JPH0334492A - Integrated circuit with metal board - Google Patents

Abstract

PURPOSE:To increase the degree of freedoms of development of an integrated circuit by removing a second circuit board mounted with an electronic component having nonvolatile rewritable storage content from a first circuit board, and rewriting data, altering control program by an external processor. CONSTITUTION:A hybrid integrated circuit 10 is formed of a pair of first and second circuit boards 16a, 16b isolated vertically, a side plate 18 for blocking a side face, and a frame 30 for integrally securing them. A logic circuit element is connected to the board 16a, and a power circuit element is connected to the board 16b. The board 16c is detachably mounted on the frame 20, and an IC chip which operates as a memory cell is mounted. The board 16c mounted with the cell is freely removed from the frame 20 to be mounted in a data rewriting unit, and easily rewritten without disassembling the circuit 10. In the stage of a development, control sequence of a CPU can be executed by using the circuit 10 itself based on the rewritten data.

Description

[Detailed description of the invention]

[Industrial Application Field] The present invention relates to an integrated circuit comprising a circuit board in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, and an electronic component mounted on the insulating layer. [Prior Art] Conventionally, conductive layers are pasted to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate, and then both conductive layers are bonded to each other through an insulating layer. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The integrated circuit manufacturing method disclosed in this prior art includes the steps of anodizing at least one main surface of an aluminum substrate to form a thin aluminum oxide layer on the substrate surface, and forming a resistor on the aluminum oxide thin layer. a step of forming a plurality of circuit elements by selectively depositing a substance and a good conductor material; a step of fixing a transistor bellet on a lead portion formed by selectively depositing a good conductor; The method is characterized by including a step of sealing at least all of the circuit elements with an insulating resin. In the integrated circuit formed in this manner, a conductive layer having a desired shape is formed on a metal substrate via an insulating layer, and at least one memory element as an electronic component is disposed on the insulating layer. It is non-removably attached as a bare chip. [Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when an integrated circuit with such a metal substrate is actually used in a vehicle, various tests are conducted during the development stage, and as necessary, the data stored in the memory element may be rewritten or controlled. This will require changes to the program. However, as mentioned above, this memory element is directly attached to the circuit as a bare chip,
- Once installed, it is impossible to remove it, making it difficult to rewrite data, change control programs, monitor memory contents, etc., and it has been pointed out that the degree of freedom in development is greatly restricted. ing. This invention was made in view of the above-mentioned problems, and the purpose of this invention is to enable operations such as rewriting data, changing control programs, and monitoring stored contents externally during the development stage of integrated circuits. An object of the present invention is to provide an integrated circuit having a metal substrate that can increase the degree of freedom in development.

[Means to solve the problem]

In order to solve the above-mentioned problems and achieve the objects, an integrated circuit having a metal substrate according to the present invention includes: a first circuit board in which a conductive layer having a desired shape is formed on the metal substrate via an insulating layer; an electronic component mounted on the insulating layer; a second circuit board provided separately from the first circuit board; and a second circuit board removably attached to the first circuit board; connecting means for electrically connecting the second circuit board with the second circuit board attached to the second circuit board;
The device is mounted on a circuit board, and is characterized by having a circuit element having non-volatile memory contents that can be rewritten from the outside. Further, the integrated circuit having a metal substrate according to the present invention further includes a third circuit board separate from the first and second circuit boards, and the first circuit board has an input interface. The third circuit board is characterized in that each output interface is provided. [Operation 1] In an integrated circuit having a metal substrate configured as described above, electronic components having rewritable memory contents in a non-volatile manner are attached to the second circuit board, so data cannot be rewritten during the development stage. For work such as changing the control program, the second circuit board to which this electronic component is attached is removed from the first circuit board, and an external processing device rewrites the data for this electronic component and changes the control program. These tasks can be done externally and independently. In this way, the degree of freedom in the development of integrated circuits is increased. [Example] Hereinafter, with reference to FIGS. 1 to 10 of the accompanying drawings, an example of an integrated circuit having a metal substrate according to the present invention is applied to a case-shaped hybrid integrated circuit. Explain in detail. FIG. 1 shows a hybrid integrated circuit 10 of this embodiment. This hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component, and specifically, for example, is configured as a hybrid integrated circuit that independently functions as an engine control unit. ing. As shown in the figure, this hybrid integrated circuit 10 is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end (rear end). There is. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14. Here, as shown in FIGS. 2 to 3B, the hybrid integrated circuit 10 includes a pair of first and second circuit boards 16a and 16b vertically spaced apart, and a first and second circuit board. 1
6a and 16b at a predetermined interval and a side plate 18 for closing the side surfaces, and these first and second circuit boards 16a. 16b and a frame 20 that integrally fixes the side plate 18. Specifically, the first and second circuit boards 16a. Circuit elements such as an IC chip, a resistor, and a capacitor, which function as a CPU necessary to perform the function of an engine control unit, are attached to the 16b. Specifically, a so-called logic circuit element is connected to the first circuit board 16a located above, and a second circuit board 16a located below is connected to the first circuit board 16a located above.
