JPH02226675A - Fixing construction for hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To simplify and ensure the fixture of an IC circuit and other materials by providing a projection part integral with at least one of circuit boards determining the external surface of ICs in such a way as to be freely taken out from a case, and fixing the projection to the other materials with a fixing means. CONSTITUTION:A hybrid integration circuit 10 is constituted with a control unit as an independent automotive functional part and the function thereof is made independent, for example, as an engine control unit. The circuit 10 is formed with an internally closed box type case and the rear end of the case is so made as to allow the connection of a male connector 14 as a connection instrument. In this case, the circuit 10 is provided with a pair of circuit boards 16a and 16b vertically separated and a side plate 18 for closing the side thereof. The aforesaid circuit boards 16a and 16b and the side plate 18 are integrally fixed to a frame body 20. According to the aforesaid construction, a logic circuit element is connected to the lower circuit board 16a, while a power circuit element is connected to the upper circuit board 16b. Also, the forward end of the circuit board 16a is integrally provided with a projection 16c for connecting the circuit 10 to a car body not shown herein.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a hybrid integrated circuit having an integrated circuit board on which a conductive layer having a desired shape is formed and a plurality of circuit elements attached on the conductive layer. Regarding fixed structures.

[Prior Art] Conventionally, conductive layers are pasted to each other through an insulating layer, a circuit element is fixed to each conductive layer, and both conductive layers are connected to each other via a connecting substrate, and then both conductive layers are bonded to each other through an insulating layer. As an integrated circuit having a pair of metal substrates facing each other,
A technique disclosed in Japanese Patent Publication No. 46-13234 is known. The integrated circuit manufacturing method disclosed in this prior art includes the steps of anodizing at least one surface of an aluminum substrate to form a thin aluminum oxide layer on the substrate surface, and forming a resistor material on the aluminum oxide thin layer. a step of forming a plurality of circuit elements by selectively depositing a good conductor material; and a step of fixing a transistor pellet on the lead portion formed by selectively depositing a good conductor material; The method is characterized by including a step of sealing all of the circuit elements with an insulating resin.

In the integrated circuit formed in this way, heat generated from resistors, transistors, etc. during operation can be dissipated quickly and effectively, making it possible to integrate output circuits, etc. .

[Problems to be Solved by the Invention] The integrated circuit formed as described above may be adopted for use in vehicles from the viewpoint of its small size and low cost. However, when an integrated circuit having such a metal substrate is actually used in a vehicle, it is required that the integrated circuit be reliably and easily attached to the vehicle body. However, in conventional integrated circuits having metal substrates, the parts are only integrally attached to the frame that defines the outer frame of the integrated circuit, and the state of fixation to the vehicle body is not fixed. In addition to being stable,
It has been pointed out that the fixing work cannot be done easily.

This invention was made in view of the above-mentioned problems, and the purpose of this invention is to reduce the size and cost of integrated circuits, and to easily and reliably fix integrated circuits to other members. The object of the present invention is to provide a fixed structure of a hybrid integrated circuit that can be used.

[Means for Solving the Problems] In order to solve the above-mentioned problems and achieve the objects, a first aspect of the present invention provides a fixing structure for a hybrid integrated circuit, in which a conductive layer having a desired shape is formed, and a conductive layer is formed on the conductive layer. In a hybrid integrated circuit comprising an integrated circuit board having a plurality of circuit elements attached thereto, and a case material fixed to the integrated circuit board to seal the plurality of circuit elements, at least One side is provided with a protrusion extending from the substrate from the terminal edge of the case material, and the hybrid integrated circuit is fixed to another member by a predetermined fixing means using the protrusion. It is said that

Further, a fixing structure for a hybrid integrated circuit according to a second aspect of the present invention includes two integrated circuit boards on which a conductive layer having a desired shape is formed and a plurality of circuit elements are attached on the conductive layer, and In a hybrid integrated circuit in which two integrated circuit boards are separated by a predetermined gap by a spacing member, at least one side end of one of the integrated circuit boards is a protrusion that projects more than the end of the other integrated circuit board. The hybrid integrated circuit is fixed to another member by a predetermined fixing means using the protrusion.

