JPH0336119U - - Google Patents

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Publication number
JPH0336119U
JPH0336119U JP9698989U JP9698989U JPH0336119U JP H0336119 U JPH0336119 U JP H0336119U JP 9698989 U JP9698989 U JP 9698989U JP 9698989 U JP9698989 U JP 9698989U JP H0336119 U JPH0336119 U JP H0336119U
Authority
JP
Japan
Prior art keywords
electronic component
exterior resin
type electronic
chip
element body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9698989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9698989U priority Critical patent/JPH0336119U/ja
Publication of JPH0336119U publication Critical patent/JPH0336119U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係るチツプ型電子部品の縦断
面図、第2図は従来のチツプ型電子部品の斜視図
、第3図は、従来のチツプ型電子部品を自動実装
する際の状態を示す一部断面正面図である。 1……素子本体、2……外装樹脂、3……外部
電極、8……紫外線硬化樹脂、9……実装面。
Fig. 1 is a vertical cross-sectional view of a chip-type electronic component according to the present invention, Fig. 2 is a perspective view of a conventional chip-type electronic component, and Fig. 3 shows a state in which a conventional chip-type electronic component is automatically mounted. It is a partially sectional front view shown. DESCRIPTION OF SYMBOLS 1...Element body, 2...Exterior resin, 3...External electrode, 8...Ultraviolet curing resin, 9...Mounting surface.

Claims (1)

【実用新案登録請求の範囲】 素子本体の側面に外装樹脂を被覆し、素子本体
の両側端面に外装樹脂よりも分厚く外部電極を形
成したチツプ型電子部品において、 紫外線硬化樹脂により、実装面とは反対側の面
の上記外装樹脂と両外部電極とを、平坦に被覆し
たことを特徴とするチツプ型電子部品。
[Scope of Claim for Utility Model Registration] In a chip-type electronic component in which the sides of the element body are coated with an exterior resin and external electrodes are formed on both end faces of the element body to be thicker than the exterior resin, the mounting surface is covered with an ultraviolet curing resin. A chip-type electronic component characterized in that the exterior resin and both external electrodes on the opposite side are flatly coated.
JP9698989U 1989-08-19 1989-08-19 Pending JPH0336119U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9698989U JPH0336119U (en) 1989-08-19 1989-08-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9698989U JPH0336119U (en) 1989-08-19 1989-08-19

Publications (1)

Publication Number Publication Date
JPH0336119U true JPH0336119U (en) 1991-04-09

Family

ID=31646153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9698989U Pending JPH0336119U (en) 1989-08-19 1989-08-19

Country Status (1)

Country Link
JP (1) JPH0336119U (en)

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