A so-called power circuit element is connected to the circuit board 16b. Further, as will be described in detail later, a third circuit board 16c is removably attached to the frame 20, and an IC chip that functions as a memory element is attached to the third circuit board 16c. It is being In addition, the above-mentioned IC chip, in this one embodiment,
As will be described later, it is set to be directly mounted (fixed) on the insulating layer 22b as a bare chip. Here, the first and second circuit boards 16a. 16b is one common substrate 22 as shown in FIG. 4A.
It is set to be formed by dividing into two pieces. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a made of a conductive material such as aluminum, an insulating layer 22b adhered to the front surface of the substrate body 22a, and On this insulating layer 22b, a conductive layer 22c is formed in a predetermined circuit pattern and defines a circuit network, and a circuit element 22d is fixed and electrically connected on this conductive layer 22c. As shown in FIG. 4A, this common substrate 22 has an opening 22e formed in the center thereof in advance and extending vertically. Here, the circuit networks in the left and right portions are connected to each other via a flexible substrate 22f provided across the opening 22e. Note that the end close to the flexible substrate 22f is connected to a position that is a predetermined distance further inward than the corresponding edge of the opening 22e. That is, within a predetermined distance range of V, protrusions 16at and 16b+ are defined at the other ends of the circuit boards 16a and 16b, respectively. By cutting out both upper and lower edges (areas indicated by symbols X and Y) of the opening 22e, the above-mentioned pair of circuit boards 16a and 16b are connected to each other via the flexible board 22f. is set to form. Note that both circuit boards 16a and 16 on the common board 22
A plurality of connection terminals 22g, 22g, and
22h are formed in a horizontal line along the edge. Furthermore, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected. On the other hand, the upper surfaces of the parts corresponding to the inner ends of both circuit boards 16a and 16b, that is, the protrusions 16a+ and t defining the other end of the case, in a state where they are vertically spaced apart and facing each other.
A plurality of connection terminals 22 are provided on the mutually opposing inner surfaces of 6b+.