[Operation] In the hybrid integrated circuit fixing structure configured as described above, at least one circuit board that defines the outer surface of the integrated circuit is integrally formed with a protrusion that extends so as to be taken out of the case. However, this protrusion is provided with a fixing means for fixing it to another member. As a result, the integrated circuit can be securely and easily fixed to other members.

[Example] Hereinafter, an example of the fixing structure of a hybrid integrated circuit related to this generation will be described with reference to FIGS. 1 to 8 of the attached drawings, regarding the case where it is applied to a case-shaped hybrid integrated circuit. , will be explained in detail.

FIG. 1 shows a hybrid integrated circuit 1° of this embodiment. This hybrid integrated circuit 10 is configured as a control unit as an independent in-vehicle functional component, and specifically, for example, is configured as an integrated circuit that independently functions as an engine control unit. There is.

As shown in the figure, this hybrid integrated circuit 10 is formed as a box-shaped case with a closed interior, and a male connector 12 as a connecting device is integrally attached to one end (rear end). There is. The male connector 12 will be described in detail later, but is configured to be connected to a commonly used female connector 14.

Here, as shown in FIGS. 2 to 3B, this hybrid integrated circuit IO includes a pair of first and second circuit boards 16a and 16b that are vertically spaced apart, and a first and second circuit board. 1
6a and 16b at a predetermined interval and a side plate 18 for closing the side surfaces, and these first and second circuit boards 16a.

16b and a frame 2° that integrally fixes the side plate 18.

Specifically, the first and second circuit boards 16a.

16b is attached with circuit elements such as an IC chip, a resistor, and a capacitor necessary to function as an engine control unit. Specifically, a so-called logic circuit element is connected to the first circuit board 16a located below, and a so-called power circuit element is connected to the second circuit board 16b located above. It is set like this.

As is clear from FIGS. 1 and 2, the other end (tip) of the lower first circuit board 16a is connected to the hybrid integrated circuit 1.
A protruding portion 16c that protrudes forward through the case and constitutes a fixing structure for fixing 0 to a vehicle body (not shown).
are integrally formed.

Here, the first and second circuit boards 16a.

16b is one common substrate 22 as shown in FIG. 4A.
It is set to be formed by dividing into two pieces. That is, as shown in FIG. 4B, the common substrate 22 includes a substrate body 22a made of a conductive material such as aluminum, an insulating layer 22b adhered to the front surface of the substrate body 22a, and A conductive layer 22c is formed on the insulating layer 22b in a predetermined circuit pattern to define a circuit network, and a circuit element 22d is fixed and electrically connected to the conductive layer 22c.

As shown in FIG. 4A, this common board 22 has an opening 22e extending in the vertical direction from the center to the left in the figure (close to the part defined as the upper circuit board 16b). It is formed. Here, the circuit networks in the left and right portions are connected to each other via a flexible substrate 22f provided across the opening 22e. The right end of the flexible substrate 22f in the figure is connected to a position a predetermined distance further to the right than the right edge of the opening 22e. That is, the above-mentioned protrusion 16c is defined at this predetermined distance. Then, by cutting out both upper and lower edges (areas indicated by symbols X and Y) including the upper and lower ends of this opening 22e, the pair of circuit boards 16a and 16b described above are cut out.
are connected to each other via the flexible substrate 22f.

In addition, in the common board 22, both circuit boards 1.6a, 1
A plurality of connection terminals 22g are provided on the upper surfaces of portions corresponding to the outer ends of the casings 6b, that is, on the inner surfaces facing each other at the end portions that define one end of the case, while being vertically spaced apart and facing each other.
, 22h are formed in rows along the edge.

