JPH033391A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPH033391A JPH033391A JP1135979A JP13597989A JPH033391A JP H033391 A JPH033391 A JP H033391A JP 1135979 A JP1135979 A JP 1135979A JP 13597989 A JP13597989 A JP 13597989A JP H033391 A JPH033391 A JP H033391A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electrode
- solder paste
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、チップ部品を面実装するプリント配線板およ
びプリント配線板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board on which chip components are surface mounted, and a method for manufacturing the printed wiring board.
（従来の技術）
従来、プリント基板にチップ部品を面実装するには、第
５図、第６図のように絶縁基板からなるプリント配線板
１ｂのチップ部品３の電極と対向する部分に電極よりも
大きい半田ランド２ｂを形成させて、この半田ランド２
ｂ’に半田ペースト７ｂを塗布させて、そこにチップ部
品３をのせて半田ペースト７ｂを溶かして、チップ部品
３の電極面と、電極４の側面全体に半田ペースト７ｂが
はみ出した縁（以下フィレットという）を形成させて面
実装をしていた。(Prior art) Conventionally, in order to surface-mount chip components on a printed circuit board, as shown in FIGS. Also, a large solder land 2b is formed, and this solder land 2
Apply the solder paste 7b to b', place the chip component 3 there, melt the solder paste 7b, and apply the solder paste 7b to the electrode surface of the chip component 3 and the entire side surface of the electrode 4 (hereinafter referred to as fillet). ) was formed and surface mounted.
しかしながら、このような構成によると、第７図、第８
図に示すように半田ペースト７ｂを溶かす際に、一方の
電極の半田ペーストが先に溶けてしまい、チップ部品３
の一方がはずれると、他方の接合している溶けた半田の
表面張力でチップ部品を持ち上げ、立たせてしまうとい
う俗にいうマンハッタン現象が発生することがあった。However, according to such a configuration, FIGS. 7 and 8
As shown in the figure, when melting the solder paste 7b, the solder paste on one electrode melts first, causing the chip component 3 to melt.
If one of the two parts comes off, the surface tension of the melted solder on the other part will lift the chip component and make it stand up, a so-called Manhattan phenomenon.
（発明が解決しようとする課題）
このように従来のプリント配線板およびプリント配線板
の製造方法においては、半田付けを行なった時、片側の
電極が半田付けの際、はずれてチップ部品が立ってしま
うマンハッタン現□象が発生してしまうことがあり、こ
のマンハッタン現象を防止するには非常に精度よく半田
付は時の温度管理を行なう必要があり、高価な設備と長
い半田付は時間を必要とする問題があった。(Problem to be Solved by the Invention) As described above, in conventional printed wiring boards and printed wiring board manufacturing methods, when soldering, one side of the electrode comes off during soldering, causing chip components to stand up. In order to prevent this Manhattan phenomenon, it is necessary to control the temperature during soldering very precisely, and expensive equipment and long soldering processes require time. There was a problem.
本発明は上記事情を考慮してなされたもので、マンハッ
タン現象が発生することのない配線補遺で信頼性、生産
性に潰れたプリント配線板及びプリント配線板の製造方
法を堤供することを目的としている。The present invention has been made in consideration of the above circumstances, and has the purpose of providing a printed wiring board and a method for manufacturing a printed wiring board that is low in reliability and productivity with a wiring supplement that does not cause the Manhattan phenomenon. There is.
（課題を解決するための手段）
本発明は上記課題を解決するために、まずプリント配線
板では、絶縁基板上のチップ部品の電極に対向する部分
に半田ランドを形成し、半田ペーストを用い、チップ部
品の面実装をするプリント配線板において、半田ランド
をチップ部品の電極の端面より内側になるように形成さ
せるように構成している。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention first forms a solder land on a portion of a printed wiring board facing an electrode of a chip component on an insulating substrate, and uses solder paste. A printed wiring board for surface mounting chip components is configured such that solder lands are formed inside the end surfaces of electrodes of the chip components.
