JPH0332423U - - Google Patents
Info
- Publication number
- JPH0332423U JPH0332423U JP9405589U JP9405589U JPH0332423U JP H0332423 U JPH0332423 U JP H0332423U JP 9405589 U JP9405589 U JP 9405589U JP 9405589 U JP9405589 U JP 9405589U JP H0332423 U JPH0332423 U JP H0332423U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- mold
- molding device
- clamped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図及び第２図は第１の実施例を示す正面図
、第３図及び第４図は第２の実施例を示す正面図
である。第５図及び第６図は従来の樹脂モールド
装置の正面図、第７図は上下金型の一部省略部分
を含む平面図、第８図は第７図の−線拡大断
面図である。
１１……下金型、１２……上金型、１５……リ
ードフレーム、Ｃ，Ｅ……移動機構。
1 and 2 are front views showing the first embodiment, and FIGS. 3 and 4 are front views showing the second embodiment. 5 and 6 are front views of a conventional resin molding device, FIG. 7 is a plan view including partially omitted parts of the upper and lower molds, and FIG. 8 is an enlarged sectional view taken along the line -- in FIG. 7. 11...Lower mold, 12...Upper mold, 15...Lead frame, C, E...Movement mechanism.
Claims (1)
リードフレーム上の主要部を樹脂被覆する樹脂モ
ールド装置において、 上記上金型をその衝合位置を除いて相対的に斜
め上下に離隔するように位置させる移動機構を具
備したことを特徴とする樹脂モールド装置。[Scope of claim for utility model registration] The lead frame is clamped by upper and lower molds,
A resin molding device for coating a main part on a lead frame with resin, characterized by comprising a moving mechanism for positioning the upper mold so as to be relatively diagonally spaced apart from each other in the vertical direction except for the abutting position. mold equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9405589U JPH0332423U (en) | 1989-08-09 | 1989-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9405589U JPH0332423U (en) | 1989-08-09 | 1989-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332423U true JPH0332423U (en) | 1991-03-29 |
Family
ID=31643396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9405589U Pending JPH0332423U (en) | 1989-08-09 | 1989-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332423U (en) |
-
1989
- 1989-08-09 JP JP9405589U patent/JPH0332423U/ja active Pending