i and 22j are formed in a horizontal row along the edge. These connection terminals 22i and 22j correspond to the connection bins 16d formed on the upper and lower edges of the third circuit board 16c, respectively, when the third circuit board 16c is attached to the integrated circuit 10. The settings are such that the connection is made with the Further, as shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape on the upper surface with the minus side open, and this open side is set to become one end of the case. Corresponding circuit boards 16a are provided on the inner edges of both upper and lower end surfaces of the side plate 18. Step portion 18a for receiving three edges of 16b. 18b are formed respectively. The intermediate portion defining the other end of this side plate 18 is exactly the first and second circuit boards 16a. 16b is set to extend along a boundary line that defines each of the protrusions 16a+ and 16b+. In other words, the portion defining the other end of the side plate 18 is attached so as to be offset inward by a predetermined distance from the other end edge of each of the first and second circuit boards 16a, 16b. Here, each circuit board 16a, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A. By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers. On the other hand, as shown in FIG. 2, the above-described frame body 20 is made of synthetic resin as an insulating member, and is configured to sandwich and surround the side surface closed by the side plate 18 from above and below. That is, this frame 20 has side plates 18
and the main body 20a facing the main body 20a, and a predetermined distance from both upper and lower ends of the main body 20a (specifically, a distance sufficient to sandwich the three open edges of the upper and lower circuit boards 16a and 16b, respectively). Flange portions 20b, 2 extending inward
It is integrally formed with 0c. And this frame 2
An opening 20d is formed over substantially the entire surface of the side surface of the intermediate portion that defines the other end of the case. Further, as shown in FIG. 3B, this frame body 20 includes a side plate 1
The upper and lower first and second circuit boards 16a are fitted into the upper and lower step portions 18a and 18b of No.8, respectively. By sandwiching 16b from above and below, the case is integrally formed. In addition, as shown in the figure, the first and second circuit boards 16a,
A flexible substrate 22f that connects the circuit elements 22d of the side plate 16b to each other is set to be located directly inward from the other end portion of the side plate 18. Since the frame body 20 is formed in this way, the side plate 1
8, the first and second substrate circuits 16a,
16b will be maintained in an assembled state while being separated vertically by a predetermined distance. That is, in this embodiment, the hybrid integrated circuit 10 is
It is formed in a case shape, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, the first and second circuit boards 16a, 16
This results in a reduction in size and weight compared to the case where the device b is housed in a separately prepared case. Next, the case-shaped hybrid integrated circuit 1 configured in this way will be explained.
The configuration of a connecting device for connecting the control unit 0 to a controlled portion of a vehicle will be explained with reference to FIGS. 5 to 8. This connecting device includes a male connector 12 that is attached in a so-called fleshed state to an opening at one end of a case-shaped hybrid integrated circuit 10, and a female connector 14 that is detachably connected to the male connector 12. It consists of As shown in FIG. 5, this male connector 12 includes a connector housing 28 formed of a box-shaped housing with both front and rear surfaces penetrated and open, and an upper connecting pin 24a arranged in a horizontal line. Upper connecting bin support 3 installed in the installed state
0a and a lower connecting bin support 30b to which the lower connecting bins 24b are attached in a horizontally aligned manner, making up a so-called three-piece structure. Here, the upper connecting bottle support 30a and the lower connecting bottle support 30b are vertically symmetrical with a sloped central portion in the vertical direction, and the upper connecting bottle support 30a is
It is integrally formed in an abbreviated shape from an upright piece 30a1 and a protruding piece 30a2 that projects outward from the lower end of this upright piece 30a1. On the other hand, the lower connecting bin support 30b is
An upright piece 30bl and this upright piece 30b in a substantially inverted shape,
It is integrally formed with a protruding piece 30 b z that protrudes outward from the upper end of the plate. The upper connecting bin 24a has a horizontal portion 24a1 that horizontally penetrates the protrusion piece 30ai and protrudes back and forth, and a vertical portion that rises vertically from the inner end of the horizontal portion 24a along the inner surface of the upright piece 30a. part 24a2 and this vertical part 24
It is integrally formed with a bent part 24a bent inward from the upper end of a2. This bent portion 24a3 corresponds to the connection terminal 2 formed on the above-mentioned upper first circuit board 16a.
2g by soldering. Further, a portion of the horizontal portion 24a1 that projects outward is defined as a connecting portion that is inserted and connected to the female connector 14. The lower connecting bin 24b also includes a horizontal portion 24b1 that horizontally penetrates the protruding piece 30b and protrudes forward and backward, and a vertical portion extending vertically from the inner end of the horizontal portion 24b along the inner surface of the upright piece 30b. Falling vertical portion 24b2 and this vertical portion 24b
It is integrally formed with a bent portion 24b bent inward from the lower end of 2. This bent portion 24b3 corresponds to the connection terminal 22 formed on the lower second circuit board 16b mentioned above.