また、プリント配線板の製造方法では、絶縁基板上のチ
ップ部品の電極に対向する部分に半田ランドを形成し、
半田ペーストを用いチップ部品の面実装をするプリント
配線板の製造方法において、半田ランドをチップ部品の
電極に対向する面とその周辺に形成し、チップ部品の電
極の端面より内側に半田ペーストを塗布させる。In addition, in the method of manufacturing a printed wiring board, a solder land is formed on the part of the insulating substrate facing the electrode of the chip component,
In a printed wiring board manufacturing method that uses solder paste to surface-mount chip components, a solder land is formed on and around the surface facing the electrode of the chip component, and solder paste is applied inside the end surface of the electrode of the chip component. let
（作 用）
このような構成のプリント配線板およびプリント配線板
の製造方法によれば半田ペーストよりもチップ部品の方
が熱容量が大きく、チップ部品の電極端面から半田ペー
ストがはみ出ないようになっていて、チップ部品が暖ま
らなければ半田ペーストは溶けないようになっている為
、半田ペーストは同時に溶ける。(Function) According to the printed wiring board having such a configuration and the method of manufacturing the printed wiring board, the chip component has a larger heat capacity than the solder paste, and the solder paste is prevented from protruding from the electrode end surface of the chip component. Since the solder paste will not melt unless the chip components warm up, the solder paste will melt at the same time.
またチップ部品の電極との接合面を電極端面よりも内側
になるように形成させるので半田ペーストの塗布量が少
なく、フィレットによる回転モーメントか発生すること
はほとんどない。Furthermore, since the joint surface of the chip component with the electrode is formed inside the end surface of the electrode, the amount of solder paste applied is small, and rotational moment due to the fillet is hardly generated.
したがって、半田ペーストが同時に溶け、フィレットに
よる回転モーメントが発生することが少ないので、マン
ハッタン現象を防止することができる。Therefore, the solder paste melts at the same time, and rotational moment due to the fillet is less likely to be generated, so that the Manhattan phenomenon can be prevented.
（実施例） 以下、本発明の実施例を図面に基づいて説明する。。(Example) Embodiments of the present invention will be described below based on the drawings. .
第１図、第２図は第１の発明に係る実施例のプリント配
線板であり、絶縁基板からなるプリント配線板ｌａ上に
マウントされるチップ部品３の電ｆ！４と導電部５との
接合面に半田ランド２ａを電［！４の端面の内側となる
ように形成させて、この半田ランド２ａに半田ペースト
７ａを塗布し、半田付けした構成になっている。FIGS. 1 and 2 show a printed wiring board according to an embodiment of the first invention, and the electric f! 4 and the conductive part 5, solder land 2a is electrically connected [! 4, and solder paste 7a is applied to this solder land 2a and soldered.
また、チップ部品３は半田ペースト７ａよりも熱容量が
大きく、チップ部品３の電極４の端面から半田ペースト
７ａがはみ出ないようにしているため、チップ部品３が
暖まらなければ半田ペースト７ａは溶けないようになっ
ている。In addition, the chip component 3 has a larger heat capacity than the solder paste 7a, and the solder paste 7a is prevented from protruding from the end surface of the electrode 4 of the chip component 3, so that the solder paste 7a does not melt unless the chip component 3 warms up. It has become.
以上のような実施例のプリント配線板１ａによれば、半
田ペースト７ａ全体が同時に溶けるので、電極４の片側
だけはずれて半田付けされることはなくなる。According to the printed wiring board 1a of the embodiment as described above, the entire solder paste 7a melts at the same time, so that only one side of the electrode 4 is prevented from being soldered off.
そして、チップ部品３の電極４との接合面の半田ランド
２ａがｔ ｆｉ！４の端面より内側となるようにして、
半田ペースト７ａを塗布したので半田ペースト２ａが少
なくて済み、半田ペーストがレジストによりチップ部品
の電極端面からはみ出ないようになっているのでフィレ
ットが発生することがなく、チップ部品３が立ってしま
うマンハッタン現象は完全に防止できる。Then, the solder land 2a on the joint surface of the chip component 3 with the electrode 4 is t fi! Make sure that it is inside the end surface of 4.
