JPH0334910Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to the structure of a hybrid IC package, and more particularly to a multipurpose package for a hybrid IC having a relatively large diameter through hole in the center of the package.

[Prior art]

In recent years, the size of electronic devices has been significantly reduced due to the heavy use of semiconductor devices, and in inverse proportion to the miniaturization of electronic devices, there is a tendency for semiconductor devices, especially hybrid ICs, to become larger in scale. Therefore, it is becoming difficult to mount a large number of hybrid ICs on printed wiring boards and accommodate them in the limited space of electronic devices.

[Purpose of invention]

The purpose of the present invention is to provide a package for hybrid ICs that can accommodate a large number of relatively large hybrid ICs in a limited space such as an electronic device, and also facilitates the input/output wiring, cooling, etc. of these hybrid ICs. It's about doing.

[Structure of the idea]

The hybrid IC package devised by this invention is
An insulating substrate having a hole bored approximately in the center of a surface on which a semiconductor element, etc. is mounted, and a hole whose center coincides with the hole of the substrate and has approximately the same diameter as the hole when mounted on the substrate. and a cylindrical body that connects a hole in the substrate and a hole in the cover, and the portions of the substrate, the cover, and the cylindrical body that contact each other are hermetically sealed.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a hybrid IC package according to the present invention, and FIG. 2 is a side sectional view of the portion indicated by a - line in FIG. 1. In both figures,
Reference numeral 1 denotes an insulating substrate such as a rigid ceramic or a metal plate whose surface is coated with an insulating coating, and a hole 2 of a relatively large diameter is bored in the center of the substrate 1. The size of the hole 2 is appropriately determined depending on the use described later, and the shape may be circular or polygonal, but a circular shape is preferable from the viewpoint of manufacturing. On the substrate 1, a film wiring board 3 on which a desired wiring pattern is formed using a thick film or a thin film is adhered, etc., and various required semiconductor elements 4 are mounted on this film wiring board 3. This is not the gist of the idea. Reference numeral 5 denotes a cover having a hole 6 in the center having approximately the same diameter or shape as the hole 2 of the substrate 1, and an end surface 7 of the cover 5 is soldered onto the substrate 1. 8 is a cylindrical body connecting the hole 2 of the substrate 1 and the hole 6 of the cover 5,
It has the same inner diameter as the hole 2 of the substrate 1, and one end 9 has the same inner diameter as the hole 2 of the substrate 1.
The other end 10 is engaged with the hole 6 of the cover 5 and hermetically sealed by soldering or the like. Note that various structures other than those shown in the drawings can be considered as a structure for connecting the substrate 1 and the cover 5 using the cylindrical body 8, but the point is that the hole 2 of the substrate 1 and the hole 6 of the cover 5 can be connected. , any structure may be used as long as the connecting portion can be hermetically sealed.

FIG. 3 is a side sectional view of a plurality (20 to 20 _° ) of the hybrid IC packages 20 constructed as described above installed in a narrow space.
Since the package 20 according to the present invention uses a rigid substrate 1, there is no need to temporarily mount it on a printed wiring board. Since it can be directly attached to the wall 30, a large number can be stored in a limited space. When stacked like this, heat dissipation becomes a problem, especially for packages that generate a lot of heat, such as high-power hybrid ICs, but the package 20 of the present invention has a through hole 10 in the center. Forced air cooling can be performed using this through hole 10, or liquid cooling can be performed by inserting a pipe (not shown) into the through hole 10.

FIG. 4 is a side cross-sectional view of the hybrid IC mounted as shown in FIG. 3 with input/output wiring. As is clear from the figure, each hybrid
The wiring 31 taken out from the IC packages _20-20o can be drawn out through the through-holes 10 of the respective packages _20-20o , which is particularly effective in the case of electronic devices where space is limited. Note that the input/output signals of the individual hybrid IC packages 20 to 20 _o can be input/output by, for example, implanting post-shaped lead terminals 32 on the board 1 and connecting the wiring 31 to the terminals 32. can.

[Effect of idea]

The structure of the hybrid IC package proposed in this invention uses a rigid substrate and has a relatively large-diameter through hole in the center of the package, so a large number of packages can be stacked and stored in a limited space. In addition, the through holes can be used for input/output wiring of the hybrid IC, forced air cooling, liquid cooling, etc., and can be used for a variety of purposes.

[Brief explanation of the drawing]

Figure 1 is a plan view showing the structure of the hybrid IC package of the present invention, and Figure 2 is the same as Figure 1.
Vertical cross-sectional view of the area indicated by the line, Figures 3 and 4
The figures are partially cutaway side views showing examples of the use of the hybrid IC package according to the present invention, with the former showing the case where it is used for cooling and the latter showing the case where it is used for input/output signal wiring. 1... Board, 2, 6... Hole, 5... Cover, 8
...Cylindrical body, 20~20 _o ...Hybrid IC package.

Claims (1)

[Scope of utility model registration request] An insulating substrate having a hole bored approximately in the center of a surface on which a semiconductor element, etc. is mounted, and a hole whose center coincides with the hole of the substrate and has approximately the same diameter as the hole when mounted on the substrate. and a cylindrical body that connects a hole in the substrate with a hole in the cover, wherein the parts of the substrate, the cover, and the cylindrical body that contact each other are hermetically sealed.
IC package.