンチモンの付着量は紙基材に対し
て２重量％、メラミン樹脂の付着量は紙基材に対
して９重量％であり、実施例１と同じであつた。
このことは五酸化アンチモンを含有するメラミン
樹脂ワニスは常に安定した状態にあることを意味
する。
比較例 １
一次含浸用のメラミン樹脂ワニスに五酸化アン
チモンを配合しない他は実施例１と同様にして樹
脂含浸基材を得た。
比較例 ２
メラミンとホルマリンを主成分とするメラミン
樹脂150重量部、水550重量部、メタノール350重
量部からなる溶液によつてメラミン樹脂ワニスを
調製し、直ちにこれを厚み10ミルスのクラフト紙
に一次含浸させた。これを120℃の乾燥機中で10
分間乾燥し、メラミン樹脂が含浸付着された紙基
材を得た。このときの紙基材中のメラミン樹脂の
付着量は紙基材に対して15.5重量％であつた。あ
とは実施例１と同様にして樹脂含浸基材を得た。
上記各実施例や各比較例で得た樹脂含浸基材を
各８枚積層すると共にその片側に接着剤付きの銅
箔（厚み35μ）を積層し、これを加熱加圧成形し
て印刷配線板用の片面銅張積層板を得た。この積
層板の耐熱特性や機械的強度、難燃特性を測定し
た。結果を第１表に示す。第１表中、「半田耐熱
性」は260℃の半田浴に積層板を浮かせてフクレ
が発生するまでの時間を測定することによつて試
験をおこなつた。
[Technical Field] The present invention relates to a method for manufacturing a resin-impregnated base material used for manufacturing copper-clad laminates for printed circuits and the like. [Background Art] Copper-clad laminates for printed circuits are produced by stacking a required number of resin-impregnated base materials, then overlaying a metal foil such as copper foil, and heating and pressing the layers. In order to improve the flame retardancy of copper-clad laminates for printed circuits, it is necessary to make the resin-impregnated base material flame retardant. Various methods have been conventionally employed to make a resin-impregnated base material obtained by impregnating and drying a paper base material with a phenol resin to make it flame retardant, and representative methods are listed below. A method of adding a flame retardant such as a compound containing halogen or phosphorus, such as tetrabromobisphenol A, to the impregnated phenolic resin A method of treating the paper base material with a nitrogen-containing compound such as a melamine resin A method of using the above method in combination 3 A method of impregnating a base material with a resin using a combination of antimony oxide and a halogen compound.However, in order to obtain a sufficient flame retardant effect, a large amount of a flame retardant containing a halogen or phosphorus compound is required. In addition, there is a problem that the heat resistance of the laminate is reduced due to the high cost and the addition of a large amount of flame retardants such as halogen compounds. There is a problem that . In a further method, when antimony trioxide is added to a resin varnish and impregnated into the paper base material, it is difficult to uniformly disperse the antimony trioxide in the base material because the antimony trioxide tends to settle in the resin varnish. Therefore, there are problems in that workability is poor and it is difficult to obtain stable flame retardancy. [Object of the Invention] The present invention has been made in view of the above points, and provides a resin-impregnated base material that can obtain stable flame retardancy without reducing the heat resistance or mechanical strength of the laminate. The purpose of this invention is to provide a method for manufacturing. [Disclosure of the Invention] However, the method for producing a resin-impregnated base material according to the present invention involves first impregnating a paper base material with a melamine resin varnish containing antimony pentoxide, and then blending a halogen flame retardant. The present invention is characterized in that a paper base material is impregnated with a phenolic resin varnish and then dried.The present invention will be described in detail below. Antimony pentoxide (Sb 2 O 5 .4H 2 O), like antimony trioxide, acts as a flame retardant aid for halogen flame retardants and is uniformly dispersed in resin varnish. The present invention was made based on this knowledge, and first, antimony pentoxide is blended to prepare a melamine resin varnish for primary impregnation. The amount of antimony pentoxide added to the melamine resin varnish is preferably set to 0.5 to 15% by weight based on the resin solid content. When water is included in the solvent of melamine resin varnish, antimony pentoxide is better and more uniformly dispersed, exists stably in the varnish, and does not settle, so melamine resin varnish uses water as its solvent. It is preferable that it contains 30% or more, and in addition methanol, toluene,