Furthermore, connection pins 24a and 24b of the male connector 12, which will be described later, are fixed to these connection terminals 22g and 22h, respectively, so as to protrude outward, and are electrically connected.

Further, as shown in FIG. 2, the above-mentioned side plate 18 is formed in a U-shape on the upper surface with the minus side open, and this open side is set to become one end of the case.

Corresponding circuit boards 16a are provided on the inner edges of both upper and lower end surfaces of the side plate 18.

Stepped portions 18a for receiving three edges of 16b.

18b are formed respectively.

Here, each circuit board lea, 16b is fitted into a corresponding step portion 18a, 18b via a seal rubber 26, as shown in FIG. 3A.

By interposing this seal rubber 26, dust is prevented from entering the case from between these rubbers.

On the other hand, as shown in FIG. 2, the frame 2o described above is made of synthetic resin as an insulating member and is configured to sandwich and surround the side surface closed by the side plate 18 from above and below. That is, this frame 20 has side plates 18
and a predetermined distance from both upper and lower ends of the main body 20a (specifically, the upper and lower circuit boards 16a).

The flange portions 20b, 2 extend inward by a distance sufficient to sandwich the three unopened edges of the flange portion 16b, respectively.
It is integrally formed with 0c.

Note that an insertion hole 20d into which the above-mentioned protrusion 16c is inserted is formed at the lower edge of the portion of the main body 20a corresponding to the other end of the case.

As shown in FIG. 3B, this frame body 20 is constructed by sandwiching the upper and lower first and second circuit boards 16a and 16b, which are respectively fitted into the upper and lower step portions 18a and 18b of the side plate 18, from above and below. The case is formed integrally. In addition, as shown in the figure, upper and lower first and second circuit boards 16a.

The flexible substrate 22f that connects the circuit elements 22d of the side plate 16b to each other is set to be located inward from the other end portion of the side plate 18.

As is clear from FIG. 3B, the lower surface of the protrusion 16c has a gap between it and the surface of another member to which it is attached, such as a vehicle body (not shown) (in other words, the frame 2
Bushing 4 to fill the gap (corresponding to the plate thickness of 0)
2 is glued. This bushing 42 and the protrusion 16c
A mounting hole 44 is formed in which a bolt (not shown) for fixing this to the vehicle body is inserted. Here, the bush 42, the mounting hole 44, and the bolt constitute the fixing means in this embodiment.

Since the frame body 20 is formed in this way, the side plate 1
8, the first and second substrate circuits 16a,
16b will be maintained in an assembled state while being separated vertically by a predetermined distance.

That is, in this embodiment, the hybrid integrated circuit 10 is
It is formed in a case shape, and both upper and lower surfaces of the case are directly defined by the circuit boards 16a and 16b. As a result, the first and second circuit boards 16a, 16
This results in a reduction in size and weight compared to the case where the device b is housed in a separately prepared case. Also, frame body 2
A protrusion 16c is integrally formed on the lower circuit board lea in a state of protruding forward from the protrusion 1.
A mounting hole 44 is formed in 6C, to which a bush 42 is adhered and into which a bolt for fixing to the vehicle body is inserted. In this way, this hybrid integrated circuit 10 is reliably fixed to the vehicle body via this bolt.

Next, the case-shaped hybrid integrated circuit 1 configured in this way will be explained.
The configuration of a connecting device for connecting the control unit 0 to a controlled portion of a vehicle will be explained with reference to FIGS. 5 to 8.

This connecting device includes a male connector 12 attached to one end opening of a case-shaped hybrid integrated circuit 10 with a so-called inner seal, and a female connector 14 detachably connected to the male connector 12. It consists of As shown in FIG. 5, this male connector 12 includes a connector housing 28 formed of a box-shaped housing with both front and rear surfaces penetrated and open, and an upper connecting pin 24a arranged in a horizontal line. Upper connecting bin support 3 installed in the installed state
0a and a lower connecting bin support 30b to which the lower connecting bins 24b are attached in a horizontally aligned manner, making up a so-called three-piece configuration.