It is defined as a connection part that is connected to h by soldering. Further, the horizontal portion 24b that protrudes outward is defined as a connecting portion that is inserted and connected to the female connector 14. The connecting bin supports 30a and 30b are set to a size that allows them to be fitted into an opening at one end of the case-like hybrid integrated circuit 10 while being joined vertically to each other. In other words, both the upright pieces 30a+
, 30bt is set to exactly define the inner periphery of the opening at one end of the hybrid integrated circuit 10. Here, as shown in FIG. 6, a recess 32a, a recess 32a, a
32b is formed. These recesses 32a, 32b are defined as injection holes for epoxy resin to be injected, as will be described later, when the male connector 12 is integrated into the hybrid integrated circuit 10. Further, the above-mentioned upper and lower connecting bins 24a and 24b are formed in a vertically symmetrical shape, that is, the same shape, and the upper and lower connecting bin supports 30a and 30b are also formed in a vertically symmetrical and identical shape. In this way, the connecting bins 24a,
Connecting bin supports 30a, 30b with attached 24b
Since they have the same shape, parts can be shared and costs can be reduced. On the other hand, the connector housing 28 described above has a fitting hole 34 formed therein so as to extend through the connector housing 28 in the front-rear direction. As shown in FIG. 7, this fitting hole 34 is formed by two protruding pieces 30 am that are overlapped with each other in a state in which both the upper and lower connecting bottle supports 30 a and 30 b are joined.
, 30 bi is set to a size large enough to fit it. Furthermore, mounting flanges 40a and 40b are integrally formed on both sides of the connector housing 28. These flange portions 40a. 40b is provided for fixing the male connector 12 to the body of a vehicle (not shown) in a state where it is attached and fixed to the hybrid integrated circuit 10. In this way, it is not necessary to provide the hybrid integrated circuit 10 itself with a flange portion for attaching the hybrid integrated circuit IO, so that the configuration of the hybrid integrated circuit 10 can be simplified. In this embodiment, these connection bins 24a,
The vertical separation distance β and the left and right arrangement pitches of the bins 24b are defined based on the specifications of the conventionally used bin arrangement. As a result, the female connector 14 connected to the male connector 12 can be of a conventionally used type, improving economical efficiency. In addition, since conventionally used male connectors are heavy and large, this compact and lightweight case-shaped hybrid integrated circuit 10
A dedicated male connector 12 is formed correspondingly. Therefore, according to this embodiment, it is possible to reliably prevent the reduction in size and weight of the hybrid integrated circuit 10 described above from being impaired. Next, referring to FIG. 8, the assembly operation of the hybrid integrated circuit 10 will be explained together with the assembly operation of the male connector 12, which is shown in FIG. 5 after the assembly is completed. First, as described above with reference to FIGS. 4A and 4B, the first and second The circuit boards 16a and 16b are formed on the same plane in an open state. As shown in FIG. 5, the corresponding connection bin supports 30a, 3 are attached to the first and second circuit boards 16a, 16b in the open state.
0b are fixed to each other via an adhesive. Here, as described above, these connecting bin supports 30a
, 30b are already fitted with corresponding connection bins 24a, 24b. In this way, these connection bins 24a, 24b connect the first and second circuit boards 16a, 1
6b is open, the corresponding connection terminal 22g
. 22h respectively. In particular, this soldering process requires a 22g connection terminal. Since the number of circuit boards 22h is large, detailed work is required, but in this embodiment, the first and second circuit boards 16a and 16b are opened on the same plane. Therefore, the work can be carried out reliably, the workability is improved, and the assemblability is maintained well. After that, while holding the first circuit board 16a in the same position, lift the first circuit board 16a so that it is above and parallel to the first circuit board 16a located below. Moving. Then, as shown in Figure 8,
Both connecting bin supports 30a, 30b are joined one above the other. Here, in this way both connecting bin supports 30a. When the upper and lower circuit boards 30b are joined, the first and second circuit boards lea and 16b are set parallel to each other. On the other hand, prior to such a joining operation, the first and second circuit boards 16a, 1 are placed on the front and rear parts of the first circuit board 16b located below, as shown in FIG.
