JPH0334830B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a testing device for laser diodes and other semiconductor devices.

[Prior Art] In aging tests for semiconductor devices and other devices, a printed circuit board on which the devices under test are placed is placed in a constant temperature bath, temperature cycles are applied, and various characteristics of the device are measured.

For example, when the device under test is a laser diode or the like, it is necessary to provide a light receiving element that receives the output light in a thermostatic oven and measure the output light.

[Problems to be Solved by the Invention] However, if the light-receiving element and the device under test are subjected to temperature cycles in the same thermostatic chamber, highly accurate measurement is difficult due to temperature drift of the light-receiving element and other parts.

Additionally, in addition to the test chamber, a method can be considered to provide a measurement chamber at room temperature separately and install a light receiving element in this measurement chamber, but it is difficult to guide the output light of the laser diode to the light receiving element in the measurement chamber. Furthermore, it was difficult to insulate the test room and the measurement room.

In view of the above points, it is an object of the present invention to provide a test device which is designed to provide thermal insulation between a test chamber of a thermostatic chamber and a measurement chamber, and which enables measurement tests with higher accuracy.

[Means for Solving the Problems] The present invention provides a test board with a seal block provided between the device under test and the measurement section, and a test chamber side of the opening of the partition wall that partitions the test chamber of the thermostatic chamber and the measurement chamber. The test device is equipped with a sealing member provided around the test board, and the measuring section side of the test board is inserted into the measuring chamber side through the opening of the partition wall, and the sealing block is brought into pressure contact with the sealing member.

[Example] FIG. 1 is a cross-sectional explanatory view showing an example of the present invention, and FIG. 2 is a schematic perspective view.

In the figure, reference numeral 1 denotes a constant temperature chamber, a test chamber 2 and a measurement chamber 3 are partitioned by a partition wall 4, and a flexible sealing member 5 is provided around the opening 4a of the partition wall 4 on the test chamber 2 side.

Reference numeral 6 denotes a test board made of a printed circuit board, etc., on one side of which a plurality of devices under test 7 such as laser diodes are provided, and on the other side a measurement section including a light receiving element 8 such as a photodiode, etc.;
The output light from the device under test 7 is guided through the optical fiber 9 to the corresponding light receiving device 8 by the optical connector 9a. Seal blocks 10 are provided on the upper and lower sides of the test board 6 located between the device under test 7 and the light receiving device 8, and the optical fiber 9 is connected to a packing 11.
The seal block 10 is clamped by a screw 10a via the seal block 10. The width of the test board 6 on the side of the device under test 7 is wider than the width of the measurement section side including the light receiving element 8 with the seal block 10 as a boundary, so that it can be easily inserted into the opening 4a of the partition wall 4. ing. Further, a front plate 12 is provided on the end face of the test board 6 on the side of the device under test 7, and is fixed to the outer wall 1a of the thermostatic chamber 1 with screws 12a.

In other words, the measurement section side of the test board 6 on which the device under test 7 and the measurement device 8 are mounted, including the light receiving element 8, is inserted from the test chamber 2 side of the thermostatic chamber 1 into the measurement chamber 3 side through the opening 4a of the partition wall 4. , the seal block 10 of the test board 6 is brought into contact with the seal member 5 provided around the opening 4a, and the screw 12a of the front plate 12 is
By tightening, the seal block 10 is brought into pressure contact with the seal member 5 and sealed. Note that the test board 6 is supported by a suitable support frame (not shown). Further, the front plate 12 is not necessarily fixed to the outer wall 1a of the thermostatic chamber 2, but is fixed to an internal support frame (not shown).
A separate door may be provided in the thermostatic chamber 1 to improve airtightness.

In this state, a test signal is applied to the device under test 7 through the printed wiring of the test board 6, the temperature of the test chamber 2 is also changed, and the characteristics of the device under test 7 are tested.

In this way, the seal block 10 of the test board 6 is pressed against the seal member 5 of the partition wall 4, and the test chamber 2
Since the measurement chamber 3 and the test chamber 3 are completely shielded and insulated, the temperature of the measurement chamber 3 remains constant even if the temperature of the test chamber 2 changes, and there is no temperature drift in the light receiving element 8, optical connector 9a, etc. , enabling highly accurate measurements and tests. In addition, since the measurement section including the device under test 7 and the light receiving device 8 is provided on a single test board 6, it is easy to take it in and out of the thermostatic chamber 1 and replace parts, resulting in good operability. ,
It is highly efficient with little leakage of output light, and does not require optical axis alignment.

Note that the laser diode as the device under test 7 is modularized by integrally providing an optical fiber 9 and an optical connector 9a.

FIG. 3 shows another embodiment, in which the same reference numerals as in FIGS. 1 and 2 indicate the same components. In this example,
Since an ordinary semiconductor element is used as the element under test 7 instead of a laser diode, an optical fiber is not necessary, and a measuring section 8a is provided in place of the light receiving element 8. The seal block 10 does not sandwich the optical fiber, but is fixed to the test board 6 via an insulating sheet 13.

In this case, the sealing block 10 is again connected to the bulkhead 4.
The characteristics of the device under test 7 are measured through the printed wiring of the test board 6.

[Effects of the Invention] As described above, in this invention, the seal block of the test board is pressed into contact with the seal member around the opening of the partition wall to shield and insulate the test chamber and the measurement chamber. The temperature of the room is always constant,
Highly accurate measurement tests become possible. In addition, it is easy to put in and take out the test board, and it has excellent operability.

[Brief explanation of drawings]

FIG. 1, FIG. 2, and FIG. 3 are explanatory diagrams showing one embodiment of the present invention. 1... Constant temperature chamber, 2... Test room, 3... Measurement room,
4... Partition wall, 4a... Opening, 5... Seal member,
6... Test board, 7... Device under test, 8...
Light receiving element, 8a... Measuring section, 9... Optical fiber,
9a...Optical connector, 10...Seal block,
11...Packkin, 12...Front plate, 10a, 1
2a...Screw, 13...Insulating sheet.

Claims (1)

[Scope of Claims] 1. A test board with a device under test on one side, a measurement section on the other side, and a seal block in the middle, and an opening in a partition wall that partitions a test chamber of a thermostatic chamber and a measurement chamber. A test device comprising: a sealing member provided around a test chamber side; the measuring section side of the test board is inserted into the measuring chamber through an opening in a partition wall, and a sealing block is brought into pressure contact with the sealing member. 2. The test apparatus according to claim 1, wherein a laser diode is used as the element to be tested, and its output is guided to the measurement chamber side through an optical fiber held between seal blocks.