Here, the upper connecting bottle support 30a and the lower connecting bottle support 30b are vertically symmetrical with a sloped central portion in the vertical direction, and the upper connecting bottle support 30a is
An upright piece 30a+, this upright piece 30a, in an abbreviated shape.
It is integrally formed with a protrusion piece 30a2 that protrudes outward from the lower end. On the other hand, the lower connecting bottle support 30b has an upright piece 30bl and an upright piece 30b in a substantially inverted shape.
It is integrally formed with a protruding piece 30b2 that protrudes outward from the upper end of the +.

The upper connecting bottle 24a has a horizontal portion 24a+ that horizontally penetrates the protruding piece 30a and protrudes back and forth, and a vertical portion 30a that rises vertically from the inner end of the horizontal portion 24a+ along the inner surface of the upright piece 30a. part 24a2 and this vertical part 2
It is integrally formed with a bent portion 24a3 that is bent inward from the upper end of 4a2. This bent portion 24a is defined as a connection portion that is connected by soldering to the connection terminal 22h formed on the above-mentioned upper second circuit board 16b. Further, a portion of the horizontal portion 24ai that protrudes outward is defined as a connecting portion that is inserted into and connected to the female connector 14.

Further, the lower connecting bin 24b stands vertically along the inner surface of a horizontal portion 24b that horizontally penetrates the protruding piece 30b2 and protrudes back and forth, and an upstanding piece 30b from the inner end of this horizontal portion 24b1. The vertical portion 24b2 that descends and the vertical portion 24b
, and a bent portion 24b bent inward from the lower end. This bent portion 24b3 corresponds to the connecting terminal 22 formed on the lower first circuit board 16a described above.
It is defined as a connection part that is connected to g by soldering. Further, a portion of the horizontal portion 24bl that protrudes outward is defined as a connecting portion that is inserted and connected to the female connector 14.

The connecting bin supports 30a and 30b are set to a size that allows them to be fitted into an opening at one end of the case-like hybrid integrated circuit 10 while being joined vertically to each other. In other words, both side vertical pieces 30a+ are connected vertically.
, 30bz (outer periphery) is set to exactly define the inner periphery of the opening at one end of the hybrid integrated circuit 10.

Here, as shown in FIG. 6, there are recesses 3ga,
32b is formed. These recesses 32a, 32b are defined as injection holes for epoxy resin to be injected, as will be described later, when the male connector 12 is integrated into the hybrid integrated circuit 10.

Further, the above-mentioned upper and lower connecting bins 24a and 24b are formed in a vertically symmetrical shape, that is, the same shape, and the upper and lower connecting bin supports 30a and 30b are also formed in a vertically symmetrical and identical shape. In this way, the connecting bins 24a,
Connecting bin supports 30a, 30b with attached 24b
Since they have the same shape, parts can be shared and costs can be reduced.

On the other hand, the connector housing 28 described above has a fitting hole 34 formed therein so as to extend through the connector housing 28 in the front-rear direction. As shown in FIG. 7, this fitting hole 34 includes side projecting pieces 30aa, which are overlapped with each other in a state where both the upper and lower connection bottle supports 30a, 30b are joined.
30b2 is set to be large enough to fit into the hole.

Furthermore, mounting flanges 40a and 40b are integrally formed on both sides of the connector housing 28. These flange portions 40a.

40b is provided for fixing the male connector 12 to the body of a vehicle (not shown) in a state where it is attached and fixed to the hybrid integrated circuit 10. In this way, it is not necessary to provide a flange portion on the hybrid integrated circuit 10 itself for attaching the hybrid integrated circuit 10, so that the configuration of the hybrid integrated circuit 10 can be simplified. Furthermore, the above-mentioned protruding portion 16c is fixed to the vehicle body via bolts, and these flange portions 40a.

