JPH0333799B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention enables the injection position of a plating solution to be moved in electroplating technology.

[Conventional technology]

By filling a plating tank with a metal solution (hereinafter referred to as plating solution), immersing the anode and the object to be plated in this plating solution, and using the object to be plated as a cathode, electricity is passed between the anode and the anode through the plating solution. In a plating apparatus that deposits a plating film on the surface of an object to be plated, an injection pipe for supplying a plating solution into a plating tank has conventionally been fixed to the plating tank.

[Problem to be solved by the invention]

By the way, the flow of the plating solution in the plating tank has a great effect on the physical properties, deposition rate, and uniform electrodeposition of the coating formed on the surface of the object to be plated. In particular, the flow rate around the object to be plated and the anode If it is insufficient, a good film cannot be obtained. However, as mentioned above, in conventional plating equipment, the injection pipe of the plating solution is fixed to the plating tank, so the flow is controlled appropriately depending on the shape and size of the object to be coated, the type of the plating solution, etc. It was not possible to adjust to.

Therefore, the present invention has been made for the purpose of appropriately adjusting the flow of a plating solution in a plating tank to improve electrodeposition properties.

[Means to solve the problem]

For the above purpose, the plating apparatus of the present invention includes a plating liquid injection pipe in which a large number of thin nozzles are lined up in the vertical direction and are opened to horizontally inject the plating liquid into the plating tank.
It has a configuration in which it is attached to a carrier whose positioning is controlled with a degree of freedom in the horizontal direction on a carrier frame installed at the top of the plating tank, and a degree of freedom in the vertical direction is added to the injection pipe. It has the following configuration.

[Effect]

According to the apparatus of the present invention, the plating liquid injection tube can be freely moved and positioned within the plating tank by the carrier with two degrees of freedom in the horizontal direction or three degrees of freedom including the vertical direction. The injection tube has a large number of thin nozzles that spray the plating solution horizontally in the form of fine jets, which are lined up in the vertical direction and opened, so that the flow rate is almost uniform with no variation depending on the depth around the plating object. The flow of the plating solution is obtained, and the position of the plating solution injection tube is adjusted according to the shape and size of the object to be coated, the type of plating solution, etc. etc.), it is possible to obtain a flow of the plating solution with good results.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on the drawings.

In FIG. 1, 1 is a plating tank in which a plating solution 2 is stored, and 3 is a plating tank in which a plurality of thin nozzles 4, 4, . 5 is a suction pipe for collecting the plating solution 2;
6 is supported near the center of the plating tank 1 and immersed in the plating solution 2, and is rotated by a motor 7 at an appropriate rotation speed (usually 10 to 20 rpm), and connected to a DC power source (not shown) that converts AC into a rectifier circuit. The object to be plated is connected to the cathode of the DC converter (DC converter that converts it into smooth DC using a DC filter circuit) via a sliding contact (not shown); 8 is a support rod 9 installed above the plating bath 1;
The plating solution 2 is suspended from the plating solution 2 and is placed close to and facing the object 6 to be plated.
an anode immersed therein and connected to the anode of the DC power supply.

A carrier frame 10 having a pair of horizontal and parallel X-direction rails 11 is installed and fixed on the plating tank 1. And on this X direction rail 11,
A servo motor 1 whose X-direction carrier 14 having wheels 15 is fixed to a carrier frame 10
It is configured to reciprocate by rotation of a feed screw 13 extending in the X direction and connected to the output shaft of No. 2.

The X-direction carrier 14 has a pair of parallel Y-direction rails 16 that are horizontal and extend in a direction (Y-direction) perpendicular to the X-direction rail 11; Y with wheels 20
The direction carrier 19 is connected to the output shaft of the servo motor 17 mounted on the X direction carrier 14 and
It is designed to move back and forth by rotation of a feed screw 18 extending in the direction.

A servo motor 21 is mounted on the Y-direction carrier 19, and as shown in FIG. 2, a pinion 22 connected to the output shaft of this servo motor 21
is engaged with a rack 24 extending in a direction perpendicular to both the X-direction rail 11 and the Y-direction rail 16, that is, in the vertical direction (Z direction), and the Z-direction carrier 23 on which the rack 24 is formed is connected to the pinion. The rotation of 22 causes reciprocating movement in the Z direction.

The above-mentioned plating liquid injection pipe 3 is vertically supported by the Z-direction carrier 23, and the nozzles 4, 4...
The lower part of the servo motor 12, 17,
By moving the carriers 14, 19, and 23 by driving the carriers 14, 19, and 23 using the numerical control NC method, the plating liquid injection pipe 3 is moved in the X direction, Y direction, and
Positioning is controlled freely with three degrees of freedom in the Z direction. Fresh plating solution is supplied to the plating solution injection pipe 3 via a flexible hose 25 from an external filter pump (not shown).

The apparatus of this embodiment has the above-described configuration, and by rotating the object 6 to be plated and applying current between the object 6 to be plated as a cathode and the anode 8,
The electrolytic metal in the plating solution 2 is deposited on the surface of the object 6 to be plated. In addition, since clean plating solution containing no impurities is injected as a fine horizontal jet from each nozzle 4 arranged in the vertical direction of the plating solution injection tube 3, the flow rate does not vary depending on the depth. A nearly uniform flow is obtained, and this clean jet is applied to the object to be coated 6.
In order to supply the metal to the surrounding area, the injection position, that is, the position of the injection pipe 3, is adjusted by moving the carriers 14, 19, and 23, taking into account the shape of the object 6 to be plated and the required characteristics of the plating film to be deposited on the surface. is positioned as close to the object to be plated 6 as possible. The positioning control in this case is performed by the numerical control method as described above, so by programming the movement path etc. in advance, it is possible to prevent the injection pipe 3 from coming into contact with the object to be coated 6. Highly accurate positioning is possible.

In the above embodiment, each carrier is positioned using a feed screw and a combination of a rack and pinion, but this may also be done using other moving means, such as a hydraulic cylinder or a combination of a pulley and a belt. good. In addition, if the shape of the injection pipe is appropriately selected according to the shape of the object to be coated,
It is possible to set a better injection position.

[Effects of the Invention] As is clear from the above description, according to the present invention, the plating liquid injection pipe can be freely moved within the plating tank,
The plating solution is sprayed horizontally as fine jets from a large number of nozzles lined up vertically on this plating solution injection tube. By supplying a fresh, impurity-free plating solution to the surrounding area in a laminar, orderly flow with no variation in flow velocity depending on depth, electrodepositivity can be improved and a high-quality plating film can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway schematic perspective view showing an embodiment of the apparatus of the present invention, and FIG. 2 is a schematic front view of the main parts. 1... plating tank, 2... plating liquid, 3... plating liquid injection pipe, 4... nozzle, 5... suction pipe,
6...Product to be plated, 8...Anode, 10...Carrier mount, 14...X direction carrier, 19...Y
Direction carrier, 23...Z direction carrier.

Claims (1)

[Scope of Claims] 1. A plating solution injection pipe in which a large number of thin nozzles for horizontally injecting plating solution into the plating tank are opened in a row in the vertical direction is horizontally mounted on a carrier frame installed at the top of the plating tank. A plating device characterized in that it is attached to a carrier whose positioning is controlled with a degree of freedom. 2. The plating apparatus according to claim 1, wherein the plating liquid injection pipe is attached to the carrier via a carrier whose positioning is controlled with a degree of freedom in the vertical direction.