JPH033261A - Tape carrier for preventing electrostatic breakdown - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] Regarding a tape carrier that mounts a chip on an insulating tape, the purpose of this invention is to prevent the mounted chip from being charged with static electricity during subsequent processes and being destroyed by the discharge, and the intermediate portion is In a tape carrier in which a desired chip is mounted on an insulating tape on which a plurality of conductor circuit patterns are formed, the outer ends of which are separated by cutting, the insulating tape has outer ends of the circuit patterns aligned in the width direction. an end or an electrode communicated with the outer end; and a conductor pattern that overlaps the outer end row or electrode row when the insulating tape is folded back along the outer folding line of the outer end row or electrode row. It is characterized by being formed.

[Industrial application field]

The present invention relates to a tape carrier for preventing electrostatic damage, and particularly to a structure of a tape carrier that prevents a fine conductor layer formed on a mounted chip from being destroyed by static electricity generated during a process after mounting.

[Conventional technology]

3 is a perspective view showing essential parts of the magnetic bubble memory device, and FIG. 4 is a plan view of the chip assembly shown in FIG. 3.

In FIG. 3, the magnetic bubble memory device 1 houses the main part of the chip assembly 2, a permanent magnet, a drive coil, etc. (not shown) in a shield case 3, and seals the housing gap with a sealing resin 4. A shield case 3 is mounted on a bin grid array board 5.

As shown in FIG. 4, the chip assembly 2 includes a magnetic bubble memory chip 8 mounted on an insulating tape (generally polyimide film) 7 on which a plurality of conductor circuit patterns 6 are formed, and an insulator 9 reinforcing the insulating tape 7. After that, the chip 8 exposed at the center of the insulator 9 is covered with a silicone resin body 10 having excellent insulating properties, and a conductive circuit pattern 6 whose one end is connected to the chip 8 is formed from the left and right ends of the insulator 9. is derived.

In such a magnetic bubble memory device 1, the chip 8 on which a predetermined conductor layer has been formed is mounted on the insulating tape 7, and then the insulator 9 and the resin body 10 are formed and the chip 8 is sealed with the sealing resin 4. , handling operations and sealing resin 4
．． Insulator 9. If the resin body 10 is charged with static electricity during the baking process, the fine conductor layer formed on the chip 8 will be damaged by the discharge of the static electricity. Therefore, there was a problem in that the electrical characteristics of the chip 8, which was normal at the time of manufacture, deteriorated or even became unusable.

FIG. 5 is a plan view showing a tape carrier in a conventional magnetic bubble memory device, and FIG. 6 is a plan view 1 of the tape for preventing electrostatic damage of the tape carrier.

In FIG. 5, the tape carrier 11 has an insulating tape (
Polyimide film) 12 with many conductor circuit patterns 1
3, measurement electrodes 14a and 14b communicating with each outer end of the conductor circuit pattern 13, and a feed through hole 15. A through hole 16a that exposes the middle portion of the conductive circuit pattern 13 and a through hole 17 that exposes the end portion of the 1,000 tube 8 are formed. Each conductor circuit pattern 13 branches in the middle, and electrodes 14a and 14b formed at each outer end thereof are aligned in the width direction of the insulating tape 12.

In FIG. 6, the electrostatic breakdown prevention chip 121 has a conductor pattern 23 formed on a rectangular insulating tape (polyimide film) 22, and the middle part of the conductor pattern 23 is exposed through a hole 24 formed in the insulating tape 22. become.

After checking the characteristics of the chip 8 mounted on the tape carrier 11 via the electrode 14a (or 14b), the tape 21 is heated so that the conductor pattern 23 overlaps the row of electrodes 14a (or 14b). When joined by means such as crimping, the independently formed circuit patterns 13 are connected via the conductor patterns 23.

After that, the insulator 9. When the resin body 10 is formed and the unnecessary parts of the insulating tape 12 and the circuit pattern 13 are removed to form the sealing resin 4, the static electricity generated during these steps is reduced to the same potential between the conductor layers formed on the chip 8. Therefore, by connecting the conductor pattern 23 to the ground, damage caused by the discharge can be prevented.

[Problem to be solved by the invention]

However, in the conventional method using the electrostatic breakdown prevention tape 21, the conductor pattern 23 is
3 and its electrodes 14a and 14b in a separate process, and when mounting the tape 21 on the insulating tape 12, alignment is required, which is troublesome.

[Means for Solving the Problems] According to FIG. 1 showing an embodiment of the tape carrier for preventing electrostatic damage of the present invention, which aims to solve the above-mentioned problems, the outer end is cut by cutting the middle part. In a tape carrier 31 in which a desired chip 8 is mounted on an insulating tape 32 having a plurality of conductor circuit patterns 13 formed thereon, the insulating tape 32 has outer ends of the circuit patterns 13 aligned in the width direction. Or the electrode 14a communicated with the outer end
, 14b, and a conductor pattern 33a that overlaps the outer end row or the electrodes 14a, 14a row when the insulating tape 32 is folded back along the outer folding line 34 of the outer end row or the electrode 14a, 14a row. [Function] The tape carrier according to the above means is formed by folding back the insulating tape with folded cotton so that the outer end of each conductor circuit pattern or the electrode communicating with the outer end is connected to a common conductor. It can be bonded to the pattern, and as a result of this bonding, the conductor layer formed on the mounted chip has the same potential. Therefore, discharge breakdown of the conductor layer related to the formation of an insulating layer, etc. that protects the mounted chip will occur in the middle of the conductor circuit pattern. All parts can be completely eliminated before cutting.

