JPH0332437U - - Google Patents
Info
- Publication number
- JPH0332437U JPH0332437U JP9142789U JP9142789U JPH0332437U JP H0332437 U JPH0332437 U JP H0332437U JP 9142789 U JP9142789 U JP 9142789U JP 9142789 U JP9142789 U JP 9142789U JP H0332437 U JPH0332437 U JP H0332437U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- opening
- cooling tank
- cooling structure
- immersion cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は、本考案の一実施例を示す図であり、
第2図は、第1図の要部拡大図であり、第3図は
、従来の構造を示す図である。
図において、1……冷却槽、1a……側面、1
b……開口、2……低沸点冷媒、4……基板、5
……素子、7……フランジ、8……シールリング
、をそれぞれ示す。
FIG. 1 is a diagram showing an embodiment of the present invention,
FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is a diagram showing the conventional structure. In the figure, 1...cooling tank, 1a...side, 1
b...Opening, 2...Low boiling point refrigerant, 4...Substrate, 5
. . . element, 7 . . . flange, 8 . . . seal ring are shown, respectively.
Claims (1)
面実装された基板4を浸漬して、該素子5を冷却
する浸漬冷却構造に於いて、 前記冷却槽1の側面1aに開設した開口1bと
、該開口1bと該素子5とが対応するように位置
合わせした状態で、前記基板4を設けたことを特
徴とする浸漬冷却構造。[Claims for Utility Model Registration] In an immersion cooling structure in which a substrate 4 on which an element 5 is mounted on one side is immersed in a cooling tank 1 filled with a low boiling point refrigerant to cool the element 5, the cooling tank 1 An immersion cooling structure characterized in that the substrate 4 is provided in a state in which an opening 1b opened in a side surface 1a of the substrate 4 is aligned with the element 5 so that the opening 1b and the element 5 correspond to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9142789U JPH0332437U (en) | 1989-08-04 | 1989-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9142789U JPH0332437U (en) | 1989-08-04 | 1989-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332437U true JPH0332437U (en) | 1991-03-29 |
Family
ID=31640911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9142789U Pending JPH0332437U (en) | 1989-08-04 | 1989-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332437U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61131553A (en) * | 1984-11-30 | 1986-06-19 | Fujitsu Ltd | Immersion liquid cooling apparatus |
| JPS63170946A (en) * | 1987-01-08 | 1988-07-14 | Fujitsu Ltd | Airtightly bonded structure of ceramic substrate |
-
1989
- 1989-08-04 JP JP9142789U patent/JPH0332437U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61131553A (en) * | 1984-11-30 | 1986-06-19 | Fujitsu Ltd | Immersion liquid cooling apparatus |
| JPS63170946A (en) * | 1987-01-08 | 1988-07-14 | Fujitsu Ltd | Airtightly bonded structure of ceramic substrate |
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