Since the solder paste 7a is applied, less solder paste 2a is needed, and since the solder paste is prevented from protruding from the electrode end surface of the chip component by the resist, fillets do not occur and the chip component 3 stands up. The phenomenon is completely preventable.
第３図、第４図は第２の発明の実施例に係るプリント配
線板の製造方法を用いたプリント配線板であり、絶縁基
板からなるプリント配線板ＩＣ上にマウントされるチッ
プ部品３の電極４と導電部５との接合面および接合周辺
に半田ランド２Ｃを形成させ、この半田ランド２Ｃ上チ
ップ部品３の電極４と導電部５との接合面に、半田ペー
スト７Ｃが電極４の端面の内側に塗布できるように電極
４の底面より狭い切り抜きを設けたマスクを乗せて、半
田ペーストを切り抜きに塗布する。3 and 4 show a printed wiring board using the printed wiring board manufacturing method according to the second embodiment of the invention, in which electrodes of a chip component 3 mounted on a printed wiring board IC made of an insulating substrate are shown. A solder land 2C is formed on the bonding surface between the electrode 4 and the conductive portion 5 and the area around the bond, and a solder paste 7C is applied to the bonding surface between the electrode 4 and the conductive portion 5 of the chip component 3 on the solder land 2C. A mask having a cutout narrower than the bottom surface of the electrode 4 is placed so that solder paste can be applied to the inside, and solder paste is applied to the cutout.
そして、この後マスクをはずし、チップ部品をマウント
し半田付けする構成になっている。After this, the mask is removed, and the chip components are mounted and soldered.
なお、第１の実施例同様半田ペースト７Ｃはチップ部品
が暖まらなければ溶けないようになっている。Note that, as in the first embodiment, the solder paste 7C does not melt unless the chip components are warmed up.
以上のような実施例のプリント配線板ＩＣによれば、半
田ペースト７Ｃ全体が同時に溶け、同時に、電極端面の
下部に半田ペースト７Ｃが濡れるので、電極４の片側だ
けはずれて半田付けされることはなくなる。According to the printed wiring board IC of the above embodiment, the entire solder paste 7C melts at the same time, and at the same time, the solder paste 7C wets the lower part of the electrode end face, so it is possible to prevent only one side of the electrode 4 from coming off when soldered. It disappears.
そして、半田ランド２Ｃにマスクにより、半田ペースト
７Ｃをチップ部品３と電極４との接合面で電極端面の内
側に形成するように塗布したので、半田ペースト７Ｃが
半田ペースト７Ｃを塗布しなかったｔｆ！端面の周辺に
濡れて、電極端面の下部に薄くフィレットが形成される
が、このフィレートは小さく表面張力はほとんどないの
で、マンハブタン現象は完全に防止できる。Then, the solder paste 7C was applied to the solder land 2C using a mask so as to be formed on the inside of the end surface of the electrode at the bonding surface between the chip component 3 and the electrode 4, so that the solder paste 7C was not applied to the solder paste 7C. ! The area around the end face gets wet and a thin fillet is formed at the bottom of the electrode end face, but this fillet is small and has almost no surface tension, so the man-button phenomenon can be completely prevented.
本発明のプリント配線板では半田ペーストを表面張力で
チップ部品を立たせてしまうほど多く塗布しないように
半田ランドをチップ部品の電極端面の内側に形成させて
塗布させ、プリント配線板の製造方法では半田ランドを
電極端面の外側まで形成させて、マスクにより半田ペー
ストを電［［面の内側に塗布させるようにしている。In the printed wiring board of the present invention, the solder land is formed inside the electrode end surface of the chip component so that the solder paste is not applied so much that the chip component will stand up due to surface tension. The land is formed to the outside of the electrode end surface, and the solder paste is applied to the inside of the electrode surface using a mask.
