JPH0332437U - - Google Patents

Info

Publication number
JPH0332437U
JPH0332437U JP9142789U JP9142789U JPH0332437U JP H0332437 U JPH0332437 U JP H0332437U JP 9142789 U JP9142789 U JP 9142789U JP 9142789 U JP9142789 U JP 9142789U JP H0332437 U JPH0332437 U JP H0332437U
Authority
JP
Japan
Prior art keywords
substrate
opening
cooling tank
cooling structure
immersion cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9142789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9142789U priority Critical patent/JPH0332437U/ja
Publication of JPH0332437U publication Critical patent/JPH0332437U/ja
Pending legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の一実施例を示す図であり、
第2図は、第1図の要部拡大図であり、第3図は
、従来の構造を示す図である。 図において、1……冷却槽、1a……側面、1
b……開口、2……低沸点冷媒、4……基板、5
……素子、7……フランジ、8……シールリング
、をそれぞれ示す。
FIG. 1 is a diagram showing an embodiment of the present invention,
FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is a diagram showing the conventional structure. In the figure, 1...cooling tank, 1a...side, 1
b...Opening, 2...Low boiling point refrigerant, 4...Substrate, 5
. . . element, 7 . . . flange, 8 . . . seal ring are shown, respectively.

Claims (1)

【実用新案登録請求の範囲】 低沸点冷媒が封入された冷却槽1に素子5が片
面実装された基板4を浸漬して、該素子5を冷却
する浸漬冷却構造に於いて、 前記冷却槽1の側面1aに開設した開口1bと
、該開口1bと該素子5とが対応するように位置
合わせした状態で、前記基板4を設けたことを特
徴とする浸漬冷却構造。
[Claims for Utility Model Registration] In an immersion cooling structure in which a substrate 4 on which an element 5 is mounted on one side is immersed in a cooling tank 1 filled with a low boiling point refrigerant to cool the element 5, the cooling tank 1 An immersion cooling structure characterized in that the substrate 4 is provided in a state in which an opening 1b opened in a side surface 1a of the substrate 4 is aligned with the element 5 so that the opening 1b and the element 5 correspond to each other.
JP9142789U 1989-08-04 1989-08-04 Pending JPH0332437U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9142789U JPH0332437U (en) 1989-08-04 1989-08-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9142789U JPH0332437U (en) 1989-08-04 1989-08-04

Publications (1)

Publication Number Publication Date
JPH0332437U true JPH0332437U (en) 1991-03-29

Family

ID=31640911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9142789U Pending JPH0332437U (en) 1989-08-04 1989-08-04

Country Status (1)

Country Link
JP (1) JPH0332437U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131553A (en) * 1984-11-30 1986-06-19 Fujitsu Ltd Immersion liquid cooling apparatus
JPS63170946A (en) * 1987-01-08 1988-07-14 Fujitsu Ltd Airtightly bonded structure of ceramic substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131553A (en) * 1984-11-30 1986-06-19 Fujitsu Ltd Immersion liquid cooling apparatus
JPS63170946A (en) * 1987-01-08 1988-07-14 Fujitsu Ltd Airtightly bonded structure of ceramic substrate

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