JPH0337263Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wire routing guide used when fixing discrete wires for repair or modification on the component mounting surface of a printed board unit.

[Problems that conventional techniques and ideas attempt to solve]

Conventionally, printed circuit board units have components mounted on one side and soldered from the other side, so wiring of discrete wires for circuit repair or circuit modification is done on the side where no components are mounted. It was wired with For this reason, wiring could be carried out freely, but as mounting density has increased in recent years, double-sided component mounting has become more common, so it became necessary to route discrete wires on the component mounting surface. Problems such as these have arisen. The first is that the discrete wires can catch on the corners or lead edges of the component and damage the wire sheathing. Second, the wired discrete wires float above the component and come into contact with other printed board units.
Third, when performing a circuit check on a printed board unit, the probe pin with the discrete wire riding on the component lead cannot come into contact with the lead.

[Means for solving problems]

The present invention provides a wire routing guide that solves the above-mentioned problems.The present invention provides a wire routing guide in which a frame body that covers and fits around the outer periphery of a component mounted on a printed board unit is formed of an insulating material. The outer surface of the side wall of the body is provided with a pitch-shaped wire gear part and a groove for guiding the probe pin, which are equal to the pitch of the leads of the component, and a part of the side wall where the wire gear part and the probe pin guide groove are not provided. A collar for guiding wires is provided on the upper part, and the collar has a length that forms a gap through which the wire can be passed between the frames when the frames are respectively fitted to adjacent parts. This is accomplished by a wire routing guide having a wire routing guide.

[Effect]

The above-mentioned wire routing guide can be fitted and fixed to the parts mounted on the printed board unit, and can guide and protect the wire with its collar and gears. guide and ensure reliable contact with the lead.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a perspective view of an embodiment of the present invention.

In this embodiment, as shown in FIG. 1, a frame 1 that can be fitted into parts mounted on a printed board unit is formed of an insulating material, and the outer surfaces of two opposing walls are provided with elastic horn-shaped parts. A wire gears portion 2 and a groove 3 for guiding the probe pin are provided, and a collar 4 for guiding the wire is provided on the upper outer surface of the other opposing wall. In this embodiment, the wire gears section 2 and the probe pin guide groove 3 are provided on two sides of the frame, but this is applied when the leads of the component are on two sides, and the component is placed on four sides. If the frame has leads on its surfaces, wire gears and probe pin guide grooves must also be provided on the four sides of the frame. Also, the flange 4 for wire guidance is the flange 4 of the adjacent routing guide as shown in Figure 2.
A gap A is formed between the two to allow the wire to pass through. Further, as shown in the figure, if the end of the collar 4 is formed obliquely, it is possible to prevent the wire from coming off the collar.

The routing guide constructed in this way is used as shown in FIG. FIG. 3a is a diagram showing the state of wire restraint and protection. In the figure, a frame 1 is fitted and fixed to a component 5, and a wire 6 in the Y-axis direction is restrained by a collar 4 for guiding the wire.
The gear 2 restrains the wire 7 in the X-axis direction.
This restrains the wires 6 and 7 in the vertical and horizontal directions. Furthermore, arranging routing guides will further enhance the effect. Also, by changing the bending direction of the gears or combining them, various wire restraints are possible.

FIG. 3b is a diagram showing a state in which the probe pin 8 is guided. In the figure, the probe pin 8 is guided by a groove 3 for guiding the probe pin provided in the frame 1 and can surely contact the lead 9 of the component.

FIG. 3c is a diagram showing the state during wire bonding. In the figure, when bonding wires to leads 9 for repairing or modifying a printed circuit board unit, a chip 10 for wire bonding is used to move gears 2, which restrains and protects wires, in an appropriate direction (from the dotted line). (to the solid line) to secure the lead bonding area. Further, when the bonding is completed and the chip 10 is removed from the top surface of the leads 9, the gears 2 returns to its original position due to its elasticity and can restrain and protect the wire.

[Effect of idea]

As explained above, according to the present invention, the wire can be guided and protected by the wire gears and the collar, and the probe pin can be guided by the groove for guiding the probe pin to ensure reliable contact with the lead. can be set.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the wire routing guide of the present invention, Fig. 2 is a perspective view showing another embodiment, and Fig. 3 is a diagram showing the usage state of the embodiment of the present invention. . In the figure, 1 is a frame body, 2 is a wire gears section, 3 is a groove for guiding a probe pin, and 4 is a collar for guiding a wire.

Claims (1)

[Scope of utility model registration request] A frame body that covers and fits around the outer periphery of the component mounted on the printed board unit is formed of an insulating material, and the outer side wall of the frame body is provided with a horn-shaped wire gear part and a probe with a pitch equal to the pitch of the leads of the component. A groove for guiding the pin is provided, and a collar for guiding the wire is provided on the upper part of the side wall where there is no wire gears or probe pin guide groove, and the collar is provided with a frame body fitted into each adjacent component. A wire routing guide characterized in that the wire routing guide has a length that forms a gap through which a wire can be passed between the frame bodies when assembled together.