したがって、どちらの場合にも半田ペースト全体が同時
に溶けるようにさせるので、マンハッタン現象が発生す
ることのない配線構造を及び製造方法を堤供し信頼性、
生産性を向上させることかできる。Therefore, in both cases, the entire solder paste is melted at the same time, providing a wiring structure and manufacturing method that does not cause the Manhattan phenomenon, and improving reliability and reliability.
It can improve productivity.
第１図は本発明の第１実施例に係るプリント配線板の上
面図、第２図は同配線板の側面図、第３図は本発明の第
２実施例に係るプリント配線板の上面図、第４図は同配
線板の側面図、第５図は従来のプリント配線板の上面図
、第６図は同配線板の側面図、第７図はマンハッタン現
象となったプリント配線板の上面図、第８図は同配線板
の側面図である。
１・・・プリント配線板
２ａ、２ｂ、２ｃ・・・半田ランド
３・・・チップ部品 ４・・・電極
５・・・導電部
６・・・マスクにより塗布された半田ペースト７ａ、７
ｂ、７Ｃ−・・半田ペーストFIG. 1 is a top view of a printed wiring board according to a first embodiment of the present invention, FIG. 2 is a side view of the same wiring board, and FIG. 3 is a top view of a printed wiring board according to a second embodiment of the present invention. , Figure 4 is a side view of the same wiring board, Figure 5 is a top view of the conventional printed wiring board, Figure 6 is a side view of the same wiring board, and Figure 7 is the top view of the printed wiring board that caused the Manhattan phenomenon. 8 are side views of the wiring board. DESCRIPTION OF SYMBOLS 1... Printed wiring board 2a, 2b, 2c... Solder land 3... Chip component 4... Electrode 5... Conductive part 6... Solder paste 7a, 7 applied with a mask
b, 7C--Solder paste
Claims (2)
田ランドを形成し、半田ペーストを用いチップ部品の面
実装をするプリント配線板において、前記半田ランドを
前記チップ部品の電極の端面より内側になるように形成
したことを特徴とするプリント配線板。1. In a printed wiring board in which a solder land is formed on a portion facing the electrode of a chip component on an insulating substrate, and the chip component is surface-mounted using solder paste, the solder land is located inside the end surface of the electrode of the chip component. A printed wiring board characterized by being formed as follows.
田ランドを形成し、半田ペーストを用いチップ部品の面
実装をするプリント配線板の製造方法において、半田ラ
ンドを電極と対向する面とその周辺に形成し、チップ部
品の電極の端面より内側に半田ペーストを塗布すること
を特徴とするプリント配線板の製造方法。2. In a printed wiring board manufacturing method in which a solder land is formed on the part facing the electrode of a chip component on an insulating substrate, and the chip part is surface-mounted using solder paste, the solder land is formed on the surface facing the electrode and its surroundings. 1. A method for manufacturing a printed wiring board, comprising: forming a solder paste on the inside of an electrode of a chip component, and applying solder paste to the inner side of the end surface of an electrode of a chip component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1135979A JPH033391A (en) | 1989-05-31 | 1989-05-31 | Printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1135979A JPH033391A (en) | 1989-05-31 | 1989-05-31 | Printed wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033391A true JPH033391A (en) | 1991-01-09 |
Family
ID=15164352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1135979A Pending JPH033391A (en) | 1989-05-31 | 1989-05-31 | Printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054846A (en) * | 2007-08-28 | 2009-03-12 | Fujitsu Ltd | Printed wiring board and electronic device manufacturing method |
-
1989
- 1989-05-31 JP JP1135979A patent/JPH033391A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054846A (en) * | 2007-08-28 | 2009-03-12 | Fujitsu Ltd | Printed wiring board and electronic device manufacturing method |
| US8338715B2 (en) | 2007-08-28 | 2012-12-25 | Fujitsu Limited | PCB with soldering pad projections forming fillet solder joints and method of production thereof |
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