JPH033372B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component, and more particularly to a method of connecting, packaging, and inspecting an electronic component element and a lead wire, and a lead wire holder used therein.

A conventional method for attaching this type of lead wire and its holder (plate) was called a chain lead wire and was constructed as shown in FIG. 1 or 2. That is, the first
The figure shows a chain lead wire punched from a single metal plate, and the lead wire holding plate 1 and the lead wire 2 were connected as a single plate from the beginning.
By clamping an electronic component such as a chip capacitor 3 to the tip of the chain lead wire and immersing it in a molten solder bath, the lead wire 2 is connected to the chip capacitor 3 by soldering. A patch plate made of aluminum or stainless steel is used to prevent the chip capacitor from falling off when it is immersed in this molten solder bath, and the through hole 4 for positioning is used to position the chain lead wire with respect to this patch plate. It's useful.

The chain lead wire shown in FIG. 1 has drawbacks such as the amount of unnecessary material used due to punching and the cross-sectional shape of the formed lead wire is not circular. Therefore, the welded chain lead wire shown in FIG. has been used.

This is a chain lead wire formed by arranging a lead wire holding plate 1 and a lead wire 2 at a predetermined interval using a suitable jig and welding the welding points 5.

The lead wire 2 is connected to the chip capacitor 3 by soldering in the same manner as the chain lead wire shown in FIG. 1, and then the capacitor portion is covered with a transfer mold or a resin dip. In this case as well, the positioning through hole 4 is used.

As described above, in the conventional lead wire holders shown in FIGS. 1 and 2, the base of the lead wire is cut off for inspection in the next process during the manufacturing process after the packaging is completed or after the seal is stamped on the exterior surface. The lead wire holding plate 1, which was no longer needed, was discarded. In other words, since the lead wire holding plate 1 is a metal plate and has good electrical conductivity, the lead wires soldered to both ends of the capacitor element 3 are short-circuited to each other. It was necessary to make them electrically independent.

In this way, the cut capacitors need to be re-aligned in order to be connected to each measuring device in the inspection process, which is one of the causes of an increase in the number of inspection man-hours. In addition, since the electrical characteristics cannot be checked during the manufacturing process before cutting the lead wires, exterior work and stamping work can be carried out on products with poor electrical characteristics due to thermal shock during soldering of the lead wires. This resulted in wasted man-hours and materials.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for attaching leads for electronic components and a lead wire holding jig that solve these drawbacks.

A method for manufacturing an electronic component according to the present invention includes inserting lead wires in a U-shape into each slit of a lead wire arrangement plate having a plurality of slits whose surfaces are electrically insulated from each other and made of an elastic material. A step of fixing the lead wire in a lead wire fixing groove formed in the slit, and a step of connecting an electronic component element near each tip of a plurality of U-shaped lead wires folded in parallel with dimensions approximately equal to the width of the slit. The method is characterized in that it includes the step of subsequently cutting the U-shaped portion of the lead wire. Preferably, folded lead wires whose tips are flattened are arranged at predetermined intervals and connected to electronic components at the flattened portions.

The present invention will be described in detail below with reference to the drawings.

FIGS. 3a and 3b are a perspective view and a partially sectional view showing an embodiment of the present invention, in which concave slits 8 are formed at equal intervals on one side of the lead wire arrangement plate 6. A fixing groove 81 for fixing the lead wire 7 is formed at both ends of the bottom surface. The lead wire 7 is folded back into a U-shape and inserted into each slit 8 as a U-shaped lead wire, and the lead wire 7 is fixed in a fixing groove 81 as shown in FIG. 3B. FIG. 3a shows a stage before the chip capacitor 3 is soldered between the tips 7a and 7b of the U-shaped lead wire 7. Figure 4 shows U
FIG. 3 is a perspective view showing a state in which the folded curved portion of the lead wire 7 is cut after the chip capacitor 3 is soldered and connected between the tip ends 7a and 7b of the lead wire 7. FIG. If the lead wire arrangement plate 6 is made of an electrically insulating material such as resin, each lead wire terminal becomes electrically independent. It goes without saying that the lead wire arrangement plate 6 may be made of a metal material such as aluminum, nickel, or stainless steel, with an insulating layer partially formed over its entire surface area.

As shown in FIGS. 3a and 3b, when the lead wire 7 has a U-shape, the lead wire 7 is pressed against the inner wall of the slit 8 by the elastic force of the lead wire 7 itself due to the U-shape, and the portion of the fixing groove 81 is If the fixing groove 81 is made of a resilient material such as hard rubber, the fixing groove 81 will have the elasticity to squeeze the lead wire 7, so the lead wire will not fall out from the slit 8 even without using a separate fixing spacer or the like. do not have.
Furthermore, the width of the entrance of the lead wire fixing groove 81 is
As shown in the figure, it is made smaller than the diameter of the lead wire 7,
By designing the lead wire 7 to be constricted by the elasticity of the hard rubber, the lead wire 7 can be more securely held.

In the present invention, since each lead wire terminal is electrically independent, not only exterior work and sealing work but also inspection can be done in batches, which saves the man-hours of realignment work and batch processing. Full automation is also easy. It also becomes possible to check electrical characteristics during the manufacturing process, and early detection of defective products eliminates wasted materials and man-hours, which has an extremely large effect on improving production efficiency.

The slit position for inserting the U-shaped lead wire shown in FIG. 3 can be used for the positioning through hole 4 shown in FIGS. If a holding structure is adopted in which a sufficient slit is not provided at the insertion position, it goes without saying that a through hole for positioning as shown in FIGS. 1 and 2 is provided.

[Brief explanation of the drawing]

1 and 2 are examples of conventional lead wire holding jigs, and FIGS. 3a and 4 are perspective views of lead wire holding jigs according to an embodiment of the present invention. Figure b is a partial sectional view of Figure 3a. Symbols in the figure: 1: Lead wire holding plate, 2: Lead wire, 3: Chip capacitor, 4: Through hole for positioning, 5: Welding point, 6: Lead wire placement plate, 7: U
Shape lead wire, 8: Fixing spacer, 7a, 7
b: Lead wire tip, 9: Straight long lead wire.

Claims (1)

[Claims] 1 Lead wires are inserted in a U-shape into each slit of a lead wire arrangement plate having a plurality of slits whose surfaces are electrically insulated from each other and made of an elastic material, and leads formed in the slits. A step of fixing the lead wire in the wire fixing groove, a step of connecting an electronic component element near each tip of a plurality of U-shaped lead wires folded in parallel with a dimension approximately equal to the width of the slit, and then A method of manufacturing an electronic component, comprising the step of cutting a U-shaped part.