JPH0333077Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] The present invention relates to a heatsink for electric elements.
Transistors, diodes,
This invention relates to a heat radiator for an electric element that radiates heat generated inside the heat generating component by attaching a heat generating component such as a thyristor and passing cooling water through a cooling channel provided on the other surface of the metal substrate.

[Conventional technology]

Heat-generating components such as transistors are mounted on one side of a metal substrate, cooling channels are provided at appropriate intervals on the other surface of the metal substrate, and cooling water is passed through the cooling channels to dissipate the heat generated from the heat-generating components. 2. Description of the Related Art Heat sinks for electric devices that radiate heat have been provided in the past. however,
In conventional heat radiators for electric devices, cooling channels are constructed from pipes with a circular cross section, and the cooling channels cannot be installed at the mounting positions of heat generating components, but are spaced apart from the mounting locations of heat generating components. Since two cooling channels are provided, the heat dissipation performance is not improved even though there are two cooling channels, and furthermore, there are disadvantages in that materials and assembly are required, and the weight is increased.

[Problem that the invention attempts to solve]

The present invention eliminates the above-mentioned drawbacks of the conventional technology. By providing a cooling channel with a flat cross section and with the flat direction substantially perpendicular to the metal substrate, it has good heat dissipation efficiency. The present invention provides a heat radiator for electric elements that saves materials, is lightweight, and simplifies assembly.

[Means for solving problems]

In the present invention, cooling channels are provided on the other side of a metal substrate on which heat-generating components are attached. This heat sink for an electric element is characterized in that the cooling water channel has a flat cross section, and the flat direction is substantially perpendicular to the metal substrate.

[Effect of invention]

The heat sink for electrical elements of the present invention mounts heat-generating components such as transistors on one side of a metal substrate, and passes cooling water through cooling channels provided on the other side of the metal substrate to radiate heat from the heat-generating components. do. Since this cooling channel has a flat cross section, it has a large heat absorption surface. In addition, since the flat direction of the cooling water channel is approximately perpendicular to the metal board, the ratio of the cooling water channel to the metal board is small, and it does not interfere with the installation of heat generating components. Can be installed in the same location.

〔Example〕

Embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view, FIG. 2 is a partially cutaway perspective view, FIG. 3 is a sectional view of the device in use, and FIG. 4 is a perspective view of another embodiment.

As shown in FIGS. 1 to 3, the heat sink for electric elements according to the present invention has a heat generating component 2 attached to one surface of a metal substrate 1, and a heat generating component 2 mounted on the other surface of the metal substrate 1 with narrow intervals. The protrusions 3 are formed integrally with the metal substrate 1. The metal substrate 1 and the protrusions 3 are made of a thermally conductive material such as aluminum alloy or copper, and are formed by extrusion molding. Further, the protrusion 3 is not located at the center of the metal substrate 1, but is located slightly on one side, and protrudes over the entire length of the metal substrate 1 in the longitudinal direction. On one side of this metal substrate 1,
A plurality of heat generating parts 2 such as transistors and diodes are attached, and a protrusion 3 on the other side of the metal substrate 1 is attached.
A cooling water channel 4 is provided between them. The cooling water channel 4 has a flat cross section, and in order to provide such a cooling water channel 4, a copper pipe 5 with a flat cross section is used. A copper pipe 5 is inserted and fixed between the protrusions 3 so that its flat direction is perpendicular to the metal substrate 1. The pipe 5 is fixed between the protrusions 3 of the metal substrate 1 by, for example, brazing.

FIG. 4 shows another embodiment in which a cooling channel 4 is provided integrally with a metal substrate 1 by extrusion molding. However, as long as the cooling water channel 4 has a flat shape and its flat direction is substantially perpendicular to the metal substrate 1, the means for providing it, its size, etc. are not limited to those shown in the drawings.

A heat generating component 2 such as a transistor is attached to one surface of the metal substrate 1 as described above with bolts 6.
At this time, as shown in FIG. 3, the bolts 6 and the legs 7 of the heat generating component 2 are passed through the metal substrate 1 while avoiding the cooling channel 4, so the heat generating component 2 can be mounted at the same position as the cooling channel 4. .

[Effect of idea]

As described above, according to the present invention, the cooling waterway has a large heat absorption surface, and furthermore, heat generating components can be attached to the position of the cooling waterway, so that the heat dissipation efficiency is extremely good. Further, since there is no need to provide a plurality of cooling channels, materials can be saved and assembly can be simplified, and the heat sink for electric elements is lightweight.

[Brief explanation of drawings]

The drawings show an embodiment of the heat sink for electric elements according to the present invention, in which FIG. 1 is an exploded perspective view, FIG. 2 is a partially cutaway perspective view, and FIG. 3 is a sectional view of the device in use.
FIG. 4 is a perspective view showing another embodiment. In the figure, 1 is a metal substrate, 2 is a heat generating component, 3 is a protrusion, 4 is a cooling channel, and 5 is a pipe.

Claims (1)

[Scope of utility model registration request] 1. A heat sink for an electric element, characterized in that a cooling channel having a flat cross section is provided on the other surface of a metal substrate on which a heat-generating component is attached so that the flat direction thereof is substantially perpendicular to the metal substrate.