JPH0332319U - - Google Patents
Info
- Publication number
- JPH0332319U JPH0332319U JP9364689U JP9364689U JPH0332319U JP H0332319 U JPH0332319 U JP H0332319U JP 9364689 U JP9364689 U JP 9364689U JP 9364689 U JP9364689 U JP 9364689U JP H0332319 U JPH0332319 U JP H0332319U
- Authority
- JP
- Japan
- Prior art keywords
- self
- resin
- adhesive layer
- layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 229920001225 polyester resin Polymers 0.000 claims 1
- 239000004645 polyester resin Substances 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
Landscapes
- Insulated Conductors (AREA)
Description
図面は、本考案の一実施例の断面図を示す。 ３……自己融着層、４……エポキシ樹脂層。 The drawing shows a cross-sectional view of an embodiment of the present invention. 3...Self-bonding layer, 4...Epoxy resin layer.
Claims (1)
ステル系樹脂、ブチラール系樹脂、ポリアミド系
樹脂のいずれかよりなる自己融着層を設け、さら
にその上にエポキシ樹脂層を０．２〜５μの厚さ
に設けてなることを特徴とする自己融着性絶縁電
線。 A self-adhesive layer made of polyester resin, butyral resin, or polyamide resin is provided on the conductor via a polyurethane insulating layer, and an epoxy resin layer is further applied to a thickness of 0.2 to 5 μm on top of the self-adhesive layer. A self-bonding insulated wire characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9364689U JPH0332319U (en) | 1989-08-09 | 1989-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9364689U JPH0332319U (en) | 1989-08-09 | 1989-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332319U true JPH0332319U (en) | 1991-03-28 |
Family
ID=31643014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9364689U Pending JPH0332319U (en) | 1989-08-09 | 1989-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332319U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101364343B1 (en) * | 2013-11-25 | 2014-02-18 | 김기성 | File for holding document sheets |
-
1989
- 1989-08-09 JP JP9364689U patent/JPH0332319U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101364343B1 (en) * | 2013-11-25 | 2014-02-18 | 김기성 | File for holding document sheets |