JPH0332442U - - Google Patents
Info
- Publication number
- JPH0332442U JPH0332442U JP7527089U JP7527089U JPH0332442U JP H0332442 U JPH0332442 U JP H0332442U JP 7527089 U JP7527089 U JP 7527089U JP 7527089 U JP7527089 U JP 7527089U JP H0332442 U JPH0332442 U JP H0332442U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- heat sink
- bonding
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例による混成集積回
路の上面図、第２図は第１図のイ部の拡大図、第
３図は従来の混成集積回路の上面図、第４図は従
来およびこの考案共通の混成集積回路を高周波回
路にに適用した場合の回路図である。
図において、１……電源回路、２……高周波回
路、３……高誘電率基板、４……アルミナ基板、
５……放熱板、６……リードを示す。なお、図中
、同一符号は同一、または相当部分を示す。
Fig. 1 is a top view of a hybrid integrated circuit according to an embodiment of this invention, Fig. 2 is an enlarged view of part A in Fig. 1, Fig. 3 is a top view of a conventional hybrid integrated circuit, and Fig. 4 is a conventional hybrid integrated circuit. FIG. 2 is a circuit diagram when the hybrid integrated circuit common to this invention is applied to a high frequency circuit. In the figure, 1... power supply circuit, 2... high frequency circuit, 3... high dielectric constant substrate, 4... alumina substrate,
5... Heat sink, 6... Leads. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
集積回路において、放熱板上に誘電率の異なる基
板を２種類以上融着して構成された事を特徴とす
る混成集積回路。 A hybrid integrated circuit formed by bonding a substrate onto a heat sink by soldering, the hybrid integrated circuit being characterized in that it is constructed by bonding two or more types of substrates with different dielectric constants onto the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7527089U JPH0332442U (en) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7527089U JPH0332442U (en) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332442U true JPH0332442U (en) | 1991-03-29 |
Family
ID=31615703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7527089U Pending JPH0332442U (en) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332442U (en) |
-
1989
- 1989-06-27 JP JP7527089U patent/JPH0332442U/ja active Pending