Frame members 36a and 36b are installed in an upright state for shielding the internal space from the outside while keeping the interval between 6b constant at a predetermined value and ensuring the strength of the hybrid integrated circuit 10. Here, one frame member 36a is located slightly inward from the flexible substrate 22f, and the other frame member 36b is located slightly inward from the connection terminals 22g and 22h. The respective installation positions are set. Then, while maintaining this joined state, they are fitted into the fitting hole 34 of the connector housing 28, and in this fitted state, the male connector 12 is integrally attached to the hybrid integrated circuit 10. . After this,
As described above, the side plate 18 is attached to the hybrid integrated circuit lO, and the frame 2° is fitted.In this way, the hybrid integrated circuit 10 as shown in FIG. 1 is integrally equipped with the male connector 12. It will be formed by. After such an assembly operation is completed, the assembled male connector 12 is reliably bonded to the hybrid integrated circuit 10, and the inside of the hybrid integrated circuit 10 is completely shielded while each connection bin 24a, 24b is attached. and the corresponding connection terminal 22g. 22h, in order to securely fix the parts, epoxy resin 38 is injected between the male connector 12 and the frame member 36b through the recesses 32a and 32b, respectively, so that both are 0. The epoxy resin 38 fills the space between the two. Further, in order to protect the flexible substrate 22f and to shield the inside of the hybrid integrated circuit IO, the frame member 3
The area in front of 6a is set to be completely filled with a similar epoxy resin 38 before the frame body 20 is attached. On the other hand, the above-mentioned first circuit board 1 located above
The mounting states of various electronic components in 6a are set as shown in FIG. Specifically, as shown in FIG. 9, first, a predetermined pattern is formed on the insulating layer 22b of the first circuit board 16a to form a circuit network, in other words, a plurality of paths defined from the conductive layer 22c. A line is formed. Then, on the insulating layer 22b of the first circuit board 16a, an IC package (for example, a Motorola MC
An IC chip 22dt having the same function as 6801) is mounted as a bare chip and connected to the above-mentioned predetermined group of pass lines via bonding wires. Although not shown in this IC chip 22dI,
A ROM containing a predetermined control program is connected. On the other hand, the third circuit board 16c described above basically has the following features:
Like the first and second circuit boards 16a and 16b, the third circuit board 16c is composed of a board body 22a, an insulating layer 22b, and a conductive layer 22c.
Specifically, on the inner surface of the third circuit board 16c, a memory element 22d, which is a circuit element having a non-volatile memory content that can be rewritten from the outside, is directly mounted as a bare chip on the insulating layer 22b of the third circuit board 16c. There is. Further, as described above, a plurality of connection bins 16d are arranged in a row on both upper and lower edges of the third circuit board 16c, and these connection bins 16d and memory elements 22d2 are arranged in a row as shown in FIG. As is clear from the above, the conductive layer 22c is formed on the insulating layer 22b.
are connected to each other by a bus line formed by the two. Here, these connection pins 16d have outward springiness. As a result, with this third circuit board 16c mounted so as to close the above-mentioned opening 20d, these connection bins 16d enter into the integrated circuit IO and connect to the corresponding connection terminals 22t and 22j, respectively. It will be connected. Further, in a state where the connection pin 16d and the connection terminals 22i, 22j are connected to each other in this way, the third circuit board 16c is prevented from easily falling off from the integrated circuit 10 due to the springiness of the connection pin 16d described above. The installation will remain in good condition. The memory element 22d2 also includes the CPU 22 described above.
d is an IC package (for example, NEC's μ
It is composed of an IC chip that has the same functions as the PD2764). Note that a predetermined map, default values, constants defining threshold values, etc. are set and stored in the memory element 22d2. Moreover, various other circuit elements such as a power transistor, a gate circuit element, a voltage regulator, a capacitor, a resistor, and a diode are mounted on the second circuit board 16b. Although not shown, an input interface is connected to the first circuit board 16a located above to which so-called logic circuit elements are connected, and a second circuit board 16a located below to which so-called power circuit elements are connected. Each of the circuit boards 16b is provided with an output interface. In this embodiment, by attaching the third circuit board 16c to the frame 20 with the memory element 22d2 mounted on the third circuit board 16c, the memory element 22d2 is substantially mounted on the third circuit board 16c. It will be connected to the hybrid integrated circuit 10. As a result, as a result of testing the hybrid integrated circuit 10 configured in this way during the development stage, if it becomes necessary to change the data, the third circuit board 16c is removed from the frame 20 and the data (not shown) is changed. It is attached to a rewriting device, and predetermined data is rewritten here. Then, the third circuit board 1 is mounted with the memory element 22d whose data has been rewritten in this way.