Volatile organic solvents such as acetone and methyl ethyl ketone can also be used in combination. Water easily permeates into the paper base material, and therefore also acts to promote the co-immersion of the melamine resin varnish into the paper base material and to uniformly adhere antimony pentoxide to the paper base material. The organic solvent also has the effect of accelerating drying after impregnating the melamine resin varnish. As the paper base material, kraft paper, linter paper, etc. are used, and this paper base material is impregnated with a melamine resin varnish containing antimony pentoxide as a primary impregnation, and then dried. By primary impregnation with the melamine resin varnish containing antimony pentoxide in this manner, the antimony pentoxide and melamine resin are allowed to penetrate into the paper base material and adhere thereto. The paper base material which has been primarily impregnated in this manner is further impregnated with a phenolic resin varnish using a phenolic resin or a modified phenolic resin as an impregnating resin. A halogen flame retardant is added to the phenolic resin varnish that is impregnated in the secondary and subsequent stages. A resin-impregnated base material can be obtained by drying the paper base material after performing the secondary and subsequent impregnations in this manner. For example, a copper-clad laminate for printed circuits can be manufactured by stacking the required number of resin-impregnated base materials thus prepared, further stacking metal foil such as copper foil, and heating and pressurizing this. Here, the flame retardancy of the laminate is improved by the halogenated flame retardant and the antimony pentoxide and melamine resin that act as flame retardant aids. The amount of resin used can be reduced, preventing a decrease in the heat resistance of the laminate due to the use of large amounts of halogenated flame retardants, and a decrease in the mechanical strength of the laminate due to the use of large amounts of melamine resin. It is something that can be done. Next, the present invention will be further explained with reference to Examples. Example 1 A solution consisting of 80 parts by weight of melamine resin containing melamine and formalin as main components, 550 parts by weight of water, 370 parts by weight of methanol, and 25 parts by weight of antimony pentoxide sol (manufactured by Nissan Chemical Industries) with a solid content of 48% was used. A melamine resin varnish was prepared, and 10 mils thick kraft paper was immediately impregnated with the melamine resin varnish. This at 120℃
The paper base material was dried in a dryer for 10 minutes to obtain a paper base impregnated with antimony pentoxide and melamine resin.
At this time, the amount of antimony pentoxide adhered to the paper base material was 2% by weight, and the amount of melamine resin adhered to the paper base material was 9% by weight. Next, tetrabromophenol A (hereinafter abbreviated as TBA) was added to the resol resin whose main components are phenol, formalin, and tung oil at 25% of the resol resin.
Prepare a phenolic resin varnish by adding % by weight,
This was impregnated as a secondary impregnation into the paper base material that had completed the primary impregnation, and the resin content was 53% by weight.
A resin-impregnated base material was obtained. Example 2 A solution consisting of 90 parts by weight of melamine resin containing melamine and formalin as main components, 550 parts by weight of water, 360 parts by weight of methanol, and 6 parts by weight of antimony pentoxide sol (manufactured by Nissan Chemical Industries, Ltd.) with a solid content of 48% was used. A melamine resin varnish was prepared and immediately impregnated onto linter paper having a thickness of 10 mils. This at 120℃
The paper base material was dried in a dryer for 10 minutes to obtain a paper base impregnated with antimony pentoxide and melamine resin.
At this time, the amount of antimony pentoxide adhered to the paper base material was 0.5% by weight, and the amount of melamine resin adhered to the paper base material was 10.5% by weight. Next, a phenolic resin varnish was prepared by adding 25% by weight of TBA to a resol resin whose main components are phenol, formalin, and tung oil. It is impregnated as impregnation and dried, and the resin content is
A 53% by weight resin-impregnated substrate was obtained. Example 3 The melamine resin varnish containing antimony pentoxide in Example 1 was allowed to stand for 24 hours, and then the paper base material was impregnated with the melamine resin varnish as the primary impregnation. An impregnated base material was obtained. At this time, the amount of antimony pentoxide deposited in the paper base material after primary impregnation was 2% by weight based on the paper base material, and the deposited amount of melamine resin was 9% by weight based on the paper base material. It was the same.