Therefore, the manufacturing yield and reliability of characteristics of magnetic bubble memory devices and the like in which chips are mounted on tape carriers can be improved.

[Example] The tape carrier for preventing electrostatic damage according to the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a magnetic bubble memory chip mounted on a tape carrier according to an embodiment of the present invention, and FIG.
It is A sectional view (0).

In FIG. 1, in which the same reference numerals are used for parts common to the previous figure, the tape carrier 31 on which the magnetic bubble memory chip 8 is mounted on the bottom surface is an insulating tape (polyimide film) 32.
, a large number of conductor circuit patterns 13 and measurement electrodes 14a and 1 communicating with each outer end of the conductor circuit patterns 13.
4b, a frame-shaped conductor pattern including a portion 33a extending in the width direction of the insulating tape 32; a through hole 15 for feeding the conductor pattern 33°; Through-holes 16a and 16b that expose the middle portion of the conductive circuit pattern 13, and through-hole 17 that exposes the end portion of the chip 8. A plurality of through holes 35 along the folding line 34 located on the outside of the electrode 14b. A through hole 36 is formed to expose the middle portion of the conductive pattern 33a.

Rows of electrodes 14b (or 14a) and conductor pattern 33a
This means that they are provided at symmetrical positions across the folding line 34.

After checking the characteristics of the chip 8 mounted on the insulating tape 32 via the electrode 14a (or 14b), the tape carrier 31 folds the outside inward along the folding line 34, and forms a conductive pattern in the row of the electrodes 14b. 33a
Each electrode 14b and the conductor pattern 33 are overlapped with each other.
Join a.

In FIG. 2 showing both ends of the tape carrier 31 with two chips 8 mounted adjacent to each other and both ends in the length direction folded back, each mold 114b and the conductor pattern 33 are shown.
A is bonded to a by thermocompression bonding or by using a conductive tape.

As a result, the tape carrier 31, which corresponds to the conventional tape carrier 11, has each independently formed circuit pattern 12.
are connected via the conductor pattern 33a.

Then comes the next step! ! ! Rim 9. When the resin body 10 is formed and the unnecessary parts of the insulating tape 32 and circuit pattern 13 are removed to form the sealing resin 4, the static electricity generated during these steps is the same between the conductor layers formed on the chip 8. By connecting the conductive pattern 33a to the ground, damage caused by electrostatic discharge can be prevented.

In addition, in the above embodiment, the through hole 35 is connected to the insulating tape 32.
This is to facilitate folding along the folding line 34, and the present invention is not limited to the shape or presence or absence of the folding line 34.

Further, the embodiment described above is an example in which the present invention is applied to a magnetic bubble memory device, and the present invention is useful when applied to other devices that utilize tape carriers, such as semiconductor devices.

(Effects of the Invention) As explained above, the tape carrier according to the present invention prevents discharge breakdown of the chip conductor layer related to the formation of the insulating layer etc. that protects the mounted chip, and prevents the intermediate part of the conductive circuit pattern after the chip is mounted. It can be completely eliminated before cutting.

Therefore, in a magnetic bubble memory device or the like in which a chip is mounted on a tape carrier, it has the effect of improving manufacturing yield and reliability of characteristics.

[Brief explanation of the drawing]

Figure 1 shows the features of the present invention! A plan view of the tape carrier according to the embodiment; FIG. 2 is a plan view with the end of the tape carrier folded and its AA sectional view; FIG. 3 is a perspective view showing the main parts of the magnetic bubble memory device; The figures are a plan view of the chip assembly shown in FIG. 3, FIG. 5 is a plan view of a conventional tape carrier, and FIG. 6 is a plan view of a tape for preventing electrostatic damage in a conventional tape carrier. In the figure, 8 is a mounted chip, 13 is a conductor circuit pattern, 14a and 14b are electrodes, 31 is a tape carrier, 32 is an insulation tape, 33a is a conductor pattern for electrode bonding, and 34 is a folding line. Plan view of the tape carrier according to Honkomei's Issho Presentation Figure 1 Figure 1. A plane view of the tape carrier with the hook part ε bent. Figure 3; This is the plan view of the chip uncensored tape carrier according to the conventional example. Plan view of prevention tape

Claims (1)

[Claims] A tape carrier (1) in which a desired chip (8) is mounted on an insulating tape (32) on which a plurality of conductor circuit patterns (13) are formed, the outer ends of which are separated by cutting the middle part. In 31), the insulating tape (32) includes electrodes (14a, 14b) that are aligned in the width direction of the circuit pattern (13) or connected to the outer end, and electrodes (14a, 14b) that are connected to the outer end of the circuit pattern (13). columns or electrodes (
A conductor pattern (14a, 14b) that overlaps the outer end row or electrode (14a, 14b) row when the insulating tape (32) is folded back along the outer folding line (34) of the row
33a) A tape carrier for preventing electrostatic damage.