Since the hybrid integrated circuit 10 is fixed to the vehicle body at the front and rear in conjunction with the fixing via the connector 40b, the fixed state is reliably set.

In this embodiment, these connection bins 24a,
The vertical separation β and the left and right casting pitch p of the bins 24b are defined based on the specifications of the conventionally used bin arrangement. As a result, the female connector 14 connected to the male connector 12 can be of a conventionally used type, improving economical efficiency.

In addition, since conventionally used male connectors are heavy and large, this compact and lightweight case-shaped hybrid integrated circuit 10
A dedicated male connector 12 is formed correspondingly.

Therefore, according to this embodiment, it is possible to reliably prevent the reduction in size and weight of the hybrid integrated circuit 10 described above from being impaired.

Next, referring to FIG. 8, the assembly operation of the hybrid integrated circuit 10 will be explained together with the assembly operation of the male connector 12, which is shown in FIG. 5 after the assembly is completed.

First, as described above with reference to FIGS. 4A and 4B, the first and second The circuit boards 16a and 16b are formed on the same plane in an open state. As shown in FIG. 5, the corresponding connection bin supports 30a, 3 are attached to the first and second circuit boards 16a, 16b in the open state.
0b are fixed to each other via an adhesive.

Here, as described above, these connecting bin supports 30a
, 30b are already fitted with corresponding connection bins 24a, 24b. In this way, these connection bins 24a, 24b connect the first and second circuit boards lea, 1
6b is open, the corresponding connection terminal 22g
.

22h respectively. In particular, this soldering work requires detailed work because there are many connection terminals 22g22h, but in this embodiment, the first and second circuit boards 1
Since 6a and 16b are opened on the same plane, the work can be carried out reliably, the workability is improved, and the ease of assembly is maintained well.

After this, while holding the first circuit board 16a in the same position, lift the second circuit board 1.6b,
It moves above and parallel to the first circuit board 16a located below. Then, as shown in FIG. 8, both connecting bottle supports 30a and 30b are joined vertically to each other.

Here, in this way both connecting bin supports 30a.

When the upper and lower circuit boards 30b are joined together, the first and second circuit boards 16a and 16b are set parallel to each other.

On the other hand, prior to such a joining operation, on the front and rear parts of the first circuit board 16a located below, as shown in FIG.
The frame members 36a and 36b are installed in an upright position to shield the internal space from the outside while keeping the interval between the 6b constant at a predetermined value and ensuring the strength of the hybrid integrated circuit 10. Here, one frame member 36a
is located slightly inwardly from the flexible board 22f and slightly outwardly from the third circuit board 16c, and the other frame member 36b is located at the connecting terminal 2.
2g and 22h, and slightly outward from the third circuit board 16c.

Then, while maintaining this joined state, they are fitted into the fitting hole 34 of the connector housing 28, and in this fitted state, the male connector 12 is integrally attached to the hybrid integrated circuit 10. . After this,
As described above, the side plate 18 is attached to the hybrid integrated circuit 10 and the frame 20 is fitted.In this way, the hybrid integrated circuit 10 as shown in FIG. will be formed.

After such an assembly operation is completed, the assembled male connector 12 is reliably bonded to the hybrid integrated circuit 10, and the inside of the hybrid integrated circuit 10 is completely shielded while each connection bin 24a, 24b is attached. and the corresponding connection terminal 22g.

22h, in order to securely fix the parts, epoxy resin 38 is injected between the male connector 12 and the frame member 36b through the above-mentioned recesses 32a and 32b, respectively. The epoxy resin 38 fills the space between the two.

Further, in order to protect the flexible substrate 22f and to shield the inside of the hybrid integrated circuit 10, the frame member 3
The area in front of 6a is set to be completely filled with a similar epoxy resin 38 before the frame body 20 is attached.

