JPH0333070Y2 - - Google Patents

Description

[Detailed explanation of the invention] Industrial application field This invention is applicable to transistors, thyristors, ICs, etc.
This invention relates to a semiconductor device cooler for cooling semiconductor devices such as the above.

Description of the Prior Art FIGS. 5 and 6 show a conventional semiconductor device cooler. In this cooler 1, a large number of heat sinks 3 made of extruded aluminum are mounted in parallel on a base 2 for mounting semiconductor elements. A semiconductor element such as a transistor (indicated by a chain line T in FIG. 6) is fixed to the lower surface of the base 2. Each heat sink 3 includes upper and lower horizontal walls 4, a vertical wall 5 that connects both horizontal walls 4, and a plurality of horizontal fins 6 formed at equal intervals in the vertical direction on both sides of the vertical wall 5. It consists of With the corresponding edges of the upper and lower horizontal walls 4 and fins 6 of adjacent heat radiators 3 butted against each other, the lower horizontal walls 4 of each heat radiator 3 are attached to the upper surface of the base 2 via the brazing sheet 7. is joined to. An aluminum cover 8 having an inverted U-shape in cross section is attached to the base 2 to cover all the heat sinks 3. A plate-shaped aluminum solder is bonded to the inner surface of the cover 8. The upper surface of the horizontal portion 4 on the upper side of each heat sink 3 is joined to the inner surface of the cover 8. The base 2, brazing sheet 7, heat sink 3, and cover 8 are assembled together and then joined by a vacuum brazing method.

In this cooler 1, the plurality of heat radiators 3 provide
A plurality of ventilation passages 9 are formed in a space within the cover 8. The heat generated in the semiconductor element T is sequentially transmitted to the base 2, heat sink 3, and cover 8. The heat transmitted to these parts 2, 3, and 8 is caused by air (this flow is shown by arrows in FIG. 6) forced into the ventilation passage 9 by, for example, a fan (not shown). released to the outside.

In the cooler 1, the space between adjacent heat radiators 3 is partitioned by the fins 6, so that
Air does not move between the ventilation passages 9 between the heat sinks 3. For this reason, the air flowing through the ventilation passage 9 located relatively close to the base 2 rises to a temperature almost equal to the temperature of the base 2 while passing through the ventilation passage 9. There was a problem that heat exchange was no longer performed near the outlet, resulting in a decrease in heat radiation efficiency.

Purpose of the invention The object of the invention is to provide a semiconductor device cooler that can solve the above problems and improve heat dissipation efficiency.

Means for Solving the Problem A semiconductor device cooler according to this invention includes a plurality of heat sinks made of extruded aluminum sections mounted in parallel on a base for mounting semiconductor devices, and each heat sink is attached to at least one of a vertical wall and a vertical wall. A semiconductor device cooler having fins formed on one side is characterized in that the fins are formed with cut-and-raised portions.

DESCRIPTION OF EMBODIMENTS FIGS. 1 and 2 show a first embodiment of this invention. Components in FIG. 1 that are the same as those in FIG. 5 are given the same reference numerals and their explanations will be omitted. Hereinafter, the term "front" refers to the left side of FIG. 2, and the term "rear" refers to the right side of the figure.

The heat sink 13 of this semiconductor device cooler 10 is made of extruded aluminum, and has upper and lower horizontal walls 14,
It consists of a vertical wall 15 connecting both horizontal walls 14 and horizontal fins 16 formed on the vertical wall 15 at predetermined intervals in the vertical direction. Each fin 16 has
Two curved cut-out portions 17 are formed. Each cut-and-raised portion 17 is made by making a pair of front and rear cuts at a predetermined interval in the fins 16 formed in the front-rear direction of the vertical wall 15, and bending and curving the portion between the two cuts upward. The number of cut-and-raised portions 17 formed on each fin 16 can be determined arbitrarily. Although the cut-and-raised portion 17 is formed upward, it may be formed downward.
The side edges of the fins 16 and horizontal walls 14 of adjacent heat radiators 13, excluding the cut-and-raised portions 17, are butted against each other. A communication portion 18 of the ventilation passage 9 is formed by the cut-and-raised portion 17 .

When air is sent into the ventilation passages 9 from the front of the cooler 10 by a fan or the like (not shown), a portion of the air sent into each ventilation passage 9 flows as shown by the arrows in FIG. The air flows through the communication part 18 formed by the cut-and-raised part 17 to the upper, lower, or both upper and lower ventilation passages 9 of the ventilation passage 9 . Therefore, relatively low temperature air in the ventilation passage 9 located relatively far from the base 2 flows into the ventilation passage 9 located relatively close to the base 2, and
Relatively high temperature air in the ventilation passage 9 located relatively close to the base 2 flows into the ventilation passage 9 located relatively far from the base 2. Therefore, the temperature of the air in the ventilation passage 9 located relatively close to the base 2 can be prevented from rising to a temperature that is approximately equal to the temperature of the base 2. Furthermore, the surface area of the fins 16 is increased by the cut-and-raised portions 17, and turbulence is generated within the ventilation passage 9. As a result,
The heat dissipation efficiency of the cooler 10 is improved.

