JPH0332442U - - Google Patents

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Publication number
JPH0332442U
JPH0332442U JP7527089U JP7527089U JPH0332442U JP H0332442 U JPH0332442 U JP H0332442U JP 7527089 U JP7527089 U JP 7527089U JP 7527089 U JP7527089 U JP 7527089U JP H0332442 U JPH0332442 U JP H0332442U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
heat sink
bonding
onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7527089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7527089U priority Critical patent/JPH0332442U/ja
Publication of JPH0332442U publication Critical patent/JPH0332442U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】
第１図はこの考案の一実施例による混成集積回
路の上面図、第２図は第１図のイ部の拡大図、第
３図は従来の混成集積回路の上面図、第４図は従
来およびこの考案共通の混成集積回路を高周波回
路にに適用した場合の回路図である。 図において、１……電源回路、２……高周波回
路、３……高誘電率基板、４……アルミナ基板、
５……放熱板、６……リードを示す。なお、図中
、同一符号は同一、または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板上に基板を半田により融着してなる混成
    集積回路において、放熱板上に誘電率の異なる基
    板を２種類以上融着して構成された事を特徴とす
    る混成集積回路。
JP7527089U 1989-06-27 1989-06-27 Pending JPH0332442U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7527089U JPH0332442U (ja) 1989-06-27 1989-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7527089U JPH0332442U (ja) 1989-06-27 1989-06-27

Publications (1)

Publication Number Publication Date
JPH0332442U true JPH0332442U (ja) 1991-03-29

Family

ID=31615703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7527089U Pending JPH0332442U (ja) 1989-06-27 1989-06-27

Country Status (1)

Country Link
JP (1) JPH0332442U (ja)

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