Then, as described above, the side plate 1 is attached, and then the frame body 2o is attached. When attaching this frame body 20, the protruding portion 16c is inserted through the insertion hole 42 to the front side. It is designed to stand out.

As described in detail above, in the fixing structure of the integrated circuit 10 of this embodiment, the protruding portion 16c is integrally formed on the lower circuit board 16a while protruding forward from the case-like hybrid integrated circuit 10. The protrusion 16c has a bushing 42 bonded to the lower surface of the protrusion 16c as a fixing means, and a mounting hole 44 that passes through the protrusion 16c and the bushing 42 in common. There is.

In this way, according to the fixing structure of this embodiment, the hybrid integrated circuit 10 can be reliably fixed to the vehicle body, and the fixing operation can be easily performed.

Furthermore, in the above-described embodiment, the protrusion 16c is
Since it is formed integrally with the lower first circuit board 16a, the surface area of the first circuit board 16a is substantially increased. As a result, this first circuit board 1
The heat radiation area from 6a increases, and the effect of increasing the heat radiation effect is also achieved.

Furthermore, in the embodiment described above, the male connector 12
is formed to consist of a connector housing 28 and connection bin supports 30a, 30b divided into upper and lower halves, and each connection bin support 30a, 30b is formed before configuring the hybrid integrated circuit 10. , corresponding circuit board 1
6a.

16b, respectively, and the connecting bins 24a.

24b to the corresponding connection terminals 22g and 22h, respectively. In this way, the assemblability of the hybrid integrated circuit 10 is maintained well.

Further, in the embodiment described above, the hybrid integrated circuit 10 to which the male connector 12 is fixed is configured such that its upper and lower surfaces are defined by a pair of circuit boards 16a and 16b. As a result, according to this embodiment, the number of parts of the hybrid integrated circuit 10 is reduced, and the hybrid integrated circuit 10 is made smaller and less expensive.

Further, in this embodiment, the circuit board 16a,
16b is a conductive aluminum substrate body 22a, an insulating layer 22b stuck on this substrate body 22a,
A conductive layer 22c is formed on the insulating layer 22b with a predetermined circuit pattern. As a result, the heat generated from the various circuit elements 22d is absorbed by using the board body 22a made of aluminum and ram as a heat sink.
Since heat can be radiated, there is no need to provide a separate heat radiating member, resulting in significant downsizing.

Furthermore, in this embodiment, as described above, since the upper and lower surfaces of the case are respectively constituted by a pair of circuit boards 16a and 16b having a board body 22a made of aluminum, these circuit boards 16a and 16b are It can be used as an electromagnetic shielding member. As a result, the internal space of the hybrid integrated circuit 10 on this case is substantially electromagnetically shielded, and the circuit element 22d is less susceptible to electromagnetic interference.

It goes without saying that this invention is not limited to the configurations of the above-described embodiments, and can be modified in various ways without departing from the gist of the invention.

For example, in one embodiment described above, the hybrid integrated circuit 1
0, it has been explained that it functions as an engine control unit, but it is not limited to this, and for example, it can operate as a functional component of a vehicle speed control device, a control device for four-wheel steering, an automatic transmission control device, etc. It can be configured as follows.

Furthermore, in the above-described embodiment, the hybrid integrated circuit lO
has been described as having a pair of upper and lower circuit boards 16a and 16b, but the present invention is not limited to this configuration, and may be configured to have three circuit boards arranged parallel to each other, for example. Needless to say, it's a good thing.

[Effects of the Invention] As detailed above, in the hybrid integrated circuit fixing structure according to the present invention, the hybrid integrated circuit fixing structure according to the first aspect of the present invention has a conductive layer of a desired shape formed, and A hybrid integrated circuit comprising an integrated circuit board on which a plurality of circuit elements are attached on a layer, and a case material is fixed on the integrated circuit board to seal the plurality of circuit elements,
At least one side of the integrated circuit board is provided with a protrusion extending from the board from a terminal side of the case material,
The hybrid integrated circuit is fixed to another member by a predetermined fixing means using the protrusion.

