JPH0334448A - Semiconductor case for surface packaging - Google Patents

Abstract

PURPOSE:To improve patterning rate on a printed wiring board to reduce manufacturing cost by leading all contacts of all external lead terminals with a substrate on four sides in the same direction. CONSTITUTION:The direction of leading a plurality of external lead terminals 2 from four sides of a semiconductor case body 1 are made slant with appropriate angle not perpendicular to the four sides of the semiconductor case body 1 so that the tips of the corresponding external lead terminals 2 are positioned in a line. As a result all pads 3 for mounting parts are directed in parallel to the direction of pattern wiring 5 on a printed wiring board 4 so that the pads 3 for mounting parts do not interface with respect to the direction of the pattern wiring 5. Therefore a pattern wiring region can be largely increased thereby largely reducing the number of wires and reducing manufacturing cost.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor case for surface mounting, and more particularly to a semiconductor case for surface mounting in which the direction in which external lead terminals are led out is improved.

[Prior Art] Conventionally, as a semiconductor case for surface mounting in which external lead terminals are led out from the four sides of the case as described above, there is one shown in FIG. 2, for example. As shown in FIG. 2, this conventional semiconductor case for surface mounting is provided with external lead terminals 6.7 led out at right angles from each of the four sides of the semiconductor case main body l, which serves as a sealed container.

When mounting such a semiconductor case for surface mounting on the printed wiring board 4, prepare pads 3.8 for component mounting on the printed wiring board 47, and insert the bent ends of the external lead terminals 6, 7. It is designed to be mounted and installed.

[Problems to be Solved] When mounting the above-mentioned conventional semiconductor case for surface mounting on the printed wiring board 4, the component mounting pads 3.8 are arranged in a direction that intersects with the extension line in the longitudinal direction as shown in the figure. I had to.

As a result, the pattern wiring area 9 on the printed wiring board 4
It is not possible to form a pattern wiring area on the component mounting bat 8 perpendicular to the pattern wiring area, which becomes an obstacle and deteriorates the patterning rate on the printed wiring board 4. To you! There was a problem that the manufacturing cost of the a-substrate would increase.

In addition, there are examples of adopting multilayer wiring as a means to avoid the above-mentioned problems and increase the patterning rate.
A printed wiring board formed by this method has a problem in that the cost increases significantly.

The present invention has been made in view of the above-mentioned conventional problems, and the installation force of the bat provided on the printed wiring cutting board does not interfere with the line area of the pattern, thereby improving the patterning rate on the printed wiring cutting board. The purpose of the present invention is to provide a semiconductor case for surface mounting, which can improve performance and reduce manufacturing costs.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a semiconductor case for surface mounting in which external lead terminals are led out from the four sides of a sealed container, in which the contact points of all external lead terminals with the substrate are connected to the four sides. Both are derived in the same direction.

[Example] Hereinafter, an example of the present invention will be explained with reference to the drawings.
Do 1.

The first [3] is a surface mounting board 4 according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a state 1b in which a body case is mounted on a printed wiring board.

As shown in FIG. 121, the semiconductor case for surface mounting includes a semiconductor case main body L and four sides of the semiconductor case main body 1.
The point that it consists of a plurality of external lead terminals 2... is the same as the conventional one, but the leading direction of each external lead terminal 2 is not perpendicular to the four sides of the half-quad case body l, but each The external lead terminals 2 are moved diagonally at an appropriate angle so that the tips of the corresponding external lead terminals 2 are positioned on line 7.

That is, when mounting this semiconductor case body l on the printed wiring board 4, the component mounting bats 3 should be oriented in parallel to each other in the same direction as shown in the figure, corresponding to the orientation of the external lead terminals 2. good.

As a result, all the component mounting pads 3 are oriented parallel to the pattern wiring direction 5 of the printed wiring board 4'', and the component mounting pads 3 are aligned parallel to the pattern wiring direction 5. It will stop happening.

In the illustrated example, the entire external lead terminal 2 is provided diagonally with respect to the side of the semiconductor case body 1, but the attachment part of the external lead terminal 2 to the semiconductor case body 1 is the same as in the conventional case. Similarly, the terminal may be made perpendicular to the side of the semiconductor case 1, and only the direction of the terminal end portion actually placed on the component mounting bat 3 may be changed.

[Effects of the Invention] As explained above, the present invention makes it possible to form contact points with the printed wiring board of the external lead terminals led out from the four sides of the sealed container of the semiconductor case body for surface mounting in the same direction on all four sides. By leading out and providing it, the direction of the component mounting bat can be aligned in parallel, which eliminates the component mounting bat from interfering with the pattern wiring, and greatly increases the pattern wiring area. It has the effect of making you more able to do things.

As a result, the number of wires can be significantly reduced compared to the conventional method, and manufacturing costs can be significantly reduced.

Furthermore, since the increase in the number of calendars can be suppressed as a means of increasing the patterning rate, there is also an effect in that it becomes possible to significantly reduce the cost of printed circuit boards.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a state in which a surface mounting semiconductor case according to an embodiment of the present invention is mounted on a printed wiring board;
FIG. 2 is a perspective view of a conventional surface mounting semiconductor case mounted on a printed wiring board. l: Semiconductor case body 2.6.7: External lead terminal 3.8: Component mounting bat 4 Niblint wiring board 5: Pattern wiring direction 9: Pattern wiring area

Claims (1)

[Claims] A surface mount semiconductor case in which external lead terminals are led out from the four sides of a sealed container, characterized in that the contact points of all the external lead terminals with the substrate are led out in the same direction on all four sides.