6c is again attached to the frame 20, and the hybrid integrated circuit 10 is thus ready for its function. In this way, in this embodiment, the setting of data to be stored in the memory element 22d2 at the product stage, which is the most problematic at the development stage, is performed on the third circuit board on which this memory element 22d2 is mounted. Since 16c is made removable from the frame 20, work at the function evaluation stage can be carried out easily and with a large degree of freedom. On the other hand, after this development stage is completed, the memory element 22d
If the data to be stored in 3 is confirmed, the 3rd
The circuit board 16c is fixed to the frame 20 by, for example, an adhesive, so that the mounted state is fixed. Since the integrated circuit 10 of this embodiment is configured as described above, at the development stage, the third circuit board 16c on which the memory element 22d3 is mounted can be freely used as the integrated circuit lO.
This allows the third circuit board 16c to be removed from the frame 20 constituting the frame 20, and when rewriting the data stored in the memory element 22d8, the third circuit board 16c can be removed from the frame 20.
By removing it from 0 and attaching it to a data rewriting device, it is possible to easily rewrite the integrated circuit 10 without disassembling it. In this way, according to the embodiment, rewriting the data stored in the memory element 22d2 at the development stage does not affect the memory contents of other circuit elements in any way.
This is easy to do, and the control procedure for operating the CPU 22d1 based on the rewritten data can be actually executed using the integrated circuit 10 itself, so the degree of freedom in the development stage is greatly improved. becomes. Furthermore, in the embodiment described above, it has been explained that rewriting data is effective in developing the hybrid integrated circuit 10. However, the present invention is not only effective at such a development stage, but also, for example, If the control content is updated and changed when the product is distributed on the market, the user can take the hybrid integrated circuit 10 to a repair shop equipped with a data rewriting device to have the hybrid integrated circuit 10 replaced. The control contents can be easily and inexpensively rewritten with upgraded control contents without replacing the entire circuit 10, which is very convenient for the user. Furthermore, in the above-mentioned embodiment, the integrated circuit 10 as a product is configured to be completed by adopting the same shape as the circuit pattern such as the pass line used in the development stage. The cost of etching the circuit pattern is significantly reduced, and since the circuit pattern that actually worked during the development stage is applied to the product as is, the product will operate without error in the same way as during the development stage. This ensures stable operation of the product, or in other words, guarantees reliability. It goes without saying that this invention is not limited to the configuration of the one embodiment described above, and can be modified in various ways without departing from the gist of the invention. For example, in one embodiment described above, the hybrid integrated circuit 1
0, it has been explained that it functions as an engine control unit, but it is not limited to this, and for example, it can operate as a functional component of a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, etc. It can be configured as follows. Furthermore, in the embodiment described above, the hybrid integrated circuit 10
has been described as having a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to this configuration, and may be configured to have three circuit boards arranged parallel to each other, for example. Needless to say, it's a good thing. Furthermore, in the embodiment described above, the third circuit board 1
As an IC chip mounted on the memory element 22d2
Although it has been described that the CPO 22dl is adopted, the present invention is not limited to this, and an IC chip corresponding to the CPO 22dl may be mounted. As a result, the present invention can be similarly applied to the case where the control program for the IC chip is processed from the outside. Furthermore, in the embodiment described above, the third circuit board 1
6c has been described as being detachably attached to the frame body 20, the present invention is not limited to such a configuration, and may be detachably attached to the first circuit board lea. Furthermore, in the above embodiment, the CPO 22dl and the memory element 22d as circuit elements were described as being mounted directly on the insulating layer 22b as bare chips.