Further, a fixing structure for a hybrid integrated circuit according to a second aspect of the present invention includes two integrated circuit boards on which a conductive layer having a desired shape is formed and a plurality of circuit elements are attached on the conductive layer, and In a hybrid integrated circuit in which two integrated circuit boards are separated by a predetermined gap by a spacing member, at least one side end of one of the integrated circuit boards is a protrusion that projects more than the end of the other integrated circuit board. The hybrid integrated circuit is fixed to another member by a predetermined fixing means using the protrusion.

Therefore, according to the present invention, there is provided a fixing structure for a hybrid integrated circuit that can reduce the size and cost of the integrated circuit and also allows the integrated circuit to be easily and reliably fixed to other members. It's going to happen.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a fixing structure for a hybrid integrated circuit according to the present invention, together with an integrated circuit to which this is applied; FIG. 2 is an exploded perspective view showing the configuration of the integrated circuit shown in FIG. 1; Figure 3A is a cross-sectional view taken along the line A-A in Figure 1; Figure 3B is a cross-sectional view taken along the line B-B in Figure 1; Figure 4A is the common substrate. Figure 4B is a cross-sectional view showing the configuration of the common board; Figure 5 is a cross-sectional view showing the configuration of the male connector attached to the integrated circuit; Figure 6 is a detailed diagram showing the configuration of the male connector. FIG. 7 is a front view showing the male connector in the assembled state; and FIG. 8 is the state in which both connection bin supports are respectively fixed to the circuit board in the open state. FIG. In the figure, 10... Hybrid integrated circuit, 12... Male connector, 14... Female connector, 14a; 14b... Connection terminal, 16a... First circuit board, 16b... Second circuit board, 16c... protrusion, 18... side plate,
18'a; 18b...Step part, 20...Frame body, 20a
...Main body, 20b; 20c...Flange part, 2
0d...Insertion hole, 22...Common board, 22a...
Substrate body, 22b...insulating layer, 22c...conductive layer,
22d...Circuit element, 22e...Opening, 22f.
...Flexible board, 22g; 22h...Connection terminal, 22i; 22j...Outer flange portion, 24a;
24b...Connection bin, 24a+; 24bt
...Horizontal part, 24a2; 24 b*...Vertical part, 24 a3; 24 bs...Bending part, 26
... Seal rubber 28 ... Connector housing,
30a... Upper connection bin support, 30a. ...Upright piece, 30a2...Protruding piece, 30b...Lower connection bottle support, 30b1...Upright piece, 30b*
... Projection piece, 32a; 32b... Recess, 34.
... Fitting hole, 36a; 36b... Frame member,
38...Epoxy resin, 40a; 40b...
Flange portion, 42...button, 44...attachment hole.

Claims (2)

[Claims] (1) It has an integrated circuit board on which a conductive layer of a desired shape is formed and a plurality of circuit elements are attached on the conductive layer, and a case material is placed on the integrated circuit board to seal the plurality of circuit elements. is fixed to the hybrid integrated circuit, wherein at least one side of the integrated circuit board is provided with a protrusion extending from the substrate from a terminal side of the case material, and the hybrid integrated circuit is fixed using the protrusion. 1. A fixing structure for a hybrid integrated circuit, wherein the hybrid integrated circuit is fixed to another member by a predetermined fixing means. (2) It has two integrated circuit boards on which a conductive layer of a desired shape is formed and a plurality of circuit elements are attached on the conductive layer, and the two integrated circuit boards are separated into a predetermined shape by a spacing member. In the hybrid integrated circuit separated by a gap, at least one side end of one of the integrated circuit boards has a protrusion that protrudes from the end of the other integrated circuit board, and the protrusion is used to connect the A fixing structure for a hybrid integrated circuit, characterized in that the hybrid integrated circuit is fixed to another member by a predetermined fixing means.