JPH0332434U - - Google Patents
Info
- Publication number
- JPH0332434U JPH0332434U JP9142489U JP9142489U JPH0332434U JP H0332434 U JPH0332434 U JP H0332434U JP 9142489 U JP9142489 U JP 9142489U JP 9142489 U JP9142489 U JP 9142489U JP H0332434 U JPH0332434 U JP H0332434U
- Authority
- JP
- Japan
- Prior art keywords
- package
- low
- refrigerant
- shaft
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
第１図は本考案の第１の実施例を示す図であり
、第２図は本考案の作用を説明する図であり、第
３図は本考案が適用される全体構造図であり、第
４図は従来の構造を示す図である。
図において、１……パツケージ、１ａ……主放
熱面、３……ブロツク、３ａ……シヤフト、３ｂ
……外壁、３ｃ，３ｃ′……開口部、３ｄ……連
結部、６……基板、６……低沸点冷媒、をそれぞ
れ示す。
FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a diagram explaining the operation of the present invention, FIG. 3 is an overall structural diagram to which the present invention is applied, and FIG. FIG. 4 is a diagram showing a conventional structure. In the figure, 1...Package, 1a...Main heat radiation surface, 3...Block, 3a...Shaft, 3b
...outer wall, 3c, 3c'...opening, 3d...connecting portion, 6...substrate, 6...low boiling point refrigerant, respectively.
Claims (1)
向にパツケージ１が実装された基板５を浸漬して
冷却する横実装型浸漬冷却構造に於いて、 棒状のシヤフト３ａと、該シヤフト３ａと連結
され、且つ前記低沸点冷媒６が排出される開口部
３ｃと前記パツケージ１の放熱面から所定間隔を
あけて該低沸点冷媒６が供給される開口部３ｃ′
とを外壁３ｂによつて囲まれるブロツク３を該パ
ツケージ１の主放熱面１ａに植立したことを特徴
とする横実装型浸漬冷却構造。[Scope of Claim for Utility Model Registration] In a horizontally mounted type immersion cooling structure in which a board 5 on which a package 1 is laterally mounted is immersed and cooled in a cooling tank in which a low boiling point refrigerant 6 is sealed, a rod-shaped a shaft 3a, an opening 3c connected to the shaft 3a and through which the low-boiling refrigerant 6 is discharged, and an opening 3c' to which the low-boiling refrigerant 6 is supplied at a predetermined distance from the heat radiation surface of the package 1;
A horizontal mounting type immersion cooling structure characterized in that a block 3 surrounded by an outer wall 3b is installed on the main heat radiation surface 1a of the package 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9142489U JPH0648866Y2 (en) | 1989-08-04 | 1989-08-04 | Horizontal mounting immersion cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9142489U JPH0648866Y2 (en) | 1989-08-04 | 1989-08-04 | Horizontal mounting immersion cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332434U true JPH0332434U (en) | 1991-03-29 |
| JPH0648866Y2 JPH0648866Y2 (en) | 1994-12-12 |
Family
ID=31640908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9142489U Expired - Lifetime JPH0648866Y2 (en) | 1989-08-04 | 1989-08-04 | Horizontal mounting immersion cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648866Y2 (en) |
-
1989
- 1989-08-04 JP JP9142489U patent/JPH0648866Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648866Y2 (en) | 1994-12-12 |
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