The present invention is not limited to such a configuration, and the CPU 22d and the memory element 22d2 as circuit elements are
The present invention can be similarly applied to a case where the present invention is composed of a package type IC and is mounted in a non-removable manner by soldering to a predetermined pass line. [Effects of the Invention] As described in detail above, the integrated circuit having a metal substrate according to the present invention includes a first circuit board on which a conductive layer having a desired shape is formed on the metal substrate via an insulating layer; an electronic component mounted on an insulating layer; a second circuit board provided separately from the first circuit board; and a second circuit board removably attached to the first circuit board; a connecting means for electrically connecting the second circuit board with the second circuit board attached to the circuit board; and a circuit element that is mounted on the second circuit board and has non-volatile memory contents that can be rewritten from the outside. It is characterized by having the following. Further, the integrated circuit having a metal substrate according to the present invention further includes a third circuit board separate from the first and second circuit boards, and the first circuit board has an input interface. The third circuit board is characterized in that each output interface is provided. Therefore, according to the present invention, during the development stage of an integrated circuit, it is possible to perform tasks such as rewriting data, changing control programs, and monitoring memory contents externally, thereby increasing the degree of freedom in development. An integrated circuit having a metal substrate will be provided.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of an integrated circuit having a metal substrate according to the present invention; FIG. 2 is an exploded perspective view showing the structure of the integrated circuit shown in FIG. 1; FIG. 3B is a sectional view taken along line A-A; FIG. 3B is a sectional view taken along line B-B in FIG. 1; FIG. 4A is a plan view showing the structure of the common substrate; Figure 4B is a sectional view showing the configuration of the common board; Figure 5 is a sectional view showing the configuration of the integrated circuit to which the male connector is attached; Figure 6 is an exploded perspective view specifically showing the configuration of the male connector; FIG. 7 is a front view showing the male connector in the assembled state; FIG. 8 is a top view showing both connection bin supports fixed to the circuit board in the open state; FIG. 9 is a top view showing the male connector in the assembled state; A perspective view schematically showing the arrangement of circuit elements on the first circuit board;
FIG. 10 is a perspective view showing the mounting state of the memory element attached to the third circuit board with the third circuit board removed from the frame. In the figure, 10... hybrid integrated circuit, 12... male connector, 14... female connector, 14a; 14b...
Connection terminal, 16a...first circuit board, 16b...
second circuit board, 16a+; 16b+- protrusion;
16c...Third circuit board, 16d...Connection bin,
18...Side plate, 18a; 18b--Stepped portion, 18c
=-Through hole, 20...Frame body, 20a...Body, 20
b; 20c...flange part, 20d...opening,
22... Common board, 22a... Board body, 22b.
... Insulating layer, 22c... Conductive layer, 22d... Circuit element, 22dl... CPU, 22d2... Memory element,
22e...opening, 22f...flexible board,
22g; 22h; 22i; 22j...
Connection terminal, 24a; 24b...-connection bin,
24a+; 24b+”'Horizontal part, 24ai;
24bz ・"Vertical part, 24as: 24bs"'
Bend part, 26... Seal rubber 28... Connector housing, 30a... Upper connection bin support, 30
a+... Standing piece, 30a... Protruding piece, 30b...
・Lower connecting bottle support, 30bl... Standing piece, 30
b, . . . protruding piece, 32 a; 32 b-recess, 3
4... Fitting hole, 36a; 36b... Frame member, 38... Epoxy resin, 40a; 40b... Flange portion. Figure 2 Figure 3A Figure 40 / Figure 3B

Claims (2)

[Claims] (1) A first circuit board in which a conductive layer of a desired shape is formed on a metal substrate via an insulating layer, an electronic component mounted on the insulating layer, and a separate body from the first circuit board. a second circuit board provided in the first circuit board and removably attached to the first circuit board; and a second circuit board attached to the first circuit board, electrically connecting the two. and a circuit element mounted on the second circuit board and having non-volatile storage contents that can be rewritten from the outside. (2) A third circuit board is further provided separately from the first and second circuit boards, and the first circuit board is provided with an input interface, and the third circuit board is provided with an output interface. 2. An integrated circuit having a metal substrate according to claim 1.