3 and 4 show a second embodiment of this invention. In FIG. 3, the same parts as in FIG. 1 are given the same reference numerals and their explanations will be omitted. This semiconductor element cooler 10A is different from that of the first embodiment in the heat dissipation body. In the heat dissipating body 13A of the cooler 10A, three upward cut-out portions 19u and three downward cut-out portions 19d are alternately formed between both ends of each fin 16A. The upward cut-out portion 19u is inclined obliquely upward toward the front (towards the air inlet). The downward cut-and-raised portion 19d is inclined obliquely downward toward the rear. A communication portion 20 of the ventilation passage 9 is formed by each cut-and-raised portion 19u and 19d. Upward cut-and-raised portion 19u and downward cut-and-raised portion 19
Only one of d may be formed.
A cut-out portion 19u formed on each fin 16A,
The number of 19d can be arbitrarily determined.

In this cooler 10A, when air is sent into each ventilation passage 9 from the front by a fan or the like, a part of the air sent into each ventilation passage 9 is transferred to the communication portion 20 as shown by the arrow in FIG. through the ventilation duct 9
It flows into the ventilation passage 9 below. Therefore, relatively low-temperature air in the ventilation passage 9 located relatively far from the base 2 flows into the ventilation passage 9 located relatively close to the base 2. It is possible to prevent the temperature of the air in a certain ventilation passage 9 from reaching a high temperature almost equal to the temperature of the base 2. Moreover, the surface area of the fin 16A is increased by the cut-and-raised portions 19u and 19d, and turbulence is generated within the ventilation passage 9. Therefore, the heat dissipation effect of the cooler 10A is improved.

In the first and second embodiments described above, the fins 16,
Although the fins 16A are formed on both sides of the vertical wall 15, the fins 16, 16A may be formed only on one side. Moreover, although the fins 16 and 16A are formed horizontally, they may be inclined.
The number of fins 16, 16A formed on the vertical wall 15 can be determined arbitrarily. The number of heat radiators 13, 13A provided on the base 2 can be arbitrarily determined as long as it is two or more. Adjacent heat sink 1
The side edges of the fins 16, 16A and the horizontal wall 14, excluding the cut-out portions 17, 19u, 19d of the fins 3, 13A, butt against each other, but the heat sink 13 is arranged so that these side edges are separated from each other. May be placed. Also, so that the fins 16, 16A of the adjacent heat sinks 13, 13A are staggered,
Fins 16, 16A may be formed.

Note that in the above embodiment, air is forced into the ventilation passage 9, but it is not necessary to force the air into the ventilation passage 9. In this case, air flows through the ventilation passage 9 due to natural convection.

Effects of the invention In the semiconductor device cooler according to this invention, since the fins are formed with cut-and-raised portions, the portions of the ventilation passage formed between adjacent heat sinks are relatively close to the semiconductor device mounting base. The air flowing through the semiconductor element mounting base and the air flowing through a portion located relatively far from the semiconductor element mounting base are mixed through the communication portion formed by the cut-and-raised portion. Therefore, it is possible to prevent the temperature of air passing through a portion of the ventilation path between adjacent heat radiators relatively close to the semiconductor mounting base from rising to approximately the same temperature as the base. Further, the cut-and-raised portion makes it possible to generate turbulent flow within the ventilation passage.
Furthermore, the surface area of the fins is increased by the cut-and-raised portions compared to conventional fins. Because of this, the heat dissipation efficiency of the semiconductor element cooler is improved.

[Brief explanation of the drawing]

1 and 2 show a first embodiment of this invention, in which FIG. 1 is a partially cutaway perspective view, FIG. 2 is a sectional view taken along the line - in FIG. 1, and FIGS. 3 and 4. 3 shows a second embodiment of this invention, FIG. 3 is a partially cutaway perspective view, FIG. 4 is a sectional view taken along the line - in FIG. 3, FIGS. 5 and 6 show a conventional example, and FIG. 5 is a partially cutaway perspective view, and FIG. 6 is a sectional view taken along the line - in FIG. 5. 2...Semiconductor element mounting base, 13, 13A
... heat sink, 14 ... horizontal wall, 15 ... vertical wall,
16, 16A...Fin, 17, 19A, 19d
...The cut-out part.

Claims (1)

[Scope of utility model registration request] A plurality of aluminum extruded heat sinks 1 mounted in parallel on a semiconductor element mounting base 2
3, 13A, and each heat sink 13, 13A has a vertical wall 15 and fins 16, 16A formed on at least one side of the vertical wall 15. 1. A semiconductor device cooler characterized in that portions 17, 19u, and 19d are formed.