This means that the melamine resin varnish containing antimony pentoxide is always in a stable state. Comparative Example 1 A resin-impregnated base material was obtained in the same manner as in Example 1, except that antimony pentoxide was not added to the melamine resin varnish for primary impregnation. Comparative Example 2 A melamine resin varnish was prepared from a solution consisting of 150 parts by weight of melamine resin whose main components are melamine and formalin, 550 parts by weight of water, and 350 parts by weight of methanol, and this was immediately applied to kraft paper with a thickness of 10 mils. Impregnated. This was dried in a dryer at 120℃ for 10 minutes.
After drying for a few minutes, a paper base impregnated with melamine resin was obtained. The amount of melamine resin adhered to the paper base material at this time was 15.5% by weight based on the paper base material. The rest was carried out similarly to Example 1 to obtain a resin-impregnated base material. Eight resin-impregnated base materials obtained in each of the above Examples and Comparative Examples are laminated, and copper foil (thickness 35μ) with adhesive is laminated on one side of the resin-impregnated base materials, and this is heated and pressure-molded to form a printed wiring board. A single-sided copper-clad laminate for use was obtained. The heat resistance properties, mechanical strength, and flame retardant properties of this laminate were measured. The results are shown in Table 1. In Table 1, "soldering heat resistance" was tested by floating the laminate in a solder bath at 260°C and measuring the time until blistering occurred.
上述のように本発明にあつては、五酸化アンチ
モンが配合されたメラミン樹脂ワニスを紙基材に
一次含浸させたのちに、ハロゲン系難燃材剤を配
合したフエノール系樹脂ワニスを紙基材に含浸さ
せ、これを乾燥するようにしたものであるから、
五酸化アンチモンの配合によつてハロゲン系難燃
剤やメラミン樹脂の使用量を低減して、耐熱性や
機械的強度を低下させることなく難燃特性を向上
させることができるものであり、しかもも五酸化
アンチモンはフエノール系樹脂ワニス中で均一に
沈降されることなく分散されるものであり、難燃
特性を安定して向上させることができるものであ
る。
As described above, in the present invention, after a paper base material is primarily impregnated with a melamine resin varnish containing antimony pentoxide, a phenolic resin varnish containing a halogen flame retardant is applied to the paper base material. It is made by impregnating it with water and drying it.
By incorporating antimony pentoxide, the amount of halogenated flame retardants and melamine resin used can be reduced, and flame retardant properties can be improved without reducing heat resistance or mechanical strength. Antimony oxide is uniformly dispersed in the phenolic resin varnish without being precipitated, and can stably improve flame retardant properties.
Claims (1)
ワニスを紙基材に一次含浸させたのちに、ハロゲ
ン系難燃剤が配合されたフエノール系樹脂ワニス
を紙基材に含浸させ、これを乾燥することを特徴
とする樹脂含浸基材の製造方法。 ２ 五酸化アンチモンが配合されたメラミン樹脂
ワニスはその溶媒の30重量％以上が水であること
を特徴とする特許請求の範囲第１項記載の樹脂含
浸基材の製造方法。[Scope of Claims] 1. After first impregnating a paper base material with a melamine resin varnish containing antimony pentoxide, the paper base material is impregnated with a phenolic resin varnish containing a halogen flame retardant. A method for producing a resin-impregnated base material, the method comprising drying the resin-impregnated base material. 2. The method for producing a resin-impregnated base material according to claim 1, wherein the melamine resin varnish containing antimony pentoxide contains water at least 30% by weight of its solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898286A JPS62295928A (en) | 1986-06-14 | 1986-06-14 | Preparation of resin-impregnated base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13898286A JPS62295928A (en) | 1986-06-14 | 1986-06-14 | Preparation of resin-impregnated base material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62295928A JPS62295928A (en) | 1987-12-23 |
| JPH0331736B2 true JPH0331736B2 (en) | 1991-05-08 |
Family
ID=15234711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13898286A Granted JPS62295928A (en) | 1986-06-14 | 1986-06-14 | Preparation of resin-impregnated base material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62295928A (en) |
-
1986
- 1986-06-14 JP JP13898286A patent/JPS62295928A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62295928A (en) | 1987-12-23 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |