JPH04164355A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPH04164355A
JPH04164355A JP2291578A JP29157890A JPH04164355A JP H04164355 A JPH04164355 A JP H04164355A JP 2291578 A JP2291578 A JP 2291578A JP 29157890 A JP29157890 A JP 29157890A JP H04164355 A JPH04164355 A JP H04164355A
Authority
JP
Japan
Prior art keywords
leads
lead
resin
chip mounting
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2291578A
Other languages
Japanese (ja)
Other versions
JP2546056B2 (en
Inventor
Sadayuki Moroi
定幸 諸井
Kaoru Sonobe
薫 園部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2291578A priority Critical patent/JP2546056B2/en
Publication of JPH04164355A publication Critical patent/JPH04164355A/en
Application granted granted Critical
Publication of JP2546056B2 publication Critical patent/JP2546056B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関し、特に外部リード
を全体加熱方式により回路基板にはんだ付けする構造の
樹脂封止型半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device, and more particularly to a resin-sealed semiconductor device having a structure in which external leads are soldered to a circuit board by an overall heating method.

〔従来の技術〕[Conventional technology]

従来の樹脂封止型半導体装置は、半導体チップを搭載す
るチップ搭載部、内部リード、外部リード、吊りリード
等の基本構成要素からなる単位個片が連なって並ぶリー
ドフレームを用い、半導体チップの搭載、ワイヤボンデ
ィング、樹脂封止までの一連の工程後、リードフレーム
から切断分離し、リード成形を行い最終製品形態となっ
ていた。Conventional resin-sealed semiconductor devices use a lead frame in which unit pieces consisting of basic components such as a chip mounting part, internal leads, external leads, and hanging leads are lined up in series to mount the semiconductor chip. After a series of steps, including wire bonding, resin sealing, and then cutting and separating from the lead frame, lead molding was performed to form the final product.

このため第３図に示すように、この種の樹脂封止型半導
体装置は、封止樹脂部２が何も覆われていないむき出し
の状態で回路基板へ赤外線リフロー法等の全体加熱方式
によってはんだ付けされていた。For this reason, as shown in FIG. 3, in this type of resin-encapsulated semiconductor device, the encapsulation resin part 2 is exposed and soldered to the circuit board using an overall heating method such as an infrared reflow method. It was attached.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の樹脂封止型半導体装置では、回路基板にはんだ付
けする際、赤外線リフロー法等の全体加熱方式が採られ
、封止樹脂部２はむき出しになっているため、その熱応
力により封止樹脂部２にクラックが生じ、信頼性が著し
く低下するという欠点があった。また、クラックは封止
樹脂部２中の水分が気化膨張することが原因の１つであ
るため、はんだ付は前にこの封止樹脂型半導体装置をベ
ーク処理することにより封止樹脂部２中の水分を抜く処
理が必要であり、このような封止樹脂部２中の水分を管
理、処理しなければならないという問題点があった。In conventional resin-encapsulated semiconductor devices, when soldering to a circuit board, a whole heating method such as an infrared reflow method is used, and since the encapsulation resin part 2 is exposed, the encapsulation resin is damaged due to thermal stress. There was a drawback that cracks were generated in the portion 2, resulting in a significant decrease in reliability. In addition, since one of the causes of cracks is the vaporization and expansion of moisture in the sealing resin part 2, it is necessary to bake the sealing resin type semiconductor device before soldering. There is a problem in that the moisture in the sealing resin part 2 must be managed and treated.

本発明の目的は、封止樹脂部のベーク処理を軽減すると
共に封止樹脂部のクラックの発生を防止、低減すること
ができる樹脂封止型半導体装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a resin-sealed semiconductor device that can reduce the baking process of the sealing resin part and prevent and reduce the occurrence of cracks in the sealing resin part.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の樹脂封止型半導体装置は、リードフレーム用部
材により形成された、チップ搭載部とこのチップ搭載部
を保持するための複数の吊りリードと前記チップ搭載部
の周辺に設けられた複数の内部リードとこれら各内部リ
ードとそれぞれ接続する複数の外部リードと前記各吊り
リード及び各外部リードを連結する連結バーと１つの辺
の少なくとも１点を前記吊りリードに接続する所定の面
積の熱遮断板と前記外部リード、吊りリード及び熱遮断
板を保持する枠部とを備えたリードフレームの前記チッ
プ搭載部に半導体チップを搭載固定し、前記半導体チッ
プの電極と前詰内部リードとを接続し、前記チップ搭載
部、半導体チップ、内部リード及び吊りリードを封止す
る封止樹脂部を形成し、前記連結バー及び枠部を前記外
部リード及び熱遮断板から切離し、前記熱遮断板の吊り
リードとの接続部を折曲げて前記封止樹脂部の表面上を
覆うように成形して構成される。The resin-sealed semiconductor device of the present invention includes a chip mounting section formed of a lead frame member, a plurality of hanging leads for holding the chip mounting section, and a plurality of hanging leads provided around the chip mounting section. an internal lead, a plurality of external leads that connect to each of these internal leads, a connecting bar that connects each of the suspension leads and each external lead, and a heat shield of a predetermined area that connects at least one point on one side to the suspension lead. A semiconductor chip is mounted and fixed on the chip mounting portion of a lead frame that includes a plate and a frame portion that holds the external leads, suspension leads, and a heat shielding plate, and the electrodes of the semiconductor chip and the front-packed internal leads are connected. , forming a sealing resin part for sealing the chip mounting part, the semiconductor chip, the internal leads, and the suspension leads; separating the connection bar and the frame from the external leads and the heat shield plate; and separating the suspension leads of the heat shield plate. The connecting portion is bent and molded to cover the surface of the sealing resin portion.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.

第１図（ａ）〜（ｃ）はそれぞれ本発明の第１の実施例
を製造工程順に示したリードフレームの平面図、完成品
直前の平面図及び完成品の斜視図である。FIGS. 1A to 1C are a plan view of a lead frame, a plan view immediately before the finished product, and a perspective view of the finished product, respectively, showing the first embodiment of the present invention in the order of manufacturing steps.

リードフレーム１は、リードフレーム用部材により形成
−された、チップ搭載部１１と、このチップ搭載部１１
を保持するための４本の吊りリード１４と、チップ搭載
部１１の周辺に設けられた複数の内部リード１２と、こ
れら各内部リード１２とそれぞれ接続する複数の外部リ
ード１３と、各吊りリード１４及び外部リード１３を連
結する連結バー１５と、１つの辺の２点を吊りリード１
４と接続する所定の面積の熱遮断板１７と、外部リード
１３．吊りリード１４及び熱遮断板１７を保持する枠部
１６とを備えた構造となっている。The lead frame 1 includes a chip mounting portion 11 formed of a lead frame member, and the chip mounting portion 11.
four suspension leads 14 for holding the chip, a plurality of internal leads 12 provided around the chip mounting section 11, a plurality of external leads 13 connected to each of these internal leads 12, and each suspension lead 14. and a connecting bar 15 that connects the external leads 13, and a hanging lead 1 at two points on one side.
a heat shielding plate 17 having a predetermined area connected to the external lead 13. It has a structure including a hanging lead 14 and a frame portion 16 that holds a heat shielding plate 17.

このリードフレーム１のチップ搭載部１１に半導体チッ
プを搭載固定し、この半導体チップの電極と内部リード
１２とをボンディング線で接続した後、チップ搭載部１
１．半導体チップ、内部リード１２及び吊りリード１４
を封止する封止樹脂部２を形成し、連結バー１５及び枠
部１６を外部リード１３及び熱遮断板１７がら切離す。After mounting and fixing a semiconductor chip on the chip mounting part 11 of this lead frame 1 and connecting the electrodes of this semiconductor chip and the internal leads 12 with bonding wires, the chip mounting part 1
1. Semiconductor chip, internal leads 12 and hanging leads 14
A sealing resin portion 2 for sealing is formed, and the connecting bar 15 and frame portion 16 are separated from the external lead 13 and heat shield plate 17.

そして熱遮断板１７の吊りリード１４との接続部を折曲
げて封止樹脂部２の一面上を覆うように成形してこの実
施例の樹脂封止型半導体装置が完成する。Then, the connection portion of the heat shield plate 17 with the hanging lead 14 is bent and molded to cover one surface of the sealing resin portion 2, thereby completing the resin-sealed semiconductor device of this embodiment.

この実施例の樹脂封止型半導体装置をｒｇＪ路基板基板
んだ付けする際には、熱遮断板１７により封止樹脂部２
に伝達される熱量が低減するので、封止樹脂部２のクラ
ックの発生を防止、低減することができる。When the resin-sealed semiconductor device of this embodiment is soldered to an RGJ circuit board, the heat shield plate 17
Since the amount of heat transferred to is reduced, the occurrence of cracks in the sealing resin portion 2 can be prevented and reduced.

第２図（ａ）、（ｂ）はそれぞれ本発明の第２の実施例
のリードフレームの平面図及び完成品の斜視図である。FIGS. 2(a) and 2(b) are a plan view and a perspective view of a completed product, respectively, of a lead frame according to a second embodiment of the present invention.

この実施例のリードフレームは、リードフレーム用部材
の幅方向の両側の、従来は枠部となっていた部分に熱遮
断板１７Ａ、１７Ｂを形成したものである。The lead frame of this embodiment has heat shielding plates 17A and 17B formed on both sides of the lead frame member in the width direction, in portions that were conventionally used as frame portions.

そして封止樹脂部２を形成後、熱遮断板１７Ａ。After forming the sealing resin part 2, the heat shielding plate 17A is formed.

１７Ｂを両方から折曲げ、封止樹脂部２上を覆うように
する。17B is bent from both sides so as to cover the sealing resin part 2.

この実施例では、リードフレームＩＡの枠部１６＾を利
用することで１枚のリードフレームから形成される樹脂
封止型半導体装置の数を減らすことなく本発明の目的を
達することができる。またリードフレームの全長、幅、
及び位置決め穴等の寸法を従来のリードフレームと同一
に設計ができる場合、樹脂封止工程までは諸設備を従来
のものと何ら変更する必要がないという利点もある。In this embodiment, by utilizing the frame portion 16^ of the lead frame IA, the object of the present invention can be achieved without reducing the number of resin-sealed semiconductor devices formed from one lead frame. Also, the total length, width,
If dimensions such as positioning holes and the like can be designed to be the same as those of conventional lead frames, there is also the advantage that there is no need to make any changes to various equipment from conventional ones up to the resin sealing process.

なお、これら実施例において、この樹脂封止型半導体装
置を回路基板へはんだ付けした後には、熱遮断板１７．
１７Ａ　、１７Ｂはそのままでもよいしく電気的な遮へ
い効果もある）、または切断除去してもよい。In these embodiments, after the resin-sealed semiconductor device is soldered to the circuit board, the heat shield plate 17.
17A and 17B may be left as they are (they also have an electrical shielding effect), or they may be cut and removed.

また熱遮断板１７．１７Ａ、１７Ｂの位置及び高さを確
実に固定したい場合には、封止樹脂部２及び熱遮断板１
７．１７Ａ、１７Ｂの表面に凹凸部などを設け、固定で
きるようにするとよい。これら実施例では、熱遮断板１
７．１７Ａ、１７Ｂの形状及び高さを自由に設計するこ
とができるので、最も効果の高い形状、高さに設定する
ことができる。通常、熱遮断板１７．１７Ａ　、１７ａ
の形状は封止樹脂部２の上面と同じ形状で、高さは封止
樹脂２の表面より１〜５ｍｍ程度の位置が適当である。In addition, when it is desired to securely fix the positions and heights of the heat shield plates 17.17A and 17B, the sealing resin part 2 and the heat shield plate 1
7. It is preferable to provide irregularities on the surfaces of 17A and 17B so that they can be fixed. In these embodiments, the heat shield plate 1
7. Since the shapes and heights of 17A and 17B can be freely designed, they can be set to the most effective shape and height. Normally, heat shield plate 17.17A, 17a
The shape is the same as the top surface of the sealing resin part 2, and the height is suitably about 1 to 5 mm from the surface of the sealing resin 2.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、封止樹脂部上にリードフ
レームの一部を利用して形成された熱遮断板を設けた構
造とすることにより、回路基板へのはんだ付は時の熱応
力による封止樹脂部のクラック発生を防止あるいは軽減
することができ、また、はんだ付は前に行うベーク処理
を省略または半分程度に時間短縮することができるとい
う効果がある。As explained above, the present invention has a structure in which a heat shield plate formed using a part of a lead frame is provided on a sealing resin part, so that soldering to a circuit board can be prevented from occurring due to thermal stress. It is possible to prevent or reduce the occurrence of cracks in the sealing resin part due to soldering, and the baking process performed before soldering can be omitted or the time can be reduced to about half.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）〜（ｃ）はそれぞれ本発明の第１の実施例
のリードフレーム゛の平面図、完成品直前の平面図及び
完成品の斜視図、第２図（ａ）。 （ｂ）はそれぞれ本発明の第２の実施例のリードフレー
ムの平面図及び完成品の斜視図、第３図は従来の樹脂封
止型半導体装置の斜視図である。 １．１＾・・・リードフレーム、２・・・封止樹脂部、
１１・・・チップ搭載部、１２・・・内部リード、１３
・・・外部リード、１４・・・吊りリード、１５・・・
連結バー、１６，１６Ａ・・・枠部、１７，１７Ａ　、
１７Ｂ・・・熱遮断板。1(a) to 1(c) are a plan view of a lead frame according to a first embodiment of the present invention, a plan view immediately before the completed product, a perspective view of the completed product, and FIG. 2(a). (b) is a plan view and a perspective view of a completed product, respectively, of a lead frame according to a second embodiment of the present invention, and FIG. 3 is a perspective view of a conventional resin-sealed semiconductor device. 1.1^... Lead frame, 2... Sealing resin part,
11... Chip mounting part, 12... Internal lead, 13
...External lead, 14...Hanging lead, 15...
Connection bar, 16, 16A... frame, 17, 17A,
17B... Heat shield plate.

Claims (1)

【特許請求の範囲】[Claims] 　リードフレーム用部材により形成された、チップ搭載
部とこのチップ搭載部を保持するための複数の吊りリー
ドと前記チップ搭載部の周辺に設けられた複数の内部リ
ードとこれら各内部リードとそれぞれ接続する複数の外
部リードと前記各吊りリード及び各外部リードを連結す
る連結バーと１つの辺の少なくとも１点を前記吊りリー
ドに接続する所定の面積の熱遮断板と前記外部リード，
吊りリード及び熱遮断板を保持する枠部とを備えたリー
ドフレームの前記チップ搭載部に半導体チップを搭載固
定し、前記半導体チップの電極と前記内部リードとを接
続し、前記チップ搭載部，半導体チップ，内部リード及
び吊りリードを封止する封止樹脂部を形成し、前記連結
バー及び枠部を前記外部リード及び熱遮断板から切離し
、前記熱遮断板の吊りリードとの接続部を折曲げて前記
封止樹脂部の表面上を覆うように成形して構成されたこ
とを特徴とする樹脂封止型半導体装置。A chip mounting section formed of a lead frame member, a plurality of hanging leads for holding the chip mounting section, and a plurality of internal leads provided around the chip mounting section are connected to each of these internal leads, respectively. a plurality of external leads, a connecting bar that connects each of the hanging leads and each external lead, a heat shielding plate having a predetermined area that connects at least one point on one side to the hanging lead, and the external lead;
A semiconductor chip is mounted and fixed on the chip mounting section of a lead frame that includes hanging leads and a frame section that holds a heat shield plate, and the electrodes of the semiconductor chip and the internal leads are connected, and the chip mounting section and the semiconductor chip are connected to each other. Forming a sealing resin part for sealing the chip, internal leads, and suspension leads, separating the connection bar and frame from the external leads and heat shielding plate, and bending the connection part of the heat shielding plate to the suspension lead. A resin-sealed semiconductor device, characterized in that the resin-sealed semiconductor device is formed by molding the resin to cover the surface of the sealing resin portion.
JP2291578A 1990-10-29 1990-10-29 Resin-sealed semiconductor device Expired - Fee Related JP2546056B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2291578A JP2546056B2 (en) 1990-10-29 1990-10-29 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2291578A JP2546056B2 (en) 1990-10-29 1990-10-29 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPH04164355A true JPH04164355A (en) 1992-06-10
JP2546056B2 JP2546056B2 (en) 1996-10-23

Family

ID=17770741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2291578A Expired - Fee Related JP2546056B2 (en) 1990-10-29 1990-10-29 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JP2546056B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365106A (en) * 1992-10-27 1994-11-15 Kabushiki Kaisha Toshiba Resin mold semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5365106A (en) * 1992-10-27 1994-11-15 Kabushiki Kaisha Toshiba Resin mold semiconductor device

Also Published As

Publication number Publication date
JP2546056B2 